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MMSZ5251ET1G

产品描述Zener Diodes ZENER DIODE PB FREE
产品类别半导体    分立半导体   
文件大小158KB,共6页
制造商ON Semiconductor(安森美)
官网地址http://www.onsemi.cn
标准
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MMSZ5251ET1G概述

Zener Diodes ZENER DIODE PB FREE

MMSZ5251ET1G规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
ON Semiconductor(安森美)
产品种类
Product Category
Zener Diodes
RoHSDetails
Vz - Zener Voltage22 V
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
SOD-123
Pd-功率耗散
Pd - Power Dissipation
500 mW (1/2 W)
Voltage Tolerance5 %
最小工作温度
Minimum Operating Temperature
- 55 C
最大工作温度
Maximum Operating Temperature
+ 150 C
ConfigurationSingle
系列
Packaging
Cut Tape
系列
Packaging
Reel
高度
Height
1.12 mm
长度
Length
2.69 mm
类型
Type
Voltage Regulator
宽度
Width
1.6 mm
工厂包装数量
Factory Pack Quantity
3000
单位重量
Unit Weight
0.001058 oz

文档预览

下载PDF文档
MMSZ52xxET1G Series,
SZMMSZ52xxET1G Series
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
Three complete series of Zener diodes are offered in the convenient,
surface mount plastic SOD−123 package. These devices provide a
convenient alternative to the leadless 34−package style.
Features
http://onsemi.com
500 mW Rating on FR−4 or FR−5 Board
Wide Zener Reverse Voltage Range
2.4 V to 110 V
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
General Purpose, Medium Current
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Peak Power
225 W (8
x
20
ms)
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
Pb−Free Packages are Available*
Mechanical Characteristics:
CASE:
Void-free, transfer-molded, thermosetting plastic case
FINISH:
Corrosion resistant finish, easily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
SOD−123
CASE 425
STYLE 1
1
Cathode
2
Anode
MARKING DIAGRAM
1
xxx M
G
G
260C for 10 Seconds
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MAXIMUM RATINGS
Rating
Peak Power Dissipation @ 20
ms
(Note 1)
@ T
L
25C
Total Power Dissipation on FR−5 Board,
(Note 3) @ T
L
= 75C
Derated above 75C
Thermal Resistance, (Note 2)
Junction−to−Ambient
Thermal Resistance, (Note 2)
Junction−to−Lead
Junction and Storage Temperature Range
Symbol
P
pk
P
D
Max
225
Units
W
xxx = Device Code (Refer to page 2)
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MMSZ52xxET1G
Package
SOD−123
(Pb−Free)
SOD−123
(Pb−Free)
SOD−123
(Pb−Free)
Shipping
3,000 /
Tape & Reel
3,000 /
Tape & Reel
10,000 /
Tape & Reel
500
6.7
340
150
−55
to
+150
mW
mW/C
C/W
SZMMSZ52xxET1G
MMSZ52xxET3G
R
qJA
R
qJL
T
J
, T
stg
C/W
C
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Nonrepetitive current pulse per Figure 11.
2. Thermal Resistance measurement obtained via infrared Scan Method.
3. FR−5 = 3.5 x 1.5 inches, using the minimum recommended footprint.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
Semiconductor Components Industries, LLC, 2012
February, 2012
Rev. 8
1
Publication Order Number:
MMSZ5221ET1/D
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