Green
TB0640L - TB3500L
30A BIDIRECTIONAL SURFACE MOUNT THYRISTOR SURGE PROTECTIVE DEVICE
Features
•
•
•
•
•
•
•
•
•
•
30A Peak Pulse Current @ 10/1000μs
150A Peak Pulse Current @ 8/20μs
58 - 320V Stand-Off Voltages
Oxide-Glass Passivated Junction
Bidirectional Protection In a Single Device
High Off-State impedance and Low On-State Voltage
Helps Equipment Meet GR-1089-CORE, IEC 61000-4-5, FCC
Part 68, ITU-T K.20/K.21, and UL497B
UL Listed Under Recognized Component Index, File Number
156346
Lead Free Finish/RoHS Compliant (Note 1)
Green Molding Compound (No Halogen and Antimony)
(Note 2)
Mechanical Data
•
•
•
•
•
•
Case: SMB
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Lead Free Plating (Matte Tin Finish). Solderable per
MIL-STD-202, Method 208
Polarity: None; Bidirectional Devices Have No Polarity Indicator
Weight: 0.093 grams (approximate)
Top View
Bottom View
Ordering Information
(Note 3)
Part Number
TB0640L-13-F
TB0720L-13-F
TB0900L-13-F
TB1100L-13-F
TB1300L-13-F
TB1500L-13-F
TB1800L-13-F
TB2300L-13-F
TB2600L-13-F
TB3100L-13-F
TB3500L-13-F
Notes:
Case
SMB
SMB
SMB
SMB
SMB
SMB
SMB
SMB
SMB
SMB
SMB
Packaging
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
2. Product manufactured with Data Code 0924 (week 24, 2009) and newer are built with Green Molding Compound.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
YWW
xxxxx
xxxxx = Product type marking code (See Table on Page 2)
= Manufacturers’ code marking
YWW = Date code marking
Y = Last digit of year (ex: 2 for 2002)
WW = Week code (01 ~ 53)
TB0640L - TB3500L
Document number: DS30359 Rev. 9 - 2
1 of 5
www.diodes.com
May 2011
© Diodes Incorporated
TB0640L - TB3500L
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Non-Repetitive Peak Impulse Current @10/1000us
Non-Repetitive Peak On-State Current @8.3ms (one-half cycle)
Typical Positive Temperature Coefficient for Breakdown Voltage
Symbol
I
pp
I
TSM
ΔVBR/ΔT
J
Value
30
15
0.1
Unit
A
A
%/°C
Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Lead
Thermal Resistance, Junction to Ambient
Junction Temperature Range
Storage Temperature Range
Symbol
R
θ
JL
R
θ
JA
T
J
T
STG
Value
30
120
-40 to +150
-55 to +150
Unit
°C/W
°C/W
°C
°C
Maximum Rated Surge Waveform
I
PP
, PEAK PULSE CURRENT (%)
Peak Value (I
pp
)
t
r
= rise time to peak value
t
p
= decay time to half value
Waveform
2/10 us
8/20 us
10/160 us
10/700 us (Note 4)
10/560 us
10/1000 us
Notes:
Standard
GR-1089-CORE
IEC 61000-4-5
FCC Part 68
ITU-T, K.20/K.21
FCC Part 68
GR-1089-CORE
Ipp (A)
200
150
100
60
50
30
Half Value
4. Applied 2kV, 10/700 us waveform
t
r
t
p
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Maximum
Rated
Repetitive
Off-State
Voltage
V
DRM
(V)
TB0640L
TB0720L
TB0900L
TB1100L
TB1300L
TB1500L
TB1800L
TB2300L
TB2600L
TB3100L
TB3500L
58
65
75
90
120
140
160
190
220
275
320
Maximum
Off-State
Leakage
Current @
V
DRM
I
DRM
(uA)
5
5
5
5
5
5
5
5
5
5
5
Maximum
Breakover
Voltage
V
BO
(V)
77
88
98
130
160
180
220
265
300
350
400
Maximum
On-State
Voltage
@ I
T
= 1A
V
T
(V)
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
Breakover Current
I
BO
Min
(mA)
50
50
50
50
50
50
50
50
50
50
50
Max
(mA)
800
800
800
800
800
800
800
800
800
800
800
Holding Current
I
H
Min
(mA)
150
150
150
150
150
150
150
150
150
150
150
Max
(mA)
800
800
800
800
800
800
800
800
800
800
800
Typical
Off-State
Capacitance
C
O
(pF)
100
100
100
60
60
60
60
40
40
40
40
T064L
T072L
T090L
T110L
T130L
T150L
T180L
T230L
T260L
T310L
T350L
Part Number
Marking
Code
TB0640L - TB3500L
Document number: DS30359 Rev. 9 - 2
2 of 5
www.diodes.com
May 2011
© Diodes Incorporated
TB0640L - TB3500L
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Symbol
V
DRM
I
DRM
V
BR
I
BR
V
BO
I
BO
I
H
V
T
I
PP
C
O
Notes:
Parameter
Stand-off Voltage
Leakage current at stand-off voltage
Breakdown voltage
Breakdown current
Breakover voltage
Breakover current
Holding current (Note 5)
On state voltage
Peak pulse current
Off-state capacitance (Note 6)
5. I
H
> (V
L
/R
L
) If this criterion is not obeyed, the TSPD triggers but does not return correctly to high-resistance state. The surge recovery time does not
exceed 30ms.
