architecture, are controlled by a highly efficient
GaAIAs infrared LED.
The PLA140’s combination of low on-resistance and
high load current handling makes it suitable for a
variety of industrial applications.
Because Solid State Relays like the PLA140 have no
moving parts, they offer faster, bounce-free switching
in a more compact surface mount or though hole
package than traditional electromechanical relays.
PLA140
Features
•
Low On-Resistance, High Current Handling
•
Low Drive Power Requirements (TTL/CMOS
Compatible)
•
3750V
rms
Input/Output Isolation
•
High Reliability
•
VDE Compatible
•
FCC Compatible
•
Arc-Free With No Snubbing Circuits
•
No EMI/RFI Generation
•
Machine Insertable, Wave Solderable
•
Small 6-Pin Package
•
Surface Mount Tape & Reel Version Available
Applications
•
Telecommunications
•
Telecomm Switching
•
Hook Switch
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment—Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
•
Automotive
Approvals
•
UL Certified Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
Certified to EN60950
TUV Certificate B 09 07 49410 004
Ordering Information
Part Number
PLA140
PLA140S
PLA140STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1,000/Reel)
Pin Configuration
AC/DC Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
Load
Do Not Use
Load
Switching Characteristics of
Normally Open Devices
Form-A
I
F
90%
+ Load
– Load
DC Only Configuration
+ Control
– Control
Do Not Use
1
2
3
6
5
4
I
LOAD
t
on
10%
t
off
Pb
DS-PLA140-R08
e
3
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Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
PLA140
Ratings
400
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW /
ºC
Derate linearly 6.67 mW /
ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current (Continuous)
AC/DC Configuration
DC Configuration
Peak Load Current
On-Resistance
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
Conditions
Symbol
Min
Typ
Max
Units
I
F
=5mA
I
F
=5mA , t=10ms
I
F
=5mA , I
L
=250mA
I
F
=5mA , I
L
=350mA
V
L
=400V
P
I
L
I
LPK
-
-
-
-
-
-
-
-
-
-
0.2
0.9
-
-
-
-
-
5.5
1.5
-
0.4
0.19
18
0.46
0.44
1.2
-
3
250
350
±500
8
3
1
3
1
-
5
-
1.4
10
-
mA
rms
/ mA
DC
mA
DC
mA
P
µA
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
I
F
=5mA, V
L
=10V
I
F
=0mA , V
L
=50V, f=1MHz
I
L
=250mA
-
I
F
=5mA
V
R
=5V
-
ms
pF
mA
mA
V
µA
pF
2
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NTEGRATED
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PERFORMANCE DATA*
30
25
Device Count (N)
Device Count (N)
PLA140
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
20
Typical I
F
for Switch Operation
(I
L
=250mA)
20
Typical On-Resistance Distribution
(N=50, I
F
=5mA, I
L
=250mA)
Device Count (N)
15
15
20
15
10
5
0
1.235 1.240 1.245 1.250 1.255 1.260 1.265
LED Forward Voltage (V)
10
10
5
5
0
0.28 0.34 0.40 0.46 0.52 0.58 0.64 0.70
LED Current (mA)
0
4.7
4.8
4.9 5.0 5.1 5.2
On-Resistance ( )
5.3
5.4
25
20
15
10
5
0
Typical Turn-On Time
(N=50, I
F
=5mA, I
L
=100mA)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=5mA, I
L
=100mA)
20
Typical Blocking Voltage Distribution
(N=50, I
F
=0mA)
Device Count (N)
Device Count (N)
Device Count (N)
0.13 0.15 0.17 0.19 0.21 0.23 0.25 0.27
Turn-Off Time (ms)
15
10
5
0
442
448
454 460 466 472 478
Blocking Voltage (V
P
)
484
0.675 0.750 0.825 0.900 0.975 1.050 1.125 1.200
Turn-On Time (ms)
Typical LED Forward Voltage Drop
vs. Temperature
1.6
LED Forward Voltage (V)
1.5
1.4
1.3
1.2
1.1
-40
I
F
=50mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
-20
0
20
40
60
Temperature (ºC)
80
100
1.6
1.4
Turn-On Time (ms)
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
Typical Turn-On Time
vs. LED Forward Current
(I
L
=100mA)
Turn-Off Time (ms)
0.26
0.24
0.22
0.20
0.18
0.16
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=100mA)
10
20
30
LED Current (mA)
40
50
0
10
20
30
LED Current (mA)
40
50
0.60
0.58
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=100mA)
Turn-On Time (ms)
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
Typical Turn-On Time vs. Temperature
(I
F
=5mA, I
L
=100mA)
Turn-Off Time (ms)
0.26
0.24
0.22
0.20
0.18
0.16
Typical Turn-Off Time vs. Temperature
(I
F
=5mA, I
L
=100mA)
LED Current (mA)
0.56
0.54
0.52
0.50
0.48
0.46
0.44
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.5
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.14
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R08
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3
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NTEGRATED
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PERFORMANCE DATA*
Typical On-Resistance vs. Temperature
AC/DC Configuration
(I
F
=5mA, I
L
=100mA)
PLA140
9
On-Resistance ( )
8
0.3
0.2
Load Current (A)
0.1
0.0
-0.1
-0.2
Typical Load Current vs. Load Voltage
AC/DC Configuration
(I
F
=5mA)
Load Current (mA)
275
250
225
200
175
150
125
100
Maximum Load Current
vs. Temperature - AC/DC Configuration
(I
F
=5mA)
7
6
5
4
3
-40
-20
0
20
40
60
Temperature (ºC)
80
100
-0.3
-1.5
-1.0
-0.5
0.0
0.5
Load Voltage (V)
1.0
1.5
-40
-20
0
20
40
60
Temperature (ºC)
80
100
2.4
2.2
On-Resistance ( )
2.0
1.8
1.6
1.4
1.2
Typical On-Resistance vs. Temperature
DC-Only Configuration
(I
F
=5mA, I
L
=100mA)
0.40
0.35
Load Current (A)
0.30
0.25
0.20
0.15
0.10
0.05
0.00
Typical Load Current vs. Load Voltage
DC-Only Configuration
(I
F
=5mA)
Load Current (mA)
375
350
325
300
275
250
225
200
175
150
Maximum Load Current
vs. Temperature - DC-Only Configuration
(I
F
=5mA)
1.0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.0
0.1
0.2
0.3
0.4
Load Voltage (V)
0.5
0.6
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Typical Blocking Voltage
vs. Temperature
510
Leakage Current (nA)
80
70
60
50
40
30
20
10
0
-40
Typical Leakage vs. Temperature
Measured Across Pins 4&6
(V
L
=400V)
Energy Rating Curve
1.2
1.0
0.8
0.6
0.4
0.2
10 s 100 s 1ms 10ms 100ms
Time
Blocking Voltage (V
P
)
500
490
480
470
460
450
440
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Load Current (A)
-20
0
20
40
60
Temperature (ºC)
80
100
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
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Manufacturing Information
Moisture Sensitivity
PLA140
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PLA140 / PLA140S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
PLA140 / PLA140S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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