HIGH GRAPHICS PERFORMANCE WITH
LOW POWER CONSUMPTION
conga-XAF
-
Based on AMD Embedded G-Series Processors
-
Best price/performance ratio
-
High performance graphics
Formfactor
CPU
ETX
®
Spec 2.7. without ISA Support | XTX
™
Extensions
AMD G-T56N
AMD G-T52R
AMD G-T40R
AMD G-T40E
1.6 GHz
1.5 GHz
1.0 GHz
1.0 GHz
Dual Core
Single Core
Single Core
Dual Core
L1 cache 64KB
L1 cache 64KB
L1 cache 64KB
L1 cache 64KB
L2 cache 512kB x2
L2 cache 512kB
L2 cache 512kB
L2 cache 512kB x2
TDP 18 W
TDP 18 W
TDP 5.5 W
TDP 6.5 W
AMD Embedded G-Series Processors
DRAM
Chipset
Ethernet
I/O Interfaces
Sound
Graphics
LVDS
DisplayPort
HDMI or DVI
CRT
congatec Board Controller
Embedded BIOS Features
Security
Single channel up to one 4 GB DDR3 SO-DIMM memory (up to 1066 MHz)
AMD A55E Controller Hub
10/100M Fast Ethernet | Realtek RTL8105E
4x PCI ExpressTM x1 lanes | 4x Serial ATA
®
| 2x EIDE (up to UDMA-66/100) | 6x USB 2.0 | PCI Bus (Rev. 2.3 compliant / 33 MHz) | 2x Express Card
LPC Bus | I²C (Fast Mode / 400 kHz Multi Maser) | Floppy | LPT | 2x COM | PS/2
High Definition Audio Interface and Analog MIC | Line In | Line Out by on-module HDA codec
Integrated High Performance Video | DirectX
®
11 graphics with UVD 3.0 | Integrated VGA DAC | Dual Simultaneous Display Support | no PEG
support
2x24 Bit | 800x600 to 1920X1200@60Hz; VESA standard or JEDIA data mapping; Automatic Panel Detection via EDID/EPI
1x DisplayPort 1.1a shared with HDMI port | resolutions up to 2560x1600 - 18W APU | 1920x1200 - 9W APU
1x HDMI 1.3 Port | shared with DisplayPort | resolutions up to 1920x1080 / 1920x1200 for DVI mode
400 MHz RAMDAC | resolutions up to 2560x1600 - 18W APU | 1920x1200 9W APU
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data | Backup
I²C bus (fast mode / 400 kHz / multi-master) | Power Loss Controll
AMI-Aptio UEFI BIOS with congatec Embedded BIOS features
The conga-XAF can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and
RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and
e-commerce will benefit also with improved authentication | integrity and confidence levels.
ACPI 3.0 with battery support
Microsoft
®
Windows8 | Microsoft
®
Windows7 | Microsoft
®
Windows XP | Microsoft
®
Windows
®
embedded Standard | Microsoft
®
Windows CE 6.0
Windows Embedded Compact 7 | Linux
Typ. application: 9 .. 18 W. | see manual for full details | CMOS Battery Backup
Operating: 0 .. +60°C | Storage: -20 .. +80°C
Operating: 10 - 90% r. H. non cond. | Storage: 5 - 95% r. H. non cond.
95 x 114 mm (3.7” x 4.5”)
Power Management
Operating Systems
Power Consumption
Temperature
Humidity
Size
www.congatec.com
conga-XAF
| Order Information
Article
conga-XAF/T56N
conga-XAF/T40N
conga-XAF/T52R
conga-XAF/T44R
conga-XAF/T40R
conga-XAF/T40E
conga-XAF/HSP-B
conga-XAF/HSP-T
conga-XAF/CSP-B
conga-XAF/CSP-T
conga-XAF/CSA-B
conga-XAF/CSA-T
DDR3-SODIMM-1066 (1GB)
DDR3L-SODIMM-1600 (2GB)
DDR3L-SODIMM-1600 (4GB)
PN
041031
041033
041034
041035
041036
041037
041050
041051
041055
041056
041057
041058
068750
068755
068756
Description
AMD G-Series dual core processor T56N 1.6GHz | 1MB L2 cache and 1066MT/s DDR3 SODIMM memory interface for up to 4GB
AMD G-Series dual core processor T40N 1.0GHz | 1MB L2 cache and 1066MT/s DDR3 SODIMM memory interface for up to 4GB
AMD G-Series single core processor T52R 1.5GHz | 512kB L2 cache and 1066MT/s DDR3 SODIMM memory interface for up to
4GB
AMD G-Series single core processor T44R 1.2GHz | 512kB L2 cache and 1066MT/s DDR3 SODIMM memory interface for up to
4GB
AMD G-Series single core processor T40R 1.0GHz | 5.5W | 1MB L2 cache and 1066MT/s DDR3 SODIMM memory interface for
up to 4GB
AMD G-Series dual core processor T40E 1.0GHz | 6.5W | 1MB L2 cache and 1066MT/s DDR3 SODIMM memory interface for up
to 4GB
Standard heatspreader for XTX module conga-XAF and EAF. All standoffs are with 2.7mm bore hole
Standard heatspreader for XTX module conga-XAF and EAF. All standoffs are M2.5mm thread
Standard passive cooling solution for modules conga-XAF and EAF. All standoffs are with 2.7mm bore hole
Standard passive cooling solution for modules conga-XAF and EAF. All standoffs are M2.5mm thread
Standard active cooling solution for modules conga-XAF and EAF. Integrated 12V fan. All standoffs are with 2.7mm bore hole
Standard active cooling solution for modules conga-XAF and EAF. Integrated 12V fan. All standoffs are M2.5mm thread
DDR3 SODIMM memory module with 1066MT/s and 1GB RAM
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 2GB RAM
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM
Accessories
conga-Xeval
conga-XDVI
conga-Xdebug
conga-FPA2
XTX/ETX-baseboard-socket-3
XTX/ETX-baseboard-
socket-9.5
conga-LDVI/EPI
019482
098637
041784
047250
400006
400009
011115
Evaluation carrier board for XTX-modules
Evaluation platform to convert SDVO to DVI-D
XTX debugging platform. Including cable for COM | PS/2 and VGA
Flatpanel prototype adapter to develop your own flatpanel adapter Including cables set
Connector for ETX and XTX carrier boards | height 3.0 mm | packing unit 8 pieces
Connector for ETX and XTX carrier boards | height 9.5 mm | packing unit 8 pieces
LVDS to DVI adapter board for digital fl at panels with a graphics resolution up to 1280x1024 pixel
© 2016 congatec AG. All rights reserved.
All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee
of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their
respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. December 12, 2016 MR
www.congatec.com
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
