Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Mounted onto a 1500 mm
2
, Denka K1, 1.5 mm AI, 2 kV thermally conductive dielectric, 2 oz. Cu, or equivalent board. Heat sinking should
be spread equally among all pins (caution: pin 2 must be electrically isolated).
2. Mounted onto a 2−layer, 1000 mm
2
per layer, 3 oz Cu, FR4 PCB. Heat sinking should be spread equally among all pins (caution: pin 2 must
be electrically isolated).
3. Mounted onto a 2−layer, 50 mm
2
per layer, 1 oz Cu, FR4 PCB. Heat sinking should be spread equally among all pins (caution: pin 2 must
be electrically isolated).
NOTE: Normally this device would be mounted on the same copper heat sink and adjacent to the LED(s). If the LED(s) were to go open,
then the HBL shunt would now dissipate the power using the same copper heat sink. Since the HBL has a voltage that is lower
than that of the LED(s), then the power dissipation would be easily handled by the same heat sink as the LED.
ELECTRICAL CHARACTERISTICS
(Unless otherwise noted: T
A
= 25°C)
Symbol
V
(BR)
Characteristics
Breakdown Voltage: The minimum voltage across the device in or at
the breakdown region. Measured at I
BR
= 1 mA.
Holding Current: The minimum current required to maintain the de-
vice in the on-state.
Breakover Voltage: The voltage across the device in the breakover
region. Measured at I
BO
= 10 mA.
Off−State Current: The dc value of current that results from the ap-
plication of the off-state voltage. This is measured at 8.0 V for
HBL1015 and 11.5 V for HBL1025.
On−State Voltage
Min
HBL1015
HBL1025
HBL1015
HBL1025
HBL1015
HBL1025
HBL1015
HBL1025
HBL1015
HBL1025
1.2
1.2
1.8
1.8
Min
8.0
11.5
125
125
14.0
16.0
0.5
0.5
2.4
2.4
V
mA
V
mA
Typ
Max
Unit
V
I
H
V
BO
I
R
V
T
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
www.onsemi.com
2
HBL1015, HBL1025 Series
TYPICAL PERFORMANCE CURVES
(T
A
= 25°C unless otherwise noted)
140
I
H
, HOLDING CURRENT (mA)
120
C
d
, CAPACITANCE (pF)
HBL1025
100
80 HBL1015
60
40
20
0
−50
20
19
18
17
16
15
14 HBL1025
13
12
11
−25
0
25
50
75
100
125
150
10
0
1
2
3
4
VOLTS (V)
5
6
7
8
HBL1015
T
A
, AMBIENT TEMPERATURE (°C)
Figure 2. Holding Current vs Temperature
15
V
BR
, BREAKDOWN VOLTAGE (V)
14.5
14
13.5
13
12.5
12
11.5
11
10.5
10
−50
−25
0
25
50
75
100
125
150
0
−50
−25
HBL1015
HBL1025
V
T
, ON−STATE VOLTAGE (V)
2.0
2.5
Figure 3. Capacitance vs Voltage
HBL1015/25 @ 350 mA
1.5
1.0
0.5
0
25
50
75
100
125
150
T
A
, AMBIENT TEMPERATURE (°C)
T
A
, AMBIENT TEMPERATURE (°C)
Figure 4. Breakover Voltage vs Temperature
Current
Figure 5. On−State Voltage vs Temperature
On−state
Current
Holding Current
Latching Current
Voltage
Off−state
Current
Breakdown
Voltage
Breakover
Voltage
Figure 6. I−V Characteristics
www.onsemi.com
3
HBL1015, HBL1025 Series
TYPICAL APPLICATION CIRCUIT
Typical Application Circuit for HBL1015
Typical Application Circuit for HBL1025
Current
Source
HBL1015
HBL1025
Current
Source
Control
Circuit
Control
Circuit
HBL1015
HBL1025
Control
Circuit
Control
Circuit
HBL1015
HBL1025
Control
Circuit
Control
Circuit
HBL1015
HBL1025
Control
Circuit
Control
Circuit
Figure 7. Typical Application Circuit
DEVICE ORDERING INFORMATION
Device
HBL1015T1G
HBL1025T1G
Marking
015
025
Package
TSOP−5
(Pb−Free)
TSOP−5
(Pb−Free)
Shipping
†
3000 / Tape & Reel
3000 / Tape & Reel
†For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
4
HBL1015, HBL1025 Series
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE K
NOTE 5
2X
D
5X
0.20 C A B
M
0.10 T
5
1
2
4
3
2X
0.20 T
B
B
S
K
DETAIL Z
G
A
A
TOP VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
DIM
A
B
C
D
G
H
J
K
M
S
MILLIMETERS
MIN
MAX
3.00 BSC
1.50 BSC
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0
_
10
_
2.50
3.00
DETAIL Z
J
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
END VIEW
SOLDERING FOOTPRINT*
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.7
0.028
SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email:
orderlit@onsemi.com
N. American Technical Support:
800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature:
http://www.onsemi.com/orderlit
For additional information, please contact your local
ARM技术
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
