HIGH SPEED
1K X 8 DUAL-PORT
STATIC SRAM
Features
IDT7130SA/LA
IDT7140SA/LA
◆
◆
◆
High-speed access
– Commercial: 20/25/35/55/100ns (max.)
– Industrial: 25/55/100ns (max.)
– Military: 25/35/55/100ns (max.)
Low-power operation
– IDT7130/IDT7140SA
—
Active: 550mW (typ.)
—
Standby: 5mW (typ.)
– IDT7130/IDT7140LA
—
Active: 550mW (typ.)
—
Standby: 1mW (typ.)
MASTER IDT7130 easily expands data bus width to 16-or-
more-bits using SLAVE IDT7140
◆
◆
◆
◆
◆
◆
◆
◆
◆
◆
On-chip port arbitration logic (IDT7130 Only)
BUSY
output flag on IDT7130;
BUSY
input on IDT7140
INT
flag for port-to-port communication
Fully asynchronous operation from either port
Battery backup operation–2V data retention (LA only)
TTL-compatible, single 5V ±10% power supply
Military product compliant to MIL-PRF-38535 QML
Industrial temperature range (–40°C to +85°C) is available
for selected speeds
Available in 48-pin DIP, LCC and Ceramic Flatpack, 52-pin
PLCC, and 64-pin STQFP and TQFP
Green parts available, see ordering information
Functional Block Diagram
OE
L
CE
L
R/W
L
OE
R
CE
R
R/W
R
I/O
0L
- I/O
7L
I/O
Control
BUSY
L
A
9L
A
0L
(1,2)
I/O
0R
-I/O
7R
I/O
Control
BUSY
R
Address
Decoder
10
,
(1,2)
MEMORY
ARRAY
10
Address
Decoder
A
9R
A
0R
CE
L
OE
L
R/W
L
ARBITRATION
and
INTERRUPT
LOGIC
CE
R
OE
R
R/W
R
INT
L
(2)
INT
R
2689 drw 01
(2)
NOTES:
1. IDT7130 (MASTER):
BUSY
is open drain output and requires pullup resistor.
IDT7140 (SLAVE):
BUSY
is input.
2. Open drain output: requires pullup resistor.
JANUARY 2013
1
DSC-2689/15
©2013 Integrated Device Technology, Inc.
IDT7130SA/LA and IDT7140SA/LA
High-Speed 1K x 8 Dual-Port Static SRAM
Military, Industrial and Commercial Temperature Ranges
Description
The IDT7130/IDT7140 are high-speed 1K x 8 Dual-Port Static
RAMs. The IDT7130 is designed to be used as a stand-alone 8-bit
Dual-Port RAM or as a "MASTER" Dual-Port RAM together with the
IDT7140 "SLAVE" Dual-Port in 16-bit-or-more word width systems.
Using the IDT MASTER/SLAVE Dual-Port RAM approach in 16-or-
more-bit memory system applications results in full-speed, error-
free operation without the need for additional discrete logic.
Both devices provide two independent ports with separate con-
trol, address, and I/O pins that permit independent asynchronous
access for reads or writes to any location in memory. An automatic
power down feature, controlled by
CE,
permits the on chip circuitry
of each port to enter a very low standby power mode.
Fabricated using CMOS high-performance technology, these de-
vices typically operate on only 550mW of power. Low-power (LA)
versions offer battery backup data retention capability, with each Dual-
Port typically consuming 200µW from a 2V battery.
The IDT7130/IDT7140 devices are packaged in 48-pin sidebraze
or plastic DIPs, LCCs, flatpacks, 52-pin PLCC, and 64-pin TQFP
and STQFP. Military grade products are manufactured in compli-
ance with the latest revision of MIL-PRF-38535 QML, making it
ideally suited to military temperature applications demanding the
highest level of performance and reliability.
Pin Configurations
(1,2,3)
01/08/02
INDEX
A
1L
A
2L
A
3L
A
4L
A
5L
A
6L
A
7L
A
8L
A
9L
I/O
0L
I/O
1L
I/O
2L
48 47 46 45 44 43
7
42
8
41
9
40
10
39
IDT7130/40L48 or F
11
38
L48-1
(4)
&
12
37
F48-1
(4)
13
36
48-Pin LCC/ Flatpack
14
35
Top View
(5)
15
34
16
33
17
32
18
31
19 20 21 22 23 24 25 26 27
28 29 30
1
I/O
3L
I/O
4L
I/O
5L
I/O
6L
I/O
7L
GND
I/O
0R
I/O
1R
I/O
2R
I/O
3R
I/O
4R
I/O
5R
6 5 4 3 2
A
0L
OE
L
INT
L
BUSY
L
R/W
L
CE
L
V
CC
CE
R
R/W
R
BUSY
R
INT
R
OE
R
A
0R
A
1R
A
2R
A
3R
A
4R
A
5R
A
6R
A
7R
A
8R
A
9R
I/O
7R
I/O
6R
,
2689 drw 03
NOTES:
1. All V
CC
pins must be connected to power supply.
