REVISIONS
LTR
A
DESCRIPTION
Change to table I, parameter t
PWC
. Removed programming
requirements. Editorial changes throughout.
Changes in accordance with NOR 5962-R006-91
Changes in accordance with NOR 5962-R229-93
Drawing updated to reflect current requirements. Removed
programming logic from truth table. Editorial changes throughout. -
gap
5 year review and update. Changed input and output capacitance
from 6 pF to 10 pF and 8 pF to 10 pF respectively. ksr
DATE (YR-MO-DA)
89-09-11
APPROVED
Michael A. Frye
B
C
D
91-09-24
93-09-21
01-01-05
Michael A. Frye
Michael A. Frye
Raymond Monnin
E
06-06-06
Raymond Monnin
THE FRONT PAGE OF THIS DRAWING HAS BEEN REPLACED
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
E
1
E
2
E
3
E
4
E
5
E
6
E
7
E
8
E
9
E
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E
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PREPARED BY
James E. Jamison
CHECKED BY
Charles Reusing
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
89-01-13
MICROCIRCUIT, MEMORY,
DIGITAL, CMOS, 2K X 8 BIT, ONE
TIME PROGRAMMABLE (OTP)
REGISTERED PROM,
MONOLITHIC SILICON
SIZE
A
SHEET
CAGE CODE
AMSC N/A
REVISION LEVEL
E
67268
1 OF
13
5962-88735
5962-E482-06
DSCC FORM 2233
APR 97
.
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-88735
01
L
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
Generic number
7C245
7C245
7C245A
7C245A
Circuit function
2K X 8-bit registered PROM
2K X 8-bit registered PROM
2K X 8-bit registered PROM
2K X 8-bit registered PROM
Access time
45 ns
35 ns
35 ns
25 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
K
L
3
Descriptive designator
GDFP2-F24 or CDFP3-F24
GDIP3-T24 or CDIP4-T24
CQCC1-N28
Terminals
24
24
28
Package style
Flat package
Dual-in-line package
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings. 1/
Supply voltage range (V
CC
) ...........................................................
DC voltage applied to outputs in high Z state ................................
DC program voltage (V
PP
):
Device types 01 and 02...............................................................
Device types 03 and 04...............................................................
DC input voltage.............................................................................
Storage temperature range ............................................................
Power dissipation (P
D
) 2/..............................................................
Lead temperature (soldering, 10 seconds) ....................................
Junction temperature (T
J
) 3/ .........................................................
Thermal resistance, junction-to-case (θ
JC
) .....................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) ...........................................................
Case operating temperature range (T
C
) .......................................
+4.5 V dc to +5.5 V dc
-55°C to +125°C
-0.5 V dc to +7.0 V dc
-0.5 V dc to +7.0 V dc
14.0 V dc
13.0 V dc
-3.0 V dc to +7.0 V dc
-65°C to +150°C
1.0 W
+300°C
+150°C
See MIL-STD-1835
1/ Unless otherwise specified, all voltages are referenced to ground.
2/ Must withstand the added P
D
due to short-circuit test; e.g., I
OS
.
3/ Maximum junction temperature may be increased to +175°C during burn-in and steady-state life.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88735
SHEET
E
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.2 Truth table.
3.2.2.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing
shall be as specified on figure 2. When required in groups A, B, or C inspection (see 4.3), the devices shall be programmed by
the manufacturer prior to test in a checkerboard pattern or similar pattern (a minimum of 50 percent of the total number of bits
programmed) or to any altered item drawing pattern which includes at least 25 percent of the total number of bits programmed.
3.2.2.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing.
3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88735
SHEET
E
3
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For
packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the
option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Processing options. Since the PROM is an unprogrammed memory capable of being programmed by either the
manufacturer or the user to result in a wide variety of PROM configurations, two processing options are provided for selection
in the contract using an altered item drawing.
3.6.1 Unprogrammed PROM delivered to the user. All testing shall be verified through group A testing as defined in 4.3.1. It
is recommended that users perform subgroups 7 and 9 after programming to verify the specific program configuration.
3.6.2 Manufacturer-programmed PROM delivered to the user. All testing requirements and quality assurance provisions
herein, including the requirements of the altered item drawing shall be satisfied by the manufacturer prior to delivery.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.9 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.10 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test (method 1015 of MIL-STD-883).
(1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or procuring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of
MIL-STD-883.
(2) TA = +125°C, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-
883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a.
b.
c.
Tests shall be as specified in table II herein.
Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
Subgroup 4 (C
IN
and C
OUT
measurements) shall be measured only for the initial test and after process or design
changes which may affect input or output capacitance. Sample size is 15 devices with no failures, and all input and
output terminals tested.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88735
SHEET
E
4
d.
Unprogrammed devices shall be tested for programmability and ac performance compliance to the requirements of
group A, subgroups 9, 10, and 11. Either of two techniques is acceptable:
(1) Testing the entire lot using additional built-in test circuitry which allows the manufacturer to verify
programmability and ac performance without programming the user array. If this is done, the resulting test
patterns shall be verified on all devices during subgroups 9, 10, and 11, group A testing in accordance with the
sampling plan specified in MIL-STD-883, method 5005.
(2) If such compliance cannot be tested on an unprogrammed device, a sample shall be selected to satisfy
programmability requirements prior to performing subgroups 9, 10, and 11. Twelve devices shall be submitted to
programming (see 4.4). If more than two devices fail to program, the lot shall be rejected. At the manufacturer's
option, the sample may be increased to 24 total devices with no more than four total device failures allowable.
Ten devices from the programmability sample shall be submitted to the requirements of group A, subgroups 9,
10, and 11. If more than two devices fail, the lot shall be rejected. At the manufacturer's option, the sample may
be increased to 20 total devices with no more than four total device failures allowable.
e.
Subgroups 7 and 8 shall include verification of the truth table.
4.3.2 Groups C and D inspections.
a.
b.
End-point electrical parameters shall be as specified in table II herein.
Steady-state life test conditions, method 1005 of MIL-STD-883.
(1)
Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1005 of MIL-STD-883.
T
A
= +125°C, minimum.
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
(2)
(3)
4.4 Programming procedures. The programming procedures shall be as specified by the device manufacturer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88735
SHEET
E
5
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