Analog to Digital Converters - ADC Dual 16-Bit 80 MSPS 1.8V
| 参数名称 | 属性值 |
| Brand Name | Analog Devices Inc |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC64,.35SQ,20 |
| 针数 | 64 |
| 制造商包装代码 | CP-64-4 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.5.A.5 |
| Samacsys Description | ADC |
| 最大模拟输入电压 | 2 V |
| 最小模拟输入电压 | |
| 最长转换时间 | 0.0125 µs |
| 转换器类型 | ADC, FLASH METHOD |
| JESD-30 代码 | S-XQCC-N64 |
| JESD-609代码 | e3 |
| 长度 | 9 mm |
| 最大线性误差 (EL) | 0.0099% |
| 湿度敏感等级 | 3 |
| 模拟输入通道数量 | 2 |
| 位数 | 16 |
| 功能数量 | 1 |
| 端子数量 | 64 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | OFFSET BINARY, 2\'S COMPLEMENT BINARY, GRAY CODE |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC64,.35SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.8 V |
| 认证状态 | Not Qualified |
| 采样速率 | 80 MHz |
| 采样并保持/跟踪并保持 | TRACK |
| 座面最大高度 | 1 mm |
| 标称供电电压 | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 9 mm |
| AD9269BCPZRL7-80 | AD9269BCPZRL7-65 | AD9269-80EBZ | AD9269-20EBZ | AD9269-65EBZ | AD9269BCPZRL7-40 | AD9269BCPZ-65 | |
|---|---|---|---|---|---|---|---|
| 描述 | Analog to Digital Converters - ADC Dual 16-Bit 80 MSPS 1.8V | Analog to Digital Converters - ADC Dual 16-Bit 65 MSPS 1.8V | Data Conversion IC Development Tools AD9269 Eval Brd 80 MSPS | Data Conversion IC Development Tools AD9269 Eval Brd 20 MSPS | Data Conversion IC Development Tools AD9269 Eval Brd 65 MSPS | Analog to Digital Converters - ADC Dual 16-Bit 40 MSPS 1.8V | Analog to Digital Converters - ADC Dual 16-Bit 65 MSPS 1.8V |
| Brand Name | Analog Devices Inc | Analog Devices Inc | - | - | - | Analog Devices Inc | Analog Devices Inc |
| 是否无铅 | 含铅 | 含铅 | - | - | - | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | - | - | - | 符合 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | - | - | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | QFN | QFN | - | - | - | QFN | QFN |
| 包装说明 | HVQCCN, LCC64,.35SQ,20 | HVQCCN, | - | - | - | HVQCCN, LCC64,.35SQ,20 | HVQCCN, |
| 针数 | 64 | 64 | - | - | - | 64 | 64 |
| 制造商包装代码 | CP-64-4 | CP-64-4 | - | - | - | CP-64-4 | CP-64-4 |
| Reach Compliance Code | compliant | compliant | - | - | - | compliant | compliant |
| ECCN代码 | 3A001.A.5.A.5 | 3A991.C.4 | - | - | - | 3A991.C.4 | 3A991.C.4 |
| Samacsys Description | ADC | ADC | - | - | - | ADC | Analog Devices AD9269BCPZ-65, 16 bit Serial ADC, Dual Differential Input, 64-Pin LFCSP |
| 最大模拟输入电压 | 2 V | 2 V | - | - | - | 2 V | 2 V |
| 最长转换时间 | 0.0125 µs | 0.0153 µs | - | - | - | 0.025 µs | 0.0153 µs |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | - | - | - | ADC, FLASH METHOD | ADC, FLASH METHOD |
| JESD-30 代码 | S-XQCC-N64 | S-XQCC-N64 | - | - | - | S-XQCC-N64 | S-XQCC-N64 |
| JESD-609代码 | e3 | e3 | - | - | - | e3 | e3 |
| 长度 | 9 mm | 9 mm | - | - | - | 9 mm | 9 mm |
| 最大线性误差 (EL) | 0.0099% | 0.0099% | - | - | - | 0.0084% | 0.0099% |
| 湿度敏感等级 | 3 | 3 | - | - | - | 3 | 3 |
| 模拟输入通道数量 | 2 | 2 | - | - | - | 2 | 2 |
| 位数 | 16 | 16 | - | - | - | 16 | 16 |
| 功能数量 | 1 | 1 | - | - | - | 1 | 1 |
| 端子数量 | 64 | 64 | - | - | - | 64 | 64 |
| 最高工作温度 | 85 °C | 85 °C | - | - | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | - | - | -40 °C | -40 °C |
| 输出位码 | OFFSET BINARY, 2\'S COMPLEMENT BINARY, GRAY CODE | OFFSET BINARY, 2\'S COMPLEMENT BINARY, GRAY CODE | - | - | - | OFFSET BINARY, 2\'S COMPLEMENT BINARY, GRAY CODE | OFFSET BINARY, 2\'S COMPLEMENT BINARY, GRAY CODE |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | - | - | - | PARALLEL, WORD | PARALLEL, WORD |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | - | - | - | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVQCCN | HVQCCN | - | - | - | HVQCCN | HVQCCN |
| 封装形状 | SQUARE | SQUARE | - | - | - | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | - | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | - | - | - | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | - | - | - | Not Qualified | Not Qualified |
| 采样速率 | 80 MHz | 65 MHz | - | - | - | 40 MHz | 65 MHz |
| 采样并保持/跟踪并保持 | TRACK | TRACK | - | - | - | TRACK | TRACK |
| 座面最大高度 | 1 mm | 1 mm | - | - | - | 1 mm | 1 mm |
| 标称供电电压 | 1.8 V | 1.8 V | - | - | - | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | - | - | - | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | - | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | MATTE TIN | - | - | - | MATTE TIN | Matte Tin (Sn) |
| 端子形式 | NO LEAD | NO LEAD | - | - | - | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | - | - | - | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | - | - | - | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | - | - | - | 30 | 30 |
| 宽度 | 9 mm | 9 mm | - | - | - | 9 mm | 9 mm |
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