Improved Industry Standard Serial 12-Bit Multiplying DACs
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| 制造商包装代码 | N |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY, OFFSET BINARY |
| 输入格式 | SERIAL |
| JESD-30 代码 | R-PDIP-T16 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.0122% |
| 湿度敏感等级 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.81 mm |
| 最大稳定时间 | 1 µs |
| 标称安定时间 (tstl) | 0.25 µs |
| 最大压摆率 | 2 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| LTC7543GKN | LTC8143FSW | LTC8143ESW | LTC8143FN | LTC8143EN | LTC8143 | LTC7543KSW | LTC7543GKSW | LTC7543KN | LTC7543 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Improved Industry Standard Serial 12-Bit Multiplying DACs | Improved Industry Standard Serial 12-Bit Multiplying DACs | Improved Industry Standard Serial 12-Bit Multiplying DACs | Improved Industry Standard Serial 12-Bit Multiplying DACs | Improved Industry Standard Serial 12-Bit Multiplying DACs | Improved Industry Standard Serial 12-Bit Multiplying DACs | Improved Industry Standard Serial 12-Bit Multiplying DACs | Improved Industry Standard Serial 12-Bit Multiplying DACs | Improved Industry Standard Serial 12-Bit Multiplying DACs | Improved Industry Standard Serial 12-Bit Multiplying DACs |
| Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology | Linear Technology | - | Linear Technology | Linear Technology | Linear Technology | - |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | - |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | - |
| 零件包装代码 | DIP | SOIC | SOIC | DIP | DIP | - | SOIC | SOIC | DIP | - |
| 包装说明 | DIP, DIP16,.3 | SOP, SOP16,.4 | SOP, SOP16,.4 | DIP, DIP16,.3 | DIP, DIP16,.3 | - | 0.300 INCH, PLASTIC, SO-16 | SOP, SOP16,.4 | DIP, DIP16,.3 | - |
| 针数 | 16 | 16 | 16 | 16 | 16 | - | 16 | 16 | 16 | - |
| 制造商包装代码 | N | SW | SW | N | N | - | SW | SW | N | - |
| Reach Compliance Code | _compli | _compli | _compli | _compli | _compli | - | _compli | _compli | _compli | - |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | - |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | - | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | - |
| 输入位码 | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | - | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | - |
| 输入格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | - | SERIAL | SERIAL | SERIAL | - |
| JESD-30 代码 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | - | e0 | e0 | e0 | - |
| 最大线性误差 (EL) | 0.0122% | 0.0244% | 0.0122% | 0.0244% | 0.0122% | - | 0.0122% | 0.0122% | 0.0122% | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 | - |
| 位数 | 12 | 12 | 12 | 12 | 12 | - | 12 | 12 | 12 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 | 1 | - |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | - | 16 | 16 | 16 | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | DIP | SOP | SOP | DIP | DIP | - | SOP | SOP | DIP | - |
| 封装等效代码 | DIP16,.3 | SOP16,.4 | SOP16,.4 | DIP16,.3 | DIP16,.3 | - | SOP16,.4 | SOP16,.4 | DIP16,.3 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | - | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 235 | 235 | NOT SPECIFIED | NOT SPECIFIED | - | 235 | 235 | NOT SPECIFIED | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 3.81 mm | 2.65 mm | 2.65 mm | 3.81 mm | 3.81 mm | - | 2.65 mm | 2.65 mm | 3.81 mm | - |
| 最大稳定时间 | 1 µs | 1 µs | 1 µs | 1 µs | 1 µs | - | 1 µs | 1 µs | 1 µs | - |
| 标称安定时间 (tstl) | 0.25 µs | 0.25 µs | 0.25 µs | 0.25 µs | 0.25 µs | - | 0.25 µs | 0.25 µs | 0.25 µs | - |
| 最大压摆率 | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | - | 2 mA | 2 mA | 2 mA | - |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | - |
| 表面贴装 | NO | YES | YES | NO | NO | - | YES | YES | NO | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | - | GULL WING | GULL WING | THROUGH-HOLE | - |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | - | 1.27 mm | 1.27 mm | 2.54 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 20 | 20 | NOT SPECIFIED | NOT SPECIFIED | - | 20 | 20 | NOT SPECIFIED | - |
| 宽度 | 7.62 mm | 7.5 mm | 7.5 mm | 7.62 mm | 7.62 mm | - | 7.5 mm | 7.5 mm | 7.62 mm | - |
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