CMOS SERIES, 8-BIT ENCODER, CDIP18, CERAMIC, DIP-18
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | CERAMIC, DIP-18 |
| 针数 | 18 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 其他特性 | LG_MAX |
| 系列 | CMOS |
| JESD-30 代码 | R-GDIP-T18 |
| 长度 | 23.24 mm |
| 逻辑集成电路类型 | ENCODER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 150 ns |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 15 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| MM74C922J | MM74C922N | MM74C922M | MM74C923N | MM74C923M | |
|---|---|---|---|---|---|
| 描述 | CMOS SERIES, 8-BIT ENCODER, CDIP18, CERAMIC, DIP-18 | CMOS SERIES, 8-BIT ENCODER, PDIP18, PLASTIC, DIP-18 | CMOS SERIES, 8-BIT ENCODER, PDSO20, PLASTIC, SOP-20 | CMOS SERIES, 9-BIT ENCODER, PDIP20, PLASTIC, DIP-20 | CMOS SERIES, 9-BIT ENCODER, PDSO20, PLASTIC, SOP-20 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP | DIP | SOIC | DIP | SOIC |
| 包装说明 | CERAMIC, DIP-18 | PLASTIC, DIP-18 | PLASTIC, SOP-20 | PLASTIC, DIP-20 | PLASTIC, SOP-20 |
| 针数 | 18 | 18 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Is Samacsys | N | N | N | N | N |
| 系列 | CMOS | CMOS | CMOS | CMOS | CMOS |
| JESD-30 代码 | R-GDIP-T18 | R-PDIP-T18 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 |
| 长度 | 23.24 mm | 21.78 mm | 12.8 mm | 26.075 mm | 12.8 mm |
| 逻辑集成电路类型 | ENCODER | ENCODER | ENCODER | ENCODER | ENCODER |
| 位数 | 8 | 8 | 8 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 18 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | SOP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 传播延迟（tpd） | 150 ns | 150 ns | 150 ns | 150 ns | 150 ns |
| 座面最大高度 | 5.08 mm | 5.08 mm | 2.65 mm | 5.08 mm | 2.65 mm |
| 最大供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 7.5 mm | 7.62 mm | 7.5 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
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