2. All GND pins must be connected to ground supply.
3. L48-1 package body is approximately .57 in x .57 in x .68 in.
F48-1 package body is approximately .75 in x .75 in x .11 in.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part-marking.
2
IDT7130SA/LA and IDT7140SA/LA
High-Speed 1K x 8 Dual-Port Static SRAM
Military, Industrial and Commercial Temperature Ranges
Pin Configurations
(1,2,3)
(con't.)
01/08/02
CE
L
R/W
L
BUSY
L
INT
L
OE
L
A
0L
A
1L
A
2L
A
3L
A
4L
A
5L
A
6L
A
7L
A
8L
A
9L
I/O
0L
I/O
1L
I/O
2L
I/O
3L
I/O
4L
I/O
5L
I/O
6L
I/O
7L
GND
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
IDT7130/40
41
P or C
9
40
P48-1
(4)
10
39
&
11
C48-2
(4)
38
12
48-Pin
37
DIP
13
36
Top View
(5)
35
14
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
V
CC
CE
R
R/W
R
BUSY
R
INT
R
OE
R
A
0R
A
1R
A
2R
A
3R
A
4R
A
5R
A
6R
A
7R
A
8R
A
9R
I/O
7R
I/O
6R
I/O
5R
I/O
4R
I/O
3R
I/O
2R
I/O
1R
I/O
0R
2689 drw 02
,
NOTES:
1. All V
CC
pins must be connected to power supply.
2. All GND pins must be connected to ground supply.
3. P48-1 package body is approximately .55 in x .61 in x .19 in.
C48-2 package body is approximately .62 in x 2.43 in x .15 in.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part-marking.
3
IDT7130SA/LA and IDT7140SA/LA
High-Speed 1K x 8 Dual-Port Static SRAM
Military, Industrial and Commercial Temperature Ranges
Pin Configurations
(1,2,3)
(con't.)
01/22/13
INDEX
7 6 5 4 3 2
A
1L
A
2L
A
3L
A
4L
A
5L
A
6L
A
7L
A
8L
A
9L
I/O
0L
I/O
1L
I/O
2L
I/O
3L
8
9
10
11
12
13
14
15
16
17
18
19
20
1
52 51 50 49 48 47
CE
R
R/W
R
BUSY
R
INT
R
N/C
A
0L
OE
L
N/C
INT
L
BUSY
L
R/W
L
CE
L
V
CC
IDT7130/40J
J52-1
(4)
52-Pin PLCC
Top View
(5)
46
45
44
43
42
41
40
39
38
37
36
35
34
21 22 23 24 25 26 27 28 29 30 31 32 33
I/O
4L
I/O
5L
I/O
6L
I/O
7L
N/C
GND
I/O
0R
I/O
1R
I/O
2R
I/O
3R
I/O
4R
I/O
5R
I/O
6R
OE
R
A
0R
A
1R
A
2R
A
3R
A
4R
A
5R
A
6R
A
7R
A
8R
A
9R
N/C
I/O
7R
,
2689 drw 04
NOTES:
1. All V
CC
pins must be connected to power supply.
2. All GND pins must be connected to ground supply.
3. J52-1 package body is approximately .75 in x .75 in x .17 in.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part-marking.
4
IDT7130SA/LA and IDT7140SA/LA
High-Speed 1K x 8 Dual-Port Static SRAM
Military, Industrial and Commercial Temperature Ranges
Pin Configurations
(1,2,3)
(con't.)
01/22/13
INDEX
OE
L
A
0L
A
1L
A
2L
A
3L
A
4L
A
5L
A
6L
N/C
A
7L
A
8L
A
9L
N/C
I/O
0L
I/O
1L
I/O
2L
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
N/C
N/C
N/C
INT
L
BUSY
L
R/W
L
CE
L
V
CC
V
CC
CE
R
R/W
R
BUSY
R
INT
R
N/C
N/C
N/C
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
IDT7130/40TF or PF
PP64-1 & PN64-1
(4)
64-Pin STQFP
64-Pin TQFP
Top View
(5)
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
OE
R
A
0R
A
1R
A
2R
A
3R
A
4R
A
5R
A
6R
N/C
A
7R
A
8R
A
9R
N/C
N/C
I/O
7R
I/O
6R
,
2689 drw 05
NOTES:
1. All V
CC
pins must be connected to power supply.
2. All GND pins must be connected to ground supply.
3. PP64-1 package body is approximately 10 mm x 10 mm x 1.4mm.
PN64-1 package body is approximately 14mm x 14mm x 1.4mm.
4. This package code is used to reference the package diagram.
5. This text does not indicate orientation of the actual part-marking.
I/O
3L
N/C
I/O
4L
I/O
5L
I/O
6L
I/O
7L
N/C
GND
GND
I/O
0R
I/O
1R
I/O
2R
I/O
3R
N/C
I/O
4R
I/O
5R
5
Microchip MCU
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