These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
Features
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ULTRAFAST RECTIFIER
3.0 AMPERES, 200 VOLTS
Ultrafast 35 Nanosecond Recovery Time
Low Forward Voltage Drop
Low Leakage
AEC−Q101 Qualified and PPAP Capable
SURD8 Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb−Free*
Mechanical Characteristics
DPAK
CASE 369C
1
3
4
Case: Epoxy, Molded
Weight: 0.4 Gram (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
MARKING DIAGRAM
AYWW
U
320G
A
Y
WW
G
= Assembly Location
= Year
= Work Week
= Pb−Free Package
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260C Max. for 10 Seconds
ESD Ratings:
Machine Model = C (> 400 V)
Human Body Model = 3B (> 8 kV)
MAXIMUM RATINGS
Rating
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Average Rectified Forward Current
(Rated V
R
, T
C
= 158C)
Peak Repetitive Forward Current
(Rated V
R
, Square Wave, 20 kHz,
T
C
= 158C)
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load
Conditions Halfwave, 60 Hz)
Operating Junction and Storage
Temperature Range
Symbol
V
RRM
V
RWM
V
R
I
F(AV)
I
FRM
Value
200
Unit
V
ORDERING INFORMATION
Device
MURD320T4G
Package
DPAK
(Pb−Free)
DPAK
(Pb−Free)
Shipping
†
2,500/Tape & Reel
16 mm
2,500/Tape & Reel
16 mm
3.0
6.0
A
SURD8320T4G
A
I
FSM
75
−65
to +175
A
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
T
J
, T
stg
C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
January, 2012
−
Rev. 7
1
Publication Order Number:
MURD320/D
MURD320T4G, SURD8320T4G
THERMAL CHARACTERISTICS
Characteristics
Thermal Resistance
−
Junction−to−Case
Thermal Resistance
−
Junction−to−Ambient (Note 1)
1. Rating applies when surface mounted on the minimum pad sizes recommended.
Symbol
R
qJC
R
qJA
Value
6
80
Unit
C/W
C/W
ELECTRICAL CHARACTERISTICS
Characteristics
Maximum Instantaneous Forward Voltage Drop (Note 2)
(i
F
= 3 Amps, T
J
= 25C)
(i
F
= 3 Amps, T
J
= 125C)
Maximum Instantaneous Reverse Current (Note 2)
(T
J
= 25C, Rated dc Voltage)
(T
J
= 125C, Rated dc Voltage)
Maximum Reverse Recovery Time
(I
F
= 1 Amp, di/dt = 50 Amps/ms, V
R
= 30 V, T
J
= 25C)
(I
F
= 0.5 Amp, i
R
= 1 Amp, I
REC
= 0.25 A, V
R
= 30 V, T
J
= 25C)
2. Pulse Test: Pulse Width = 300
ms,
Duty Cycle
2.0%.
100
IR, REVERSE CURRENT (
m
A)
70
50
Symbol
v
F
Value
0.95
0.75
5
500
35
25
Unit
Volts
i
R
mA
t
rr
ns
30
i , INSTANTANEOUS FORWARD CURRENT (AMPS)
F
20
80
40
20
8.0
4.0
2.0
0.8
0.4
0.2
0.08
0.04
0.02
0.008
0.004
0.002
0
20
40
60
80
T
J
= 175C
150C
100C
25C
10
7.0
5.0
100
120
140
160
180 200
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 2. Typical Reverse Current*
3.0
175C
2.0
PF(AV) , AVERAGE POWER DISSIPATION (WATTS)
150C
1.0
0.7
0.5
100C
14
13
12
11
10
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
0
T
J
= 25C
* The curves shown are typical for the highest voltage device in the
voltage grouping. Typical reverse current for lower voltage selections
can be estimated from these curves if V
R
is sufficiently below rated
V
R
.
SINE WAVE
SQUARE WAVE
5.0
10
I
PK
/I
AV
= 20
dc
0.3
0.2
T
J
= 175C
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
v
F,
INSTANTANEOUS VOLTAGE (VOLTS)
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10
Figure 1. Typical Forward Voltage
I
F(AV)
, AVERAGE FORWARD CURRENT (AMPS)
Figure 3. Average Power Dissipation
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2
MURD320T4G, SURD8320T4G
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
8.0
7.0
6.0
5.0
4.0
3.0
dc
2.0
1.0
0
100
110
120
130
140
150
160
170
180
T
C
, CASE TEMPERATURE (C)
T
J
= 175C
SINE WAVE
OR
SQUARE WAVE
RATED VOLTAGE APPLIED
R
qJC
= 6C/W
Figure 4. Current Derating, Case
IF(AV) , AVERAGE FORWARD CURRENT (AMPS)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
0
20
40
60
80
100
120
140
160
180 200
T
A
, AMBIENT TEMPERATURE (C)
SINE WAVE
OR
SQUARE WAVE
SURFACE MOUNTED ON
MIN. PAD SIZE RECOMMENDED
dc
T
J
= 175C
RATED VOLTAGE APPLIED
R
qJA
= 80C/W
Figure 5. Current Derating, Ambient
1000
500
C, CAPACITANCE (pF)
300
200
T
J
= 25C
100
50
30
20
10
0
10
20
30
40
50
60
70
80
90
100
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 6. Typical Capacitance
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3
MURD320T4G, SURD8320T4G
PACKAGE DIMENSIONS
DPAK (SINGLE GAUGE)
CASE 369C−01
ISSUE D
A
B
C
A
c2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
DIM
A
A1
b
b2
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
Z
INCHES
MIN
MAX
0.086 0.094
0.000 0.005
0.025 0.035
0.030 0.045
0.180 0.215
0.018 0.024
0.018 0.024
0.235 0.245
0.250 0.265
0.090 BSC
0.370 0.410
0.055 0.070
0.108 REF
0.020 BSC
0.035 0.050
−−−
0.040
0.155
−−−
MILLIMETERS
MIN
MAX
2.18
2.38
0.00
0.13
0.63
0.89
0.76
1.14
4.57
5.46
0.46
0.61
0.46
0.61
5.97
6.22
6.35
6.73
2.29 BSC
9.40 10.41
1.40
1.78
2.74 REF
0.51 BSC
0.89
1.27
−−−
1.01
3.93
−−−
E
b3
L3
1
4
D
2
3
Z
DETAIL A
H
L4
b2
e
b
0.005 (0.13)
M
c
C
L2
GAUGE
PLANE
H
C
L
L1
DETAIL A
SEATING
PLANE
A1
ROTATED 90 CW
5
SOLDERING FOOTPRINT*
6.20
0.244
3.00
0.118
2.58
0.102
5.80
0.228
1.60
0.063
6.17
0.243
SCALE 3:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
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Email:
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For additional information, please contact your local
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