|
FPF2164 |
FPF2163 |
FPF2165 |
描述 |
Power Switch ICs - Power Distribution Full Function Load Switch |
IC LOAD SWITCH ADJ CURR 6-MLP |
IC LOAD SWITCH ADJ CURR 6-MLP |
Brand Name |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
是否无铅 |
不含铅 |
不含铅 |
不含铅 |
包装说明 |
HVSON, |
HVSON, |
HVSON, |
制造商包装代码 |
511CY |
511CY |
511CY |
Reach Compliance Code |
compliant |
compliant |
compliant |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
Factory Lead Time |
1 week |
1 week |
1 week |
可调阈值 |
YES |
YES |
YES |
模拟集成电路 - 其他类型 |
POWER SUPPLY SUPPORT CIRCUIT |
POWER SUPPLY SUPPORT CIRCUIT |
POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 |
S-XDSO-N6 |
S-XDSO-N6 |
S-XDSO-N6 |
长度 |
2 mm |
2 mm |
2 mm |
湿度敏感等级 |
1 |
1 |
1 |
信道数量 |
1 |
1 |
1 |
功能数量 |
1 |
1 |
1 |
端子数量 |
6 |
6 |
6 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
封装主体材料 |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
封装代码 |
HVSON |
HVSON |
HVSON |
封装形状 |
SQUARE |
SQUARE |
SQUARE |
封装形式 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
0.8 mm |
0.8 mm |
0.8 mm |
最大供电电压 (Vsup) |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 (Vsup) |
1.8 V |
1.8 V |
1.8 V |
标称供电电压 (Vsup) |
3.3 V |
3.3 V |
3.3 V |
表面贴装 |
YES |
YES |
YES |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Gold/Palladium/Silver (Ni/Au/Pd/Ag) |
端子形式 |
NO LEAD |
NO LEAD |
NO LEAD |
端子节距 |
0.65 mm |
0.65 mm |
0.65 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
2 mm |
2 mm |
2 mm |
Base Number Matches |
1 |
1 |
1 |
JESD-609代码 |
e4 |
e4 |
- |