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IS61LF25618A-7.5TQI

产品描述SRAM 4Mb 256Kx18 7.5ns 3.3v I/O
产品类别存储    存储   
文件大小434KB,共25页
制造商ISSI(芯成半导体)
官网地址http://www.issi.com/
下载文档 详细参数 选型对比 全文预览

IS61LF25618A-7.5TQI概述

SRAM 4Mb 256Kx18 7.5ns 3.3v I/O

IS61LF25618A-7.5TQI规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称ISSI(芯成半导体)
零件包装代码QFP
包装说明TQFP-100
针数100
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
Factory Lead Time12 weeks
最长访问时间7.5 ns
其他特性FLOW-THROUGH ARCHITECTURE
最大时钟频率 (fCLK)117 MHz
I/O 类型COMMON
JESD-30 代码R-PQFP-G100
JESD-609代码e0
长度20 mm
内存密度4718592 bit
内存集成电路类型CACHE SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量100
字数262144 words
字数代码256000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织256KX18
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装等效代码QFP100,.63X.87
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源2.5/3.3,3.3 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.035 A
最小待机电流3.14 V
最大压摆率0.16 mA
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式GULL WING
端子节距0.65 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度14 mm
Base Number Matches1

文档预览

下载PDF文档
IS61(64)LF12832A  IS64VF12832A
IS61(64)LF12836A  IS61(64)VF12836A
IS61(64)LF25618A  IS61(64)VF25618A
128K x 32, 128K x 36, 256K x 18 
4 Mb SYNCHRONOUS FLOW-THROUGH STATIC RAM
SEPTEBMER 2011
FEATURES
• Internal self-timed write cycle
• Individual Byte Write Control and Global Write
• Clock controlled, registered address, data and
control
• Burst sequence control using MODE input
• Three chip enable option for simple depth expan-
sion and address pipelining
• Common data inputs and data outputs
• Auto Power-down during deselect
• Single cycle deselect
• Snooze MODE for reduced-power standby
• Power Supply
LF: V
dd
3.3V + 5%,
V
ddq
3.3V/2.5V + 5%
VF: V
dd
2.5V -5% +10%,
V
ddq
2.5V -5% +10%
• JEDEC 100-Pin TQFP, 119-pin PBGA, and 165-
pin PBGA packages
• Automotive temperature available
• Lead-free available
LF/VF12836A and IS61(64)LF/VF25618A are high-speed,
low-power synchronous static RAMs designed to provide
burstable, high-performance memory for communication
and networking applications. The IS61(64)LF12832A is
organized as 131,072 words by 32 bits. The IS61(64)LF/
VF12836A is organized as 131,072 words by 36 bits. The
IS61(64)LF/VF25618A is organized as 262,144 words by
18 bits. Fabricated with
ISSI
's advanced CMOS technol-
ogy, the device integrates a 2-bit burst counter, high-speed
SRAM core, and high-drive capability outputs into a single
monolithic circuit. All synchronous inputs pass through
registers controlled by a positive-edge-triggered single
clock input.
Write cycles are internally self-timed and are initiated by
the rising edge of the clock input. Write cycles can be one
to four bytes wide as controlled by the write control inputs.
Separate byte enables allow individual bytes to be written.
Byte write operation is performed by using byte write en-
able (BWE) input combined with one or more individual
byte write signals (BWx). In addition, Global Write (GW)
is available for writing all bytes at one time, regardless of
the byte write controls.
Bursts can be initiated with either ADSP (Address Status
Processor) or ADSC (Address Status Cache Controller)
input pins. Subsequent burst addresses can be gener-
ated internally and controlled by the ADV (burst address
advance) input pin.
The mode pin is used to select the burst sequence order,
Linear burst is achieved when this pin is tied LOW. Interleave
burst is achieved when this pin is tied HIGH or left floating.
DESCRIPTION
The
ISSI
IS61(64)LF12832A, IS64VF12832A, IS61(64)
FAST ACCESS TIME
Symbol 
t
kq
t
kc
Parameter 
Clock Access Time
Cycle Time
Frequency
-6.5 
6.5
7.5
133
-7.5 
7.5
8.5
117
Units
ns
ns
MHz
Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-
est version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason-
ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.
Rev.  G
09/01/2011
1

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