Thermal Substrates - MCPCB 1-UP INDV STAR CREE XP-E
参数名称 | 属性值 |
Product Attribute | Attribute Value |
制造商 Manufacturer | Bergquist Company |
产品种类 Product Category | Thermal Substrates - MCPCB |
RoHS | Details |
Configuration | Star Board |
Designed for | Cree XP-E |
芯体材料 Core Material | Aluminum |
工厂包装数量 Factory Pack Quantity | 500 |
Thermal Conductivity | 1.3 W/m-K |
804090 | 804087 | |
---|---|---|
描述 | Thermal Substrates - MCPCB 1-UP INDV STAR CREE XP-E | Thermal Substrates - MCPCB 1-UP INDV STAR OSRAM OSLON |
Product Attribute | Attribute Value | Attribute Value |
制造商 Manufacturer |
Bergquist Company | Bergquist Company |
产品种类 Product Category |
Thermal Substrates - MCPCB | Thermal Substrates - MCPCB |
RoHS | Details | Details |
Configuration | Star Board | Star Board |
Designed for | Cree XP-E | Osram OSLON |
芯体材料 Core Material |
Aluminum | Aluminum |
工厂包装数量 Factory Pack Quantity |
500 | 500 |
Thermal Conductivity | 1.3 W/m-K | 1.3 W/m-K |
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