Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MKE02Z32VLD4

MKE02Z32VLD4: 产品描述ARM Microcontrollers - MCU MKE02Z32VLD4/LQFP44///STANDARD MARKING * TRAY DRY; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小785KB，共37页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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MKE02Z32VLD4在线购买

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MKE02Z32VLD4概述

ARM Microcontrollers - MCU MKE02Z32VLD4/LQFP44///STANDARD MARKING * TRAY DRY

MKE02Z32VLD4规格参数

参数名称	属性值
Brand Name	Freescale
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
Reach Compliance Code	compliant
ECCN代码	3A991.A.2
JESD-609代码	e3
湿度敏感等级	3
峰值回流温度（摄氏度）	260
技术	CMOS
端子面层	MATTE TIN
处于峰值回流温度下的最长时间	40
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC

文档解析

MKE02子家族微控制器搭载ARM Cortex-M0+处理器，核心频率达40 MHz，总线频率20 MHz，在2.7V至5.5V电压和-40°C至105°C温度下稳定运行。闪存写入兼容相同电压范围。存储资源包含高达64 KB闪存、256 B EEPROM和4 KB RAM，支持代码和数据高效管理。时钟架构灵活：外部振荡器可选低功耗或高增益模式；内部时钟源可微调至40 MHz；低功耗1 kHz振荡器用于节能场景。电源管理模块实现多级功耗控制，包括运行、等待和停止模式，配合低电压检测机制，提升系统韧性。系统外设包括看门狗、CRC模块和SWD调试接口，确保可靠性和可维护性。位操作引擎优化位级操作。安全特性提供64位唯一ID。人机接口支持最多57个GPIO，键盘中断模块增强交互性。模拟模块核心为12位SAR ADC，最多16通道，支持停止模式操作和硬件触发；两个模拟比较器各带6位DAC，实现精密模拟处理。定时器组合包括多个FlexTimer/PWM单元（一个6通道和两个2通道）、周期性中断定时器及实时时钟，适用于电机控制和时序管理。通信接口全面：两个SPI模块支持主从模式；最多三个UART模块处理串行数据；一个I2C模块连接传感器和外围设备。封装选项覆盖64引脚QFP/LQFP、44引脚LQFP、32引脚LQFP和32引脚QFN，满足不同尺寸需求。该设计针对通信密集型应用如物联网节点，通过丰富接口实现无缝设备集成。

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NXP Semiconductors

Data Sheet: Technical Data

Document Number MKE02P64M40SF0

Rev. 4, 07/2016

KE02 Sub-Family Data Sheet

Supports the following:

MKE02Z16VLC4(R),

MKE02Z32VLC4(R),

MKE02Z64VLC4(R),

MKE02Z16VLD4(R),

MKE02Z32VLD4(R),

MKE02Z64VLD4(R),

MKE02Z32VLH4(R),

MKE02Z64VLH4(R),

MKE02Z32VQH4(R),

MKE02Z64VQH4(R),

MKE02Z16VFM4(R),

MKE02Z32VFM4(R), and

MKE02Z64VFM4(R)

MKE02P64M40SF0

Key features

• Operating characteristics

– Voltage range: 2.7 to 5.5 V

– Flash write voltage range: 2.7 to 5.5 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 40 MHz ARM® Cortex-M0+ core and up to

20 MHz bus clock

– Single cycle 32-bit x 32-bit multiplier

– Single cycle I/O access port

• Memories and memory interfaces

– Up to 64 KB flash

– Up to 256 B EEPROM

– Up to 4 KB RAM

• Clocks

– Oscillator (OSC) - supports 32.768 kHz crystal or 4

MHz to 20 MHz crystal or ceramic resonator; choice

of low power or high gain oscillators

– Internal clock source (ICS) - internal FLL with

internal or external reference, 31.25 kHz pre-

trimmed internal reference for 32 MHz system clock

(able to be trimmed for up to 40 MHz system clock)

– Internal 1 kHz low-power oscillator (LPO)

• System peripherals

– Power management module (PMC) with three power

modes: Run, Wait, Stop

– Low-voltage detection (LVD) with reset or interrupt,

selectable trip points

– Watchdog with independent clock source (WDOG)

– Programmable cyclic redundancy check module

(CRC)

– Serial wire debug interface (SWD)

– Bit manipulation engine (BME)

• Security and integrity modules

– 64-bit unique identification (ID) number per chip

• Human-machine interface

– Up to 57 general-purpose input/output (GPIO)

– Two up to 8-bit keyboard interrupt modules (KBI)

– External interrupt (IRQ)

• Analog modules

– One up to 16-channel 12-bit SAR ADC, operation in

Stop mode, optional hardware trigger (ADC)

– Two analog comparators containing a 6-bit DAC

and programmable reference input (ACMP)

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ordering parts.......................................................................................4

1.1 Determining valid orderable parts............................................... 4

2 Part identification................................................................................. 4

2.1 Description...................................................................................4

2.2 Format.......................................................................................... 4

2.3 Fields............................................................................................4

2.4 Example....................................................................................... 5

3 Parameter classification........................................................................5

4 Ratings..................................................................................................6

4.1 Thermal handling ratings............................................................. 6

4.2 Moisture handling ratings............................................................ 6

4.3 ESD handling ratings................................................................... 6

4.4 Voltage and current operating ratings..........................................7

5 General................................................................................................. 7

5.1 Nonswitching electrical specifications........................................ 7

5.1.1

5.1.2

5.1.3

DC characteristics.......................................................... 7

Supply current characteristics........................................ 14

EMC performance..........................................................15

5.2.2

FTM module timing....................................................... 17

5.3 Thermal specifications................................................................. 18

5.3.1

5.3.2

Thermal operating requirements.................................... 18

Thermal characteristics.................................................. 19

6 Peripheral operating requirements and behaviors................................ 20

6.1 Core modules............................................................................... 20

6.1.1

SWD electricals .............................................................20

6.2 External oscillator (OSC) and ICS characteristics.......................21

6.3 NVM specifications..................................................................... 23

6.4 Analog..........................................................................................24

6.4.1

6.4.2

ADC characteristics....................................................... 25

Analog comparator (ACMP) electricals.........................27

6.5 Communication interfaces........................................................... 28

6.5.1

SPI switching specifications.......................................... 28

7 Dimensions...........................................................................................31

7.1 Obtaining package dimensions.................................................... 31

8 Pinout................................................................................................... 32

8.1 Signal multiplexing and pin assignments.................................... 32

8.2 Device pin assignment................................................................. 34

9 Revision history....................................................................................36

5.2 Switching specifications.............................................................. 16

5.2.1

Control timing................................................................ 16

KE02 Sub-Family Data Sheet, Rev. 4, 07/2016