Intel
®
845GE/845PE Chipset
Datasheet
Intel
®
82845GE Graphics and Memory Controller Hub (GMCH) and
Intel
®
82845PE Memory Controller Hub (MCH)
October 2002
Document Number:
251924-001
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future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The 845GE/845PE chipset may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
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2
C is a two-wire communications bus/protocol developed by Philips. SMBus is a subset of the I
2
C bus/protocol and was developed by Intel.
Implementations of the I
2
C bus/protocol may require licenses from various entities, including Philips Electronics N.V. and North American Philips
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Copyright © 2002, Intel Corporation
2
Intel
®
82845GE/82845PE
Datasheet
Contents
1
Introduction
...........................................................................................................13
1.1
1.2
1.3
1.4
Terminology ...................................................................................................13
Related Documents .......................................................................................14
Intel
®
845GE / 845PE Chipset System Overview ..........................................15
Intel
®
82845GE GMCH / 82845PE MCH Overview .......................................17
1.4.1 Host Interface....................................................................................17
1.4.2 System Memory Interface .................................................................17
1.4.3 Hub Interface ....................................................................................17
1.4.4 Multiplexed AGP and Intel
®
DVO Port Interface ...............................18
1.4.5 Graphics Overview (Intel
®
82845GE only)........................................18
1.4.6 Display Interfaces (Intel
®
82845GE only) .........................................19
Host Interface Signals....................................................................................23
DDR SDRAM Interface ..................................................................................25
Hub Interface .................................................................................................26
AGP Interface Signals....................................................................................26
2.4.1 AGP Addressing Signals...................................................................26
2.4.2 AGP Flow Control Signals ................................................................27
2.4.3 AGP Status Signals ..........................................................................27
2.4.4 AGP Strobes .....................................................................................28
2.4.5 PCI Signals–AGP Semantics............................................................29
2.4.6 PCI Pins during PCI Transactions on AGP Interface ........................30
Multiplexed DVO Device Signal Interfaces (Intel
®
82845GE only) ................30
2.5.1 Intel
®
DVO Signal Name to AGP Signal Name Pin
Mapping (Intel
®
82845GE only) ........................................................32
Analog Display (Intel
®
82845GE only) ...........................................................33
Clocks, Reset, and Miscellaneous Signals ....................................................34
RCOMP, VREF, VSWING Signals.................................................................34
Power and Ground Signals ............................................................................35
Functional Straps ...........................................................................................36
Intel
®
(G)MCH Sequencing Requirements ....................................................36
Reset States ..................................................................................................37
2.12.1 Full and Warm Reset States .............................................................37
Register Terminology.....................................................................................39
Platform Configuration ...................................................................................40
Routing Configuration Accesses....................................................................41
3.3.1 Standard PCI Bus Configuration Mechanism ...................................42
3.3.2 PCI Bus #0 Configuration Mechanism ..............................................42
3.3.3 Primary PCI and Downstream Configuration Mechanism.................42
3.3.4 AGP/PCI_B Bus Configuration Mechanism ......................................42
I/O Mapped Registers ....................................................................................44
3.4.1 CONFIG_ADDRESS—Configuration Address Register ...................44
3.4.2 CONFIG_DATA—Configuration Data Register ................................45
Intel
®
(G)MCH Internal Device Registers ......................................................46
3.5.1 DRAM Controller/Host-Hub Interface Device Registers (Device 0) ..46
2
Signal Description
..............................................................................................21
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
3
Register Description
..........................................................................................39
3.1
3.2
3.3
3.4
3.5
Intel
®
82845GE/82845PE
Datasheet
3
3.5.2
VID—Vendor Identification Register (Device 0) ................ 48
DID—Device Identification Register (Device 0)................. 48
PCICMD—PCI Command Register (Device 0) ................. 49
PCISTS—PCI Status Register (Device 0) ......................... 50
RID—Revision Identification Register (Device 0) .............. 51
SUBC—Sub-Class Code Register (Device 0) ................... 51
BCC—Base Class Code Register (Device 0).................... 51
MLT—Master Latency Timer Register (Device 0) ............. 52
HDR—Header Type Register (Device 0) .......................... 52
APBASE—Aperture Base Configuration
Register (Device 0)............................................................ 53
3.5.1.11 SVID—Subsystem Vendor Identification
Register (Device 0)............................................................ 54
3.5.1.12 SID—Subsystem Identification Register (Device 0) .......... 54
3.5.1.13 CAPPTR—Capabilities Pointer Register (Device 0) ......... 54
3.5.1.14 AGPM—AGP Miscellaneous Configuration
Register (Device 0)............................................................ 55
3.5.1.15 GC—Graphics Control Register (Device 0)
