16-bit Microcontrollers - MCU PIC24F Core 4KB 512B RAM 3V Deep Sleep
参数名称 | 属性值 |
Product Attribute | Attribute Value |
制造商 Manufacturer | Microchip(微芯科技) |
产品种类 Product Category | 16-bit Microcontrollers - MCU |
Core | PIC24 |
Data Bus Width | 16 bit |
产品 Product | MCU |
Processor Series | PIC24F |
PIC24F04KA200-E/P | PIC24F04KA200-I/P | PIC24F04KA201-E/P | PIC24F04KA200-I/ST | PIC24F04KA201T-I/SS | PIC24F04KA200T-I/ST | |
---|---|---|---|---|---|---|
描述 | 16-bit Microcontrollers - MCU PIC24F Core 4KB 512B RAM 3V Deep Sleep | 16-bit Microcontrollers - MCU 4KB Flash512B RAM 3V 10-bit 500ksps ADC | 16-bit Microcontrollers - MCU PIC24F Core 4KB 512B RAM 3V Deep Sleep | 16-bit Microcontrollers - MCU 4KB Flash512B RAM 3V 10-bit 500ksps ADC | 16位微控制器 - MCU 4KB Flash512B RAM 3V 10-bit 500ksps ADC | 16位微控制器 - MCU 4KB Flash512B RAM 3V 10-bit 500ksps ADC |
是否无铅 | - | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | - | 符合 | - | 符合 | 符合 | 符合 |
厂商名称 | - | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
零件包装代码 | - | DIP | - | TSSOP | SSOP | TSSOP |
包装说明 | - | DIP, DIP14,.3 | - | TSSOP, TSSOP14,.25 | SSOP, SSOP20,.3 | TSSOP, TSSOP14,.25 |
针数 | - | 14 | - | 14 | 20 | 14 |
Reach Compliance Code | - | compliant | - | compliant | compliant | compliant |
ECCN代码 | - | 3A991.A.2 | - | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
Factory Lead Time | - | 5 weeks | - | 16 weeks | 8 weeks | 10 weeks |
Is Samacsys | - | N | - | N | N | N |
具有ADC | - | YES | - | YES | YES | YES |
位大小 | - | 16 | - | 16 | 16 | 16 |
CPU系列 | - | PIC | - | PIC | PIC | PIC |
最大时钟频率 | - | 32 MHz | - | 32 MHz | 32 MHz | 32 MHz |
DAC 通道 | - | NO | - | NO | NO | NO |
DMA 通道 | - | NO | - | NO | NO | NO |
集成缓存 | - | NO | - | NO | NO | NO |
JESD-30 代码 | - | R-PDIP-T14 | - | R-PDSO-G14 | R-PDSO-G20 | R-PDSO-G14 |
JESD-609代码 | - | e3 | - | e3 | e3 | e3 |
长度 | - | 19.05 mm | - | 5 mm | 7.2 mm | 5 mm |
低功率模式 | - | NO | - | NO | NO | NO |
I/O 线路数量 | - | 12 | - | 12 | 18 | 12 |
端子数量 | - | 14 | - | 14 | 20 | 14 |
计时器数量 | - | 3 | - | 3 | 3 | 3 |
片上数据RAM宽度 | - | 16 | - | 16 | 16 | 16 |
片上程序ROM宽度 | - | 24 | - | 24 | 24 | 24 |
最高工作温度 | - | 85 °C | - | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | -40 °C | - | -40 °C | -40 °C | -40 °C |
PWM 通道 | - | YES | - | YES | YES | YES |
封装主体材料 | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | DIP | - | TSSOP | SSOP | TSSOP |
封装等效代码 | - | DIP14,.3 | - | TSSOP14,.25 | SSOP20,.3 | TSSOP14,.25 |
封装形状 | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | IN-LINE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | - | NOT SPECIFIED | - | 260 | 260 | 260 |
电源 | - | 2/3.3 V | - | 2/3.3 V | 2/3.3 V | 2/3.3 V |
认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | - | 512 | - | 512 | 512 | 512 |
RAM(字数) | - | 256 | - | 256 | 256 | 256 |
ROM(单词) | - | 1365 | - | 1365 | 1365 | 1365 |
ROM可编程性 | - | FLASH | - | FLASH | FLASH | FLASH |
座面最大高度 | - | 5.334 mm | - | 1.2 mm | 2 mm | 1.2 mm |
速度 | - | 32 MHz | - | 32 MHz | 32 MHz | 32 MHz |
最大压摆率 | - | 18 mA | - | 18 mA | 18 mA | 18 mA |
最大供电电压 | - | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | - | 3 V | - | 3 V | 3 V | 3 V |
标称供电电压 | - | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | - | NO | - | YES | YES | YES |
技术 | - | CMOS | - | CMOS | CMOS | CMOS |
温度等级 | - | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | - | Matte Tin (Sn) - annealed | - | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
端子形式 | - | THROUGH-HOLE | - | GULL WING | GULL WING | GULL WING |
端子节距 | - | 2.54 mm | - | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | - | DUAL | - | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | - | 40 | 40 | 40 |
宽度 | - | 7.62 mm | - | 4.4 mm | 5.3 mm | 4.4 mm |
uPs/uCs/外围集成电路类型 | - | MICROCONTROLLER | - | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
Base Number Matches | - | 1 | - | 1 | 1 | 1 |
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