Analog to Digital Converters - ADC 8-Bit 4Ch 1Msps 5V Precision ADC
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | DIP |
| 包装说明 | PLASTIC, DIP-24 |
| 针数 | 24 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 5.25 V |
| 最小模拟输入电压 | -5.25 V |
| 最长转换时间 | 0.865 µs |
| 转换器类型 | ADC, FLASH METHOD |
| JESD-30 代码 | R-PDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 30.545 mm |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 4 |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | BINARY |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 240 |
| 认证状态 | Not Qualified |
| 采样速率 | 1 MHz |
| 采样并保持/跟踪并保持 | TRACK |
| 座面最大高度 | 4.572 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| MAX114ENG | MAX114CNG | MAX114CAG-T | MAX114ENG-T | MAX114CAG | MAX114EAG-T | MAX114EAG | MAX114CNG+ | MAX114CNG-T | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Analog to Digital Converters - ADC 8-Bit 4Ch 1Msps 5V Precision ADC | Analog to Digital Converters - ADC +5V, 1Msps, 4 and 8-Channel, 8-Bit ADCs with 1A Power-Down | Analog to Digital Converters - ADC | ADC, Flash Method, 8-Bit, 1 Func, 4 Channel, Parallel, Word Access, BICMOS, PDIP24, PLASTIC, DIP-24 | Analog to Digital Converters - ADC +5V, 1Msps, 4 and 8-Channel, 8-Bit ADCs with 1A Power-Down | Analog to Digital Converters - ADC | Analog to Digital Converters - ADC +5V, 1Msps, 4 and 8-Channel, 8-Bit ADCs with 1A Power-Down | IC ADC 8BIT 1MSPS 24-DIP | ADC, Flash Method, 8-Bit, 1 Func, 4 Channel, Parallel, Word Access, BICMOS, PDIP24, PLASTIC, DIP-24 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 不符合 |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| 包装说明 | PLASTIC, DIP-24 | PLASTIC, DIP-24 | SSOP-24 | DIP, | SSOP-24 | SSOP-24 | SSOP-24 | , | DIP, |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | compliant | not_compliant | not_compliant | not_compliant | compliant | compliant |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e3 | e0 |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | Matte Tin (Sn) | TIN LEAD |
| 零件包装代码 | DIP | DIP | SSOP | DIP | SSOP | SSOP | SSOP | - | DIP |
| 针数 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | - | 24 |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - | EAR99 |
| 最大模拟输入电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | - | 5.25 V |
| 最小模拟输入电压 | -5.25 V | -5.25 V | -5.25 V | -5.25 V | -5.25 V | -5.25 V | -5.25 V | - | -5.25 V |
| 最长转换时间 | 0.865 µs | 0.865 µs | 0.865 µs | 0.865 µs | 0.865 µs | 0.865 µs | 0.865 µs | - | 0.865 µs |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | - | ADC, FLASH METHOD |
| JESD-30 代码 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 | R-PDIP-T24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | - | R-PDIP-T24 |
| 长度 | 30.545 mm | 30.545 mm | 8.2 mm | 30.545 mm | 8.2 mm | 8.2 mm | 8.2 mm | - | 30.545 mm |
| 湿度敏感等级 | 1 | 1 | 1 | - | 1 | 1 | 1 | - | - |
| 模拟输入通道数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | - | 4 |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | - | 24 |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | - | 70 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | - | BINARY |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | - | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | SSOP | DIP | SSOP | SSOP | SSOP | - | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | - | IN-LINE |
| 峰值回流温度（摄氏度） | 240 | 240 | 245 | NOT SPECIFIED | 240 | 245 | 240 | - | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 采样速率 | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | - | 1 MHz |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK | - | TRACK |
| 座面最大高度 | 4.572 mm | 4.572 mm | 1.99 mm | 4.572 mm | 1.99 mm | 1.99 mm | 1.99 mm | - | 4.572 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V |
| 表面贴装 | NO | NO | YES | NO | YES | YES | YES | - | NO |
| 技术 | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | - | BICMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | - | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | - | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 0.65 mm | 2.54 mm | 0.65 mm | 0.65 mm | 0.65 mm | - | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | 20 | NOT SPECIFIED | NOT SPECIFIED | 20 | NOT SPECIFIED | 20 | - | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 5.29 mm | 7.62 mm | 5.29 mm | 5.29 mm | 5.29 mm | - | 7.62 mm |
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