Figure 1. Collector Emitter Saturation Voltage vs.
Collector Current
600
h
FE
, DC CURRENT GAIN
500
400
300
200
100
0
Figure 2. Collector Emitter Saturation Voltage vs.
Collector Current
1.4
150°C (5.0 V)
150°C (2.0 V)
25°C (5.0 V)
25°C (2.0 V)
−55°C
(5.0 V)
−55°C
(2.0 V)
V
BE(sat)
, BASE EMITTER
SATURATION VOLTAGE (V)
1.2
1.0
0.8
0.6
0.4
0.2
0
0.001
0.01
0.1
1
10
I
C
/I
B
= 10
T
A
=
−55°C
25°C
150°C
0.001
0.01
0.1
1
10
I
C
, COLLECTOR CURRENT (A)
I
C
, COLLECTOR CURRENT (A)
Figure 3. DC Current Gain vs. Collector
Current
V
BE(on)
, BASE EMITTER TURN−ON VOLTAGE (V)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0.001
0.01
0.1
1
10
I
C
, COLLECTOR CURRENT (A)
150°C
T
A
=
−55°C
V
CE
, COLLECTOR−EMITTER VOLTAGE (V)
1.0
0.8
0.6
0.4
0.2
0
Figure 4. Base Emitter Saturation Voltage vs.
Collector Current
V
CE
=
−1.0
V
10 mA
100 mA
300 mA
I
C
= 500 mA
25°C
0.01
0.1
1
10
100
I
B
, BASE CURRENT (mA)
Figure 5. Base Emitter Turn−On Voltage vs.
Collector Current
Figure 6. Saturation Region
http://onsemi.com
3
NSS12100XV6T1G
50
C
obo
, OUTPUT CAPACITANCE (pF)
C
ibo
, INPUT CAPACITANCE (pF)
45
40
35
30
25
20
30
25
20
15
10
5
0
0
1
3
4
5
6
7
8
9
V
CB
, COLLECTOR BASE VOLTAGE (V)
2
10
C
obo(pF)
C
ibo(pF)
0
1
3
4
2
V
EB
, EMITTER BASE VOLTAGE (V)
5
Figure 7. Input Capacitance
Figure 8. Output Capacitance
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4
NSS12100XV6T1G
PACKAGE DIMENSIONS
SOT−563, 6 LEAD
CASE 463A−01
ISSUE F
D
−X−
6
5
4
A
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
MILLIMETERS
MIN
NOM MAX
0.50
0.55
0.60
0.17
0.22
0.27
0.08
0.12
0.18
1.50
1.60
1.70
1.10
1.20
1.30
0.5 BSC
0.10
0.20
0.30
1.50
1.60
1.70
INCHES
NOM MAX
0.021 0.023
0.009 0.011
0.005 0.007
0.062 0.066
0.047 0.051
0.02 BSC
0.004 0.008 0.012
0.059 0.062 0.066
MIN
0.020
0.007
0.003
0.059
0.043
1
2
3
E
−Y−
b
6 PL
5
0.08 (0.003)
H
E
DIM
A
b
C
D
E
e
L
H
E
e
C
M
X Y
STYLE 4:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. EMITTER
5. COLLECTOR
6. COLLECTOR
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.35
0.0531
1.0
0.0394
0.5
0.5
0.0197 0.0197
SCALE 20:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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