Differential Amplifiers High CM Vltg
参数名称 | 属性值 |
Source Url Status Check Date | 2013-05-01 14:56:15.502 |
Brand Name | Analog Devices Inc |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | ADI(亚德诺半导体) |
零件包装代码 | SOIC |
包装说明 | SOP, SOP8,.25 |
针数 | 8 |
制造商包装代码 | R-8 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER |
标称带宽 (3dB) | 0.5 MHz |
标称共模抑制比 | 88 dB |
最大输入失调电压 | 1000 µV |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e0 |
长度 | 4.9 mm |
湿度敏感等级 | 1 |
负供电电压上限 | -18 V |
标称负供电电压 (Vsup) | -15 V |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP8,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | 240 |
电源 | +-15 V |
认证状态 | Not Qualified |
座面最大高度 | 1.75 mm |
最小摆率 | 1.7 V/us |
标称压摆率 | 2.1 V/us |
供电电压上限 | 18 V |
标称供电电压 (Vsup) | 15 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 3.9 mm |
AD629AR-REEL | AD629BRZ-RL | AD629BNZ | AD629BR | AD629AR | |
---|---|---|---|---|---|
描述 | Differential Amplifiers High CM Vltg | Differential Amplifiers High CM Vltg | Differential Amplifiers High CM Vltg | Differential Amplifiers High CM Vltg | Differential Amplifiers High CM Vltg |
Brand Name | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 符合 | 符合 | 不符合 | 不符合 |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | SOIC | SOIC | DIP | SOIC | SOIC |
包装说明 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 |
针数 | 8 | 8 | 8 | 8 | 8 |
制造商包装代码 | R-8 | R-8 | N-8 | R-8 | R-8 |
Reach Compliance Code | not_compliant | compliant | compliant | not_compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
标称带宽 (3dB) | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz |
标称共模抑制比 | 88 dB | 96 dB | 96 dB | 96 dB | 88 dB |
最大输入失调电压 | 1000 µV | 1000 µV | 1000 µV | 1000 µV | 1000 µV |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 |
JESD-609代码 | e0 | e3 | e3 | e0 | e0 |
长度 | 4.9 mm | 4.9 mm | 9.27 mm | 4.9 mm | 4.9 mm |
负供电电压上限 | -18 V | -18 V | -18 V | -18 V | -18 V |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | DIP | SOP | SOP |
封装等效代码 | SOP8,.25 | SOP8,.25 | DIP8,.3 | SOP8,.25 | SOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 240 | 260 | NOT APPLICABLE | 235 | 235 |
电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.75 mm | 1.75 mm | 5.33 mm | 1.75 mm | 1.75 mm |
最小摆率 | 1.7 V/us | 1.7 V/us | 1.7 V/us | 1.7 V/us | 1.7 V/us |
标称压摆率 | 2.1 V/us | 2.1 V/us | 2.1 V/us | 2.1 V/us | 2.1 V/us |
供电电压上限 | 18 V | 18 V | 18 V | 18 V | 18 V |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | YES | YES | NO | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | 30 | NOT APPLICABLE | 20 | 20 |
宽度 | 3.9 mm | 3.9 mm | 7.62 mm | 3.9 mm | 3.9 mm |
Source Url Status Check Date | 2013-05-01 14:56:15.502 | - | - | 2013-05-01 14:56:15.512 | 2013-05-01 14:56:15.501 |
湿度敏感等级 | 1 | 1 | - | 1 | 1 |
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