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Datasheet> 器件分类 > 半导体> 嵌入式处理器和控制器> HE8067702739824S R2ZY

HE8067702739824S R2ZY: 产品描述CPU - Central Processing Units 64BIT MPU; 产品类别半导体嵌入式处理器和控制器; 文件大小2MB，共215页; 制造商Intel(英特尔); 官网地址http://www.intel.com/; 标准

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HE8067702739824S R2ZY概述

CPU - Central Processing Units 64BIT MPU

HE8067702739824S R2ZY规格参数

参数名称	属性值
Product Attribute	Attribute Value
制造商 Manufacturer	Intel(英特尔)
产品种类 Product Category	CPU - Central Processing Units
RoHS	Details
产品 Product	Mobile Processors
封装 / 箱体 Package / Case	FCBGA-1515
Family	Intel Core M
Core	Intel Core M
Code Name	Kaby Lake
Processor Series	M3-7Y30
Embedded Options	Non-Embedded
Number of Cores	2 Core
TDP - Max	4.5 W
Maximum Clock Frequency	2.6 GHz
Data Bus Width	64 bit
Memory Size	16 GB
Memory Type	DDR3L-1600, LPDDR3-1866
System Bus Type	QPI
System Bus Speed	4 GT/s
Cache Memory	4 MB
最大工作温度 Maximum Operating Temperature	+ 100 C
系列 Packaging	Tray
Package / Case Size	20 mm x 16.5 mm
安装风格 Mounting Style	SMD/SMT
CPU Configuration - Max	1 Configuration
ECC Memory Supported	Non-Supported
Intel Hyper-Threading Technology	With HT Technology
Intel Virtualization Technology - VT	With VT
Lithography - Process Technology	14 nm
Moisture Sensitive	Yes
Number of Displays Supported	3 Display
Number of Memory Channels	2 Channel
Number of PCI Express Lanes	10 Lane
Number of Threads	4 Thread
PCIe Configurations	1x4, 2x2, 1x2 + 2x1, 4x1
PCIe Revision	Revision 3.0
工厂包装数量 Factory Pack Quantity	1
Turbo Frequency - Max	2.6 GHz

