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IS42RM32800K-75BLI-TR

产品描述DRAM 256M, 2.5V, 133Mhz Mobile SDRAM
产品类别存储   
文件大小605KB,共35页
制造商ISSI(芯成半导体)
官网地址http://www.issi.com/
标准
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IS42RM32800K-75BLI-TR概述

DRAM 256M, 2.5V, 133Mhz Mobile SDRAM

IS42RM32800K-75BLI-TR规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
ISSI(芯成半导体)
产品种类
Product Category
DRAM
RoHSDetails
类型
Type
SDRAM Mobile
Data Bus Width32 bit
Organization8 M x 32
封装 / 箱体
Package / Case
BGA-90
Memory Size256 Mbit
Maximum Clock Frequency133 MHz
Access Time6 ns
电源电压-最大
Supply Voltage - Max
3 V
电源电压-最小
Supply Voltage - Min
2.3 V
Supply Current - Max80 mA
最小工作温度
Minimum Operating Temperature
- 40 C
最大工作温度
Maximum Operating Temperature
+ 85 C
系列
Packaging
Reel
安装风格
Mounting Style
SMD/SMT
Moisture SensitiveYes
工作电源电压
Operating Supply Voltage
2.5 V
工厂包装数量
Factory Pack Quantity
2500

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IS42/45SM/RM/VM32800K
2M
x
32Bits
x
4Banks Mobile Synchronous DRAM
Description
These IS42/45SM/RM/VM32800K are mobile 268,435,456 bits CMOS Synchronous DRAM organized as 4 banks of 2,097,152 words x 32
bits. These products are offering fully synchronous operation and are referenced to a positive edge of the clock. All inputs and outputs
are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve high bandwidth. All input
and output voltage levels are compatible with LVCMOS.
Features
JEDEC standard 3.3V, 2.5V, 1.8V power supply.
• Auto refresh and self refresh.
• All pins are compatible with LVCMOS interface.
• 4K refresh cycle every 16ms (A2 grade) or
64 ms (Industrial, A1 grade).
• Programmable Burst Length and Burst Type.
- 1, 2, 4, 8 or Full Page for Sequential Burst.
- 4 or 8 for Interleave Burst.
• Programmable CAS Latency : 2, 3 clocks.
• All inputs and outputs referenced to the positive edge of the
system clock.
• Data mask function by DQM.
• Internal 4 banks operation.
• Burst Read Single Write operation.
• Special Function Support.
- PASR(Partial Array Self Refresh)
- Auto TCSR(Temperature Compensated Self Refresh)
- Programmable Driver Strength Control
Full Strength or 3/4, 1/2, 1/4, 1/8 of Full Strength
- Deep Power Down Mode
• Automatic precharge, includes CONCURRENT Auto Precharge
Mode and controlled Precharge.
Copyright © 2016 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its
products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services
described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information
and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or
effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to
its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Rev. B1 | Jan. 2016
www.issi.com
- DRAM@issi.com
1

IS42RM32800K-75BLI-TR相似产品对比

IS42RM32800K-75BLI-TR IS42RM32800K-75BLI IS42RM32800K-6BLI-TR IS42SM32800K-75BLI-TR IS42SM32800K-6BLI-TR IS42SM32800K-6BLI
描述 DRAM 256M, 2.5V, 133Mhz Mobile SDRAM Synchronous DRAM, 8MX32, 6ns, CMOS, PBGA90, FBGA-90 DRAM 256M, 2.5V, 166Mhz Mobile SDRAM DRAM 256M, 3.3V, 133Mhz Mobile SDRAM DRAM 256M, 3.3V, 166Mhz Mobile SDRAM DRAM 256M, 3.3V, 166Mhz 8Mx32 Mobile SDR
Product Attribute Attribute Value - Attribute Value Attribute Value Attribute Value Attribute Value
制造商
Manufacturer
ISSI(芯成半导体) - ISSI(芯成半导体) ISSI(芯成半导体) ISSI(芯成半导体) ISSI(芯成半导体)
产品种类
Product Category
DRAM - DRAM DRAM DRAM DRAM
RoHS Details - Details Details Details Details
类型
Type
SDRAM Mobile - SDRAM Mobile SDRAM Mobile SDRAM Mobile SDRAM Mobile
Data Bus Width 32 bit - 32 bit 32 bit 32 bit 32 bit
Organization 8 M x 32 - 8 M x 32 8 M x 32 8 M x 32 8 M x 32
封装 / 箱体
Package / Case
BGA-90 - BGA-90 BGA-90 BGA-90 BGA-90
Memory Size 256 Mbit - 256 Mbit 256 Mbit 256 Mbit 256 Mbit
Maximum Clock Frequency 133 MHz - 166 MHz 133 MHz 166 MHz 166 MHz
Access Time 6 ns - 5.5 ns 6 ns 5.5 ns 5.5 ns
电源电压-最大
Supply Voltage - Max
3 V - 3 V 3.6 V 3.6 V 3.6 V
电源电压-最小
Supply Voltage - Min
2.3 V - 2.3 V 2.7 V 2.7 V 2.7 V
Supply Current - Max 80 mA - 80 mA 80 mA 80 mA 80 mA
最小工作温度
Minimum Operating Temperature
- 40 C - - 40 C - 40 C - 40 C - 40 C
最大工作温度
Maximum Operating Temperature
+ 85 C - + 85 C + 85 C + 85 C + 85 C
系列
Packaging
Reel - Reel Reel Reel Tray
安装风格
Mounting Style
SMD/SMT - SMD/SMT SMD/SMT SMD/SMT SMD/SMT
Moisture Sensitive Yes - Yes Yes Yes Yes
工作电源电压
Operating Supply Voltage
2.5 V - 2.5 V 3.3 V 3.3 V 3.3 V
工厂包装数量
Factory Pack Quantity
2500 - 2500 2500 2500 240
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