(Intel
®
82845GE only) ....................................................... 56
3.5.1.16 DRB[0:3]—DRAM Row Boundary Register (Device 0) ..... 58
3.5.1.17 DRA—DRAM Row Attribute Register (Device 0) .............. 59
3.5.1.18 DRT—DRAM Timing Register (Device 0) ......................... 60
3.5.1.19 DRC—DRAM Controller Mode Register (Device 0) .......... 61
3.5.1.20 PAM[0:6]—Programmable Attribute Map Registers
(Device 0) .......................................................................... 62
3.5.1.21 FDHC—Fixed SDRAM Hole Control Register (Device 0) . 65
3.5.1.22 SMRAM—System Management RAM Control
Register (Device 0)............................................................ 65
3.5.1.23 ESMRAMC—Extended System Management RAM
Control Register (Device 0) ............................................... 66
3.5.1.24 ACAPID—AGP Capability Identifier Register (Device 0) .. 67
3.5.1.25 AGPSTAT—AGP Status Register (Device 0) ................... 67
3.5.1.26 AGPCMD—AGP Command Register (Device 0) .............. 68
3.5.1.27 AGPCTRL—AGP Control Register (Device 0) .................. 68
3.5.1.28 APSIZE—Aperture Size Register (Device 0) .................... 69
3.5.1.29 ATTBASE—Aperture Translation Table Register
(Device 0) .......................................................................... 69
3.5.1.30 AMTT—AGP MTT Control Register (Device 0)................. 70
3.5.1.31 LPTT—AGP Low Priority Transaction Timer
Register (Device 0)............................................................ 70
3.5.1.32 GMCHCFG—GMCH/MCH Configuration
Register (Device 0)............................................................ 71
3.5.1.33 ERRSTS—Error Status Register (Device 0) ..................... 72
3.5.1.34 ERRCMD—Error Command Register (Device 0).............. 73
3.5.1.35 SMICMD—SMI Command Register (Device 0) ................ 74
3.5.1.36 SCICMD—SCI Command Register (Device 0) ................. 74
3.5.1.37 SKPD—Scratchpad Data Register (Device 0) .................. 74
3.5.1.38 CAPREG—Capability Identification Register (Device 0) ... 74
Host-to-AGP Bridge Registers (Device 1)......................................... 75
3.5.2.1 VID1—Vendor Identification Register (Device 1) .............. 76
3.5.2.2 DID1—Device Identification Register (Device 1)............... 76
3.5.2.3 PCICMD1—PCI Command Register (Device 1) ............... 77
3.5.2.4 PCISTS1—PCI Status Register (Device 1)....................... 78
3.5.2.5 RID1—Revision Identification Register (Device 1) ............ 78
3.5.2.6 SUBC1—Sub-Class Code Register (Device 1) ................. 79
3.5.2.7 BCC1—Base Class Code Register (Device 1).................. 79
3.5.1.1
3.5.1.2
3.5.1.3
3.5.1.4
3.5.1.5
3.5.1.6
3.5.1.7
3.5.1.8
3.5.1.9
3.5.1.10
4
Intel
®
82845GE/82845PE
Datasheet
3.5.3
3.5.4
MLT1—Master Latency Timer Register (Device 1) ...........79
HDR1—Header Type Register (Device 1).........................80
PBUSN1—Primary Bus Number Register (Device 1) .......80
SBUSN1—Secondary Bus Number Register (Device 1)...80
SUBUSN1—Subordinate Bus Number Register
(Device 1) ..........................................................................81
3.5.2.13 SMLT1—Secondary Bus Master Latency Timer
Register (Device 1)............................................................81
3.5.2.14 IOBASE1—I/O Base Address Register (Device 1)............82
3.5.2.15 IOLIMIT1—I/O Limit Address Register (Device 1).............82
3.5.2.16 SSTS1—Secondary Status Register (Device 1) ...............83
3.5.2.17 MBASE1—Memory Base Address Register (Device 1) ....84
3.5.2.18 MLIMIT1—Memory Limit Address Register (Device 1) .....84
3.5.2.19 PMBASE1—Prefetchable Memory Base Address
Register (Device 1)............................................................85
3.5.2.20 PMLIMIT1—Prefetchable Memory Limit Address
Register (Device 1)............................................................85
3.5.2.21 BCTRL1—Bridge Control Register (Device 1) ..................86
3.5.2.22 ERRCMD1—Error Command Register (Device 1)............87
Integrated Graphics Device Registers (Device 2)
(Intel
®
82845GE only) .......................................................................88
3.5.3.1 VID2—Vendor Identification Register (Device 2) ..............89
3.5.3.2 DID2—Device Identification Register (Device 2)...............89
3.5.3.3 PCICMD2—PCI Command Register (Device 2) ...............90
3.5.3.4 PCISTS2—PCI Status Register (Device 2) .......................91
3.5.3.5 RID2—Revision Identification Register (Device 2) ............91
3.5.3.6 CC—Class Code Register (Device 2) ...............................92
3.5.3.7 CLS—Cache Line Size Register (Device 2) ......................92
3.5.3.8 MLT2—Master Latency Timer Register (Device 2) ...........92
3.5.3.9 HDR2—Header Type Register (Device 2).........................93
3.5.3.10 GMADR —Graphics Memory Range Address
Register (Device 2)............................................................93
3.5.3.11 MMADR—Memory Mapped Range Address
Register (Device 2)............................................................94
3.5.3.12 SVID2—Subsystem Vendor Identification
Register (Device 2)............................................................94
3.5.3.13 SID2—Subsystem Identification Register (Device 2) ........94
3.5.3.14 ROMADR—Video BIOS ROM Base Address
Registers (Device 2) ..........................................................95
3.5.3.15 CAPPOINT—Capabilities Pointer Register (Device 2)......95
3.5.3.16 INTRLINE—Interrupt Line Register (Device 2)..................95
3.5.3.17 INTRPIN—Interrupt Pin Register (Device 2) .....................96
3.5.3.18 MINGNT—Minimum Grant Register (Device 2) ................96
3.5.3.19 MAXLAT—Maximum Latency Register (Device 2)............96
3.5.3.20 PMCAPID—Power Management Capabilities ID
Register (Device 2)............................................................96
3.5.3.21 PMCAP—Power Management Capabilities
Register (Device 2)............................................................97
3.5.3.22 PMCS—Power Management Control/Status
Register (Device 2)............................................................97
Device 6 Registers ............................................................................98
3.5.4.1 DWTC—DRAM Write Throttling Control
Register (Device 6)............................................................98
3.5.4.2 DRTC—DRAM Read Throttling Control
Register (Device 6)............................................................99
3.5.2.8
3.5.2.9
3.5.2.10
3.5.2.11
3.5.2.12
Intel
®
82845GE/82845PE
Datasheet
5
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