MAX1308_EC_ _ .................................................0°C to +75°C
MAX1308_EE_ _ ..............................................-40°C to +85°C
MAX1308_EA_ _ ............................................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(V
CC
= +5.0V ±10%, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
CC
= +5.0V and T
A
= +25°C.) (Note 1)
PARAMETER
DRIVER
V
CC
Supply-Voltage Range
Differential Driver Output
Change in Magnitude of
Differential Output Voltage
Driver Common-Mode Output
Voltage
Change in Magnitude of
Common-Mode Voltage
Input-High Voltage
Input-Low Voltage
Input Hysteresis
Input Current
Input Impedance First Transition
Input Current
SRL Input-High Voltage
SRL Input-Middle Voltage
SRL Input-Low Voltage
SRL Input Current
Output Leakage (Y and Z)
Full Duplex
I
O
SRL = V
CC
SRL = GND
DE = GND,
V
CC
= GND or V
CC
V
IN
= +12V
V
IN
= -7V
-100
-75
125
I
IN2
V
CC
R
L
= 100Ω (RS-422), Figure 1
V
OD
R
L
= 54Ω (RS-485), Figure 1
No load
ΔV
OD
V
OC
ΔV
OC
V
IH
V
IL
V
HYS
I
IN1
R
L
= 100Ω or 54Ω, Figure 1 (Note 2)
R
L
= 100Ω or 54Ω, Figure 1
R
L
= 100Ω or 54Ω, Figure 1 (Note 2)
DE, DI,
RE,
TXP, RXP, H/F
DE, DI,
RE,
TXP, RXP, H/F
DE, DI,
RE,
TXP, RXP, H/F
DE, DI,
RE
DE
TXP, RXP, H/F internal pulldown
1
10
V
CC
- 0.4
V
CC
x 0.3
V
CC
x 0.7
0.4
75
100
±1
10
40
3
0.8
V
CC
/ 2
4.5
3
2
5.5
V
CC
V
CC
V
CC
0.2
3
0.2
V
V
V
V
V
mV
µA
kΩ
µA
V
V
V
µA
µA
V
V
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
2
Maxim Integrated
MAX13080E–MAX13084E/
MAX13086E–MAX13089E
+5.0V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
DC ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +5.0V ±10%, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
CC
= +5.0V and T
A
= +25°C.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
0
≤
V
OUT
≤
+12V (Note 3)
-7V
≤
V
OUT
≤
V
CC
(Note 3)
Driver Short-Circuit Output
Current
I
OSD
0
≤
V
OUT
≤
+12V, +85°C
≤
T
A
≤
+125°C
(Note 3)
-7V
≤
V
OUT
≤
V
CC
, +85°C
≤
T
A
≤
+125°C
(Note 3)
Driver Short-Circuit Foldback
Output Current
Thermal-Shutdown Threshold
Thermal-Shutdown Hysteresis
Input Current (A and B)
RECEIVER
Receiver Differential Threshold
Voltage
Receiver Input Hysteresis
RO Output-High Voltage
RO Output-Low Voltage
Three-State Output Current at
Receiver
Receiver Input Resistance
Receiver Output Short-Circuit
Current
SUPPLY CURRENT
No load,
RE
= 0, DE = V
CC
Supply Current
Supply Current in Shutdown
Mode
ESD PROTECTION
Human Body Model
ESD Protection for Y, Z, A, and B
Contact Discharge
IEC 61000-4-2
±15
±6
kV
kV
I
CC
No load,
RE
= V
CC
, DE = V
CC
No load,
RE
= 0, DE = 0
I
SHDN
RE
= V
CC
, DE = GND
1.2
1.2
1.2
2.8
1.8
1.8
1.8
10
µA
mA
V
TH
ΔV
TH
V
OH
V
OL
I
OZR
R
IN
I
OSR
-7V
≤
V
CM
≤
+12V
V
A
+ V
B
= 0V
I
O
= -1mA
I
O
= 1mA
0
≤
V
O
≤
V
CC
-7V
≤
V
CM
≤
+12V
0V
≤
V
RO
≤
V
CC
96
±110
V
CC
- 0.6
0.4
±
1
-200
-125
15
-50
mV
mV
V
V
µA
kΩ
mA
I
OSDF
T
TS
T
TSH
I
A, B
DE = GND,
V
CC
= GND or V
CC
V
IN
= +12V
V
IN
= -7V
-100
(V
CC
- 1V)
≤
V
OUT
≤
+12V (Note 3)
-7V
≤
V
OUT
≤
+1V (Note 3)
175
15
125
MIN
40
-250
40
-270
20
-20
TYP
MAX
250
-40
270
-40
mA
°C
°C
µA
mA
UNITS
Maxim Integrated
3
MAX13080E–MAX13084E/
MAX13086E–MAX13089E
+5.0V, ±15kV ESD-Protected, Fail-Safe,
Hot-Swap, RS-485/RS-422 Transceivers
DRIVER SWITCHING CHARACTERISTICS
MAX13080E/MAX13081E/MAX13082E/MAX13089E WITH SRL = UNCONNECTED (250kbps)
(V
CC
= +5.0V ±10%, T
A
= T
MIN
to T
MAX
, unless otherwise noted. Typical values are at V
CC
= +5.0V and T
A
= +25°C.)
PARAMETER
Driver Propagation Delay
Driver Differential Output Rise or
Fall Time
Differential Driver Output Skew
|t
DPLH
- t
DPHL
|
Maximum Data Rate
Driver Enable to Output High
Driver Enable to Output Low
Driver Disable Time from Low
Driver Disable Time from High
Driver Enable from Shutdown to
Output High
Driver Enable from Shutdown to
Output Low
Time to Shutdown
t
DZH
t
DZL
t
DLZ
t
DHZ
Figure 4
Figure 5
Figure 5
Figure 4
SYMBOL
t
DPLH
t
DPHL
t
R ,
t
F
t
DSKEW
CONDITIONS
C
L
= 50pF, R
L
= 54Ω, Figures 2 and 3
C
L
= 50pF, R
L
= 54Ω, Figures 2 and 3
C
L
= 50pF, R
L
= 54Ω, Figures 2 and 3
250
2500
2500
100
100
5500
5500
50
340
700
MIN
350
350
400
TYP
MAX
1800
1800
1900
250
UNITS
ns
ns
ns
kbps
ns
ns
ns
ns
ns
ns
ns
t
DZH(SHDN)
Figure 4
t
DZL(SHDN)
Figure 5
t
SHDN
RECEIVER SWITCHING CHARACTERISTICS
MAX13080E/MAX13081E/MAX13082E/MAX13089E WITH SRL = UNCONNECTED (250kbps)
据外媒报道，萨里大学（University of Surrey）的研究人员开发出一种无需依赖GPS即可在人口密集的城市地区精确定位设备位置的人工智能系统。该系统可将定位误差从734米缩小到22米以内，这对于自动驾驶汽车和救援车辆等技术的发展意义重大。 图片来源： 萨里大学 在发表于《IEEE Robotics and Automation Letters》的论文中，研究人员介绍了PEn...[详细]
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