HE8067702739824S R2ZY相似产品对比

	HE8067702739824S R2ZY	HE8067702739526S-R2ZT	FJ8067702739738S-R343	FJ8067702739740S-R341	HE8067702739826S-R2ZX	FJ8067702739633S-R340	FJ8067702739738S R2ZW	HE8067702739826S R345	FJ8067702739628S R33Z
描述	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU	CPU - Central Processing Units 64BIT MPU
Product Attribute	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value	Attribute Value
制造商 Manufacturer	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)	Intel(英特尔)
产品种类 Product Category	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units	CPU - Central Processing Units
RoHS	Details	Details	-	-	Details	Details	Details	-	Details
产品 Product	Mobile Processors	Mobile Processors	-	-	Mobile Processors	Mobile Processors	Mobile Processors	-	Mobile Processors
封装 / 箱体 Package / Case	FCBGA-1515	FCBGA-1515	-	-	FCBGA-1515	FCBGA-1356	FCBGA-1356	-	FCBGA-1356
Family	Intel Core M	Intel Core i7	-	-	Intel Core i5	Intel Core i5	Intel Core i3	-	Intel Core i7
Core	Intel Core M	Intel Core i7	-	-	Intel Core i5	Intel Core i5	Intel Core i3	-	Intel Core i7
Code Name	Kaby Lake	Kaby Lake	-	-	Kaby Lake	Kaby Lake	Kaby Lake	-	Kaby Lake
Processor Series	M3-7Y30	i7-7Y75	-	-	i5-7Y54	i5-7300U	i3-7100U	-	i7-7600U
Embedded Options	Non-Embedded	Non-Embedded	-	-	Non-Embedded	Embedded	Embedded	-	Embedded
Number of Cores	2 Core	2 Core	-	-	2 Core	2 Core	2 Core	-	2 Core
TDP - Max	4.5 W	4.5 W	-	-	4.5 W	15 W	15 W	-	15 W
Maximum Clock Frequency	2.6 GHz	3.6 GHz	-	-	3.2 GHz	3.5 GHz	2.4 GHz	-	3.9 GHz
Data Bus Width	64 bit	64 bit	-	-	64 bit	64 bit	64 bit	-	64 bit
Memory Size	16 GB	16 GB	-	-	16 GB	32 GB	32 GB	-	32 GB
Memory Type	DDR3L-1600, LPDDR3-1866	DDR3L-1600, LPDDR3-1866	-	-	DDR3L-1600, LPDDR3-1866	DDR3L-1600, DDR4-2133, LPDDR3-1866	DDR3L-1600, DDR4-2133, LPDDR3-1866	-	DDR3L-1600, DDR4-2133, LPDDR3-1866
System Bus Type	QPI	QPI	-	-	QPI	QPI	QPI	-	QPI
System Bus Speed	4 GT/s	4 GT/s	-	-	4 GT/s	4 GT/s	4 GT/s	-	4 GT/s
Cache Memory	4 MB	4 MB	-	-	4 MB	3 MB	3 MB	-	4 MB
最大工作温度 Maximum Operating Temperature	+ 100 C	+ 100 C	-	-	+ 100 C	+ 100 C	+ 100 C	-	+ 100 C
系列 Packaging	Tray	Tray	-	-	Tray	Tray	Tray	-	Tray
Package / Case Size	20 mm x 16.5 mm	20 mm x 16.5 mm	-	-	20 mm x 16.5 mm	42 mm x 24 mm	42 mm x 24 mm	-	42 mm x 24 mm
安装风格 Mounting Style	SMD/SMT	SMD/SMT	-	-	SMD/SMT	SMD/SMT	SMD/SMT	-	SMD/SMT
CPU Configuration - Max	1 Configuration	1 Configuration	-	-	1 Configuration	1 Configuration	1 Configuration	-	1 Configuration
ECC Memory Supported	Non-Supported	Non-Supported	-	-	Non-Supported	Non-Supported	Non-Supported	-	Non-Supported
Intel Hyper-Threading Technology	With HT Technology	With HT Technology	-	-	With HT Technology	With HT Technology	With HT Technology	-	With HT Technology
Intel Virtualization Technology - VT	With VT	With VT	-	-	With VT	With VT	With VT	-	With VT
Lithography - Process Technology	14 nm	14 nm	-	-	14 nm	14 nm	14 nm	-	14 nm
Moisture Sensitive	Yes	Yes	-	-	Yes	Yes	Yes	-	Yes
Number of Displays Supported	3 Display	3 Display	-	-	3 Display	3 Display	3 Display	-	3 Display
Number of Memory Channels	2 Channel	2 Channel	-	-	2 Channel	2 Channel	2 Channel	-	2 Channel
Number of PCI Express Lanes	10 Lane	10 Lane	-	-	10 Lane	12 Lane	12 Lane	-	12 Lane
Number of Threads	4 Thread	4 Thread	-	-	4 Thread	4 Thread	4 Thread	-	4 Thread
PCIe Configurations	1x4, 2x2, 1x2 + 2x1, 4x1	1x4, 2x2, 1x2 + 2x1, 4x1	-	-	1x4, 2x2, 1x2 + 2x1, 4x1	1x4, 2x2, 1x2 + 2x1, 4x1	1x4, 2x2, 1x2 + 2x1, 4x1	-	1x4, 2x2, 1x2 + 2x1, 4x1
PCIe Revision	Revision 3.0	Revision 3.0	-	-	Revision 3.0	Revision 3.0	Revision 3.0	-	Revision 3.0
工厂包装数量 Factory Pack Quantity	1	1	-	-	1	1	1	-	1

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