I/O Controller Interface IC Smart Card Bridge to Full Speed USB
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Microchip(微芯科技) |
零件包装代码 | QFN |
包装说明 | QFN-24 |
针数 | 24 |
Reach Compliance Code | compliant |
ECCN代码 | 3A001.A.3 |
Factory Lead Time | 5 weeks |
总线兼容性 | SPI; UART |
最大数据传输速率 | 1.2 MBps |
JESD-30 代码 | S-PQCC-N24 |
JESD-609代码 | e3 |
长度 | 5 mm |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HQCCN |
封装等效代码 | LCC24,.2SQ,25 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大压摆率 | 7.5 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 3.6 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | NO LEAD |
端子节距 | 0.65 mm |
端子位置 | QUAD |
宽度 | 5 mm |
uPs/uCs/外围集成电路类型 | BUS CONTROLLER, UNIVERSAL SERIAL BUS |
SEC1110和SEC1210芯片具有复杂的功耗管理功能,旨在在不同的工作模式下优化能耗。以下是这些芯片功耗管理功能的工作原理以及它们在低功耗模式下的性能概述:
电源模式:
电源管理单元:
低功耗模式:
性能:
功耗:
总的来说,SEC1110和SEC1210芯片的功耗管理功能通过提供多种电源模式和唤醒事件,使得它们能够在保证性能的同时,根据应用需求优化能耗。在设计低功耗应用时,开发者可以根据这些功能来制定合适的电源管理策略。
SEC1210I-CN-02 | SEC1110I-A5-02-TR | SEC1210-CN-02NC | SEC1110-A5-02 | SEC1210-CN-02NC-TR | SEC1210-CN-02 | SEC1210-CN-02-TR | SEC1110-A5-02NC | |
---|---|---|---|---|---|---|---|---|
描述 | I/O Controller Interface IC Smart Card Bridge to Full Speed USB | I/O Controller Interface IC Smart Card Bridge to Full Speed USB | I/O Controller Interface IC Smart Card Bridge to Full Speed USB | I/O Controller Interface IC Smart Card Bridge to Full Speed USB | I/O Controller Interface IC | I/O Controller Interface IC Smart Card Bridge to Full Speed USB | I/O Controller Interface IC Smart Card Bridge to Full Speed USB | I/O Controller Interface IC |
是否Rohs认证 | 符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | - |
零件包装代码 | QFN | QFN | - | QFN | QFN | QFN | QFN | QFN |
包装说明 | QFN-24 | QFN-16 | - | HQCCN, LCC16,.2SQ,32 | QFN-24 | QFN-24 | QFN-24 | QFN-16 |
针数 | 24 | 16 | - | 16 | 24 | 24 | 24 | 16 |
Reach Compliance Code | compliant | compliant | - | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | 3A001.A.3 | 3A001.A.3 | - | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
Factory Lead Time | 5 weeks | 5 weeks | - | 5 weeks | 5 weeks | 5 weeks | 5 weeks | 5 weeks |
最大数据传输速率 | 1.2 MBps | 1.2 MBps | - | 1.2 MBps | 1.2 MBps | 1.2 MBps | 1.2 MBps | 1.2 MBps |
JESD-30 代码 | S-PQCC-N24 | S-PQCC-N16 | - | S-PQCC-N16 | S-PQCC-N24 | S-PQCC-N24 | S-PQCC-N24 | S-PQCC-N16 |
JESD-609代码 | e3 | e3 | - | e3 | e3 | e3 | e3 | e3 |
长度 | 5 mm | 5 mm | - | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm |
端子数量 | 24 | 16 | - | 16 | 24 | 24 | 24 | 16 |
最高工作温度 | 85 °C | 85 °C | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | - | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
封装代码 | HQCCN | HQCCN | - | HQCCN | HQCCN | HQCCN | HQCCN | HQCCN |
封装等效代码 | LCC24,.2SQ,25 | LCC16,.2SQ,32 | - | LCC16,.2SQ,32 | LCC24,.2SQ,25 | LCC24,.2SQ,25 | LCC24,.2SQ,25 | LCC16,.2SQ,32 |
封装形状 | SQUARE | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG | CHIP CARRIER, HEAT SINK/SLUG | - | CHIP CARRIER, HEAT SINK/SLUG | CHIP CARRIER, HEAT SINK/SLUG | CHIP CARRIER, HEAT SINK/SLUG | CHIP CARRIER, HEAT SINK/SLUG | CHIP CARRIER, HEAT SINK/SLUG |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 1 mm | - | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
最大压摆率 | 7.5 mA | 7.5 mA | - | 7.5 mA | 7.5 mA | 7.5 mA | 7.5 mA | 7.5 mA |
最大供电电压 | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
标称供电电压 | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | - | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | - | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
端子形式 | NO LEAD | NO LEAD | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.65 mm | 0.8 mm | - | 0.8 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.8 mm |
端子位置 | QUAD | QUAD | - | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 5 mm | 5 mm | - | 5 mm | 5 mm | 5 mm | 5 mm | 5 mm |
uPs/uCs/外围集成电路类型 | BUS CONTROLLER, UNIVERSAL SERIAL BUS | BUS CONTROLLER, UNIVERSAL SERIAL BUS | - | BUS CONTROLLER, UNIVERSAL SERIAL BUS | BUS CONTROLLER, UNIVERSAL SERIAL BUS | BUS CONTROLLER, UNIVERSAL SERIAL BUS | BUS CONTROLLER, UNIVERSAL SERIAL BUS | BUS CONTROLLER, UNIVERSAL SERIAL BUS |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved