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conga-BM57/CSP-HP-T: 产品描述Heat Sinks PASSIVE COOLING SOL conga-BM57 2.5mm; 产品类别热管理产品; 文件大小942KB，共2页; 制造商congatec; 标准

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conga-BM57/CSP-HP-T概述

Heat Sinks PASSIVE COOLING SOL conga-BM57 2.5mm

conga-BM57/CSP-HP-T规格参数

参数名称	属性值
Product Attribute	Attribute Value
制造商 Manufacturer	congatec
产品种类 Product Category	Heat Sinks
RoHS	Details
工厂包装数量 Factory Pack Quantity	1

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MAXIMUM COMPUTING

PERFORMANCE

conga-BM57

up to Intel

Core™ i7 Processors 2.66 GHz

Highest end graphics performance

Intel® Turbo Boost Technology up to 3.33 GHz

Formfactor

CPU

COM Express™ Basic | (95 x 125 mm) | Type II Connector Layout

Intel® Core™ i7-620M

Intel® Core™ i5-520M

Intel® Celeron™ P4500

2.66 GHz

2.4 GHz

1.86 GHz

32 nm processor

4MB cache

3MB cache

2MB cache

1066 MHz

TDP 35 W

PGA package

Integrated dual channel memory controller | up to 17.1 GByte/sec. memory bandwidth

Integrated Intel® HD Graphics with dynamic frequency up to 667 MHz

Intel® Clear Video HD Technology

DRAM

Chipset

Ethernet

I/O Interfaces

Sound

Graphics

2 Sockets | SO-DIMM DDR3 1333 MHz | up to 8 GByte

Intel® 5 Series Chipset: Intel® HM55

Intel® 82577LM Ethernet PHY

5x PCI Express™ lanes | 3x Serial ATA® (AHCI) no RAID support | 1x EIDE (UDMA-66/100) optional | 2x ExpressCard® | 8x USB 2.0 (EHCI)

Digital High Definition Audio Interface with support for multiple audio codecs

Processor integrated Mobile Intel® 5 Series HD graphics OpenGL 2.1 and DirectX10 support | Two independent pipelines for full dual view support |

High performance hardware MPEG-2 decoding WMV9 (VC-1) and H.264 (AVC) support Blu-ray support @ 40 MBit/s | hardware motion compensation

| no PEG support

Dual channel LVDS transmitter | Supports flat panels 2x24 Bit interface | VESA mappings | resolutions up to 1920x1200 | Automatic Panel

3x DisplayPorts 1.1 shared with HDMI

3x ports shared with DisplayPorts

350 MHz RAMDAC | resolutions up to QXGA (2048x1536)

Supports one SDVO port shared with HDMI and DisplayPort capable of driving a 200MP pixel rate

Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup

AMI Aptio® UEFI 2.x firmware | 4 MByte serial SPI firmware flash

The conga-BM57 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and

ACPI 3.0 with battery support

Microsoft® Windows 8 | Microsoft® Windows 7 | Microsoft® Windows XP | Microsoft® Windows® embedded Standard | Linux

Typ. application: tbd. | see manual for full details | CMOS Battery Backup

Operating: 0 .. +60°C | Storage: -20 .. +80°C

Operating: 10 - 90% r. H. non cond. | Storage: 5 - 95% r. H. non cond.

95 x 125 mm (3.74” x 4.92”)

LVDS

(eDP optional)

DisplayPort

HDMI

CRT Interface

AUX Output

congatec Board Controller

Embedded BIOS Features

Security

Power Management

Operating Systems

Power Consumption

Temperature

Humidity

Size

www.congatec.com

conga-BM57/CSP-HP-T相似产品对比

	conga-BM57/CSP-HP-T	conga-BM57-CSA-HP-B	conga-BM57/HSP-HP-B	conga-BM57/HSP-HP-T	BM57/HSP -HP-B (Heatpipe Solution)	conga-BM57/CSA-HP-T	conga-BM57/CSP-HP-B
描述	Heat Sinks PASSIVE COOLING SOL conga-BM57 2.5mm	Heat Sinks ACTIVE COOLING SOL conga-BM57 2.7mm	Heat Sinks HEATSPREADER FOR conga-BM57 2.7mm	Heat Sinks HEATSPREADER FOR conga-BM57 2.5mm	Heat Sinks HEATSPREADER FOR conga-BM57 2.7mm	Heat Sinks ACTIVE COOLING SOL conga-BM57 2.5mm	Heat Sinks PASSIVE COOLING SOL conga-BM57 2.7mm
Product Attribute	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value
制造商 Manufacturer	congatec	congatec	congatec	congatec	congatec	congatec	congatec
产品种类 Product Category	Heat Sinks	Heat Sinks	Heat Sinks	Heat Sinks	Heat Sinks	Heat Sinks	Heat Sinks
RoHS	Details	Details	Details	Details	Details	Details	Details
工厂包装数量 Factory Pack Quantity	1	1	1	1	-	1	1
产品 Product	-	Heat Sink Accessories	Heat Sinks	Heat Sinks	Heat Sinks	-	-

conga-BM57/CSP-HP-T

conga-BM57/CSP-HP-T概述

conga-BM57/CSP-HP-T规格参数

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