C Series
F E AT U R E S
TO-126, TO-247, TO-220
and TO-264 Package Heatsinks
Ohmite introduces the C series (Pat. Pending). This
series offers high performance, low cost and a
compact heat sink with an integrated camming clip
system for TO-126, TO-220, TO-247 and TO-264
devices. This powerful heat sink provides tool and
fixture free assembly operation, largest surface areas
and smallest space occupation. It is the ideal type of
heat sink for high power density and small size (1U
or 2U) electronic packaging with forced convection
cooling.
S E R i E S S P E C i F i C AT i O N S
• Minimum assembly cost and labor Spring Clips
make the mounting holes, fasteners, tools and
fixtures obsolete in assembly operations & reduce
costs.
• Maximum Thermal Transfer Maximum surface area
per unit volume, efficient cooling fins & consistent
mounting force reduces thermal resistance.
• Maximum Repeatability Constant spring force over
repeated assembly/disassembly.
• Maximum Reliability Resilient spring action locks
electronic component in place. Fewer parts in
assembly and no fasteners and washers required.
Prevent short circuit by eliminating metal particles
generated from hardware or thread tapping.
• Design Flexibility Maximum flexibility for dynamic
device locations and power upgrading. “Configure-
to-Fit” gives designers total freedom to configure
heat sink needed to fit into a multitude design envi-
ronments.
ChARACTERiSTiCS
Heatsink
Part Number
C247-025
C247-050
C247-075
C264-030
C264-058
C264-085
C220-025
C220-050
C220-075
C126-025
C126-040
C126-050
C126-075
Surface
Area
(in
2
/mm
2
)
11 / 7,312
23 / 14,858
34 / 21,655
13 / 8,774
25 / 16,963
37 / 24,861
11 / 7,312
23 / 14,858
34 / 21,655
10.2 / 6,559
16.3 / 10,495
20.4 / 13,119
30.6 / 21,655
Weight Length “L”
(oz/g)
(mm)
0.5 / 15
25
1.1 / 31
50
1.6 / 45
75
0.7 / 19
30
1.35 / 37
58
1.97 / 54
85
0.5 / 15
25
1.1 / 31
50
1.6 / 45
75
0.45 / 12.7
25
0.72 / 20.3
40
0.90 / 25.4
50
1.35 / 38.1
75
Solder Foot
Cold-rolled Steel, Per ASTM A-366
with pure tin over copper strike. RoHS
compliant.
Interface
for improvement, use thermal joint
Thermal
compound, 0.005 Grafoil (TGon 800
Resistance
by Laird), or phase change material
(Hi-Flow by Bergquist)
Insulator
(Optional) Sil-Pad 900-S, K6 800-S
and K10 by Bergquist
Spring Clip
Music Wire, Per ASTM A228 with
bright nickel plating
Heat Sink
Aluminum Alloy 6063-T5 or Equivalent
with either degreased or black anod-
ized finish.
h E AT D i S S i PAT i O N
Heat dissipation is the total for ALL DEVICES attached to heatsink.
200
140
Case Temp. Rise above Ambient (°C)
120
100
80
60
40
20
0
0
5
10
Heat Dissipated, total for ALL devices (watts)
400
Air Velocity (ft./min.)
600
800
12
Avg. Thermal Resistance from Mounting
Surface to Ambient (°C/watts)
C247-025-1AE (1 device)
C247-050-2AE (2 devices)
C247-075-3AE (3 devices)
1000
9
Thermal Resistance from Mounting
Case to Ambient (°C/watts)
8
7
6
5
4
3
2
1
0
15
200
38
Average Heat Sink Temp. Rise
above Ambient (°C)
36
34
32
30
28
26
24
22
2
3
4
5
6
7
8
Total Heat Dissipated (watts)
9
6
8
400
Air Velocity (ft./min.)
600
800
1000
TO-126/CE-S102 (25mm long)
one device w/Sil-pad 900s
10
4
10
(continued)
168
1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com
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