6. Off-state capacitance measured at f = 1.0MHz, 1.0V
RMS
signal, V
R
= 2V
DC
bias.
I
I
PP
I
BO
I
H
I
BR
I
DRM
V
T
V
DRM
V
BR
V
BO
V
100
1.2
NORMALIZED BREAKDOWN VOLTAGE
1.15
I
(DRM)
, OFF-STATE CURRENT (uA)
10
1.1
1
1.05
0.1
V
DRM
= 50V
1
0.01
0.95
0.001
-25
0
25
50
75
100 125
150
T
J
, JUNCTION TEMPERATURE (°C)
Fig. 1 Off-State Current vs. Junction Temperature
0.9
-50
-25 0
25 50 75 100 125 150 175
T
J
, JUNCTION TEMPERATURE (°C)
Fig. 2 Relative Variation of Breakdown Voltage
vs. Junction Temperature
TB0640L - TB3500L
Document number: DS30359 Rev. 9 - 2
3 of 5
www.diodes.com
May 2011
© Diodes Incorporated
TB0640L - TB3500L
1.1
NORMALIZED BREAKDOWN VOLTAGE
100
1.05
I
T
, ON-STATE CURRENT (A)
10
1
T
j
= 25°C
0.95
25 50 75 100 125 150 175
0
-50 -25
T
J
, JUNCTION TEMPERATURE (ºC)
Fig. 3 Relative Variation of Breakover Voltage
vs. Junction Temperature
2
NORMALIZED HOLDING CURRENT
1
1
9
3
4
5
6
7
8
V
T
, ON-STATE VOLTAGE (V)
Fig. 4 On-State Current vs. On-State Voltage
2
1
1.5
1
0.5
0
-50
-25
25
50
75
100 125
0
T
J
, JUNCTION TEMPERATURE (°C)
Fig. 5 Relative Variation of Holding Current vs.
Junction Temperature
NORMALIZED CAPACITANCE
0.1
1
10
100
V
R
, REVERSE VOLTAGE (V)
Fig. 6 Relative Variation of Junction Capacitance
vs. Reverse Voltage Bias
Package Outline Dimensions
B
A
C
D
J
H
G
E
SMB
Dim
Min
Max
A
3.30
3.94
B
4.06
4.57
C
1.96
2.21
D
0.15
0.31
E
5.00
5.59
G
0.05
0.20
H
0.76
1.52
J
2.00
2.50
All Dimensions in mm
TB0640L - TB3500L
Document number: DS30359 Rev. 9 - 2
4 of 5
www.diodes.com
May 2011
© Diodes Incorporated
TB0640L - TB3500L
Suggested Pad Layout
C
X
Y
G
Z
SMB
Value (in mm)
Dimensions
Z
6.8
G
1.8
X
2.3
Y
2.5
C
4.3
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
TB0640L - TB3500L
Document number: DS30359 Rev. 9 - 2
5 of 5
www.diodes.com
May 2011
© Diodes Incorporated
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