c. Maximum under steady state conditions is 81 °C/W.
d. Package limited.
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
g. Based on T
C
= 25 °C.
S15-1032-Rev. B, 04-May-15
Document Number: 65164
1
For technical questions, contact:
pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Si7617DN
www.vishay.com
Vishay Siliconix
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
PARAMETER
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
SYMBOL
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
TEST CONDITIONS
V
GS
= 0 V, I
D
= -250 μA
I
D
= -250 μA
V
DS
= V
GS
, I
D
= -250 μA
V
DS
= 0 V, V
GS
= ± 25 V
V
DS
= -30 V, V
GS
= 0 V
V
DS
= -30 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≥
-10 V, V
GS
= -10 V
V
GS
= -10 V, I
D
= -13.9 A
V
GS
= -4.5 V, I
D
= -10.3 A
V
DS
= -15 V, I
D
= -13.9 A
MIN.
-30
-
-
-1.2
-
-
-
-30
-
-
-
-
TYP.
-
-25
4.7
-
-
-
-
-
0.0103
0.0185
35
1800
370
312
39
20.5
6
11
2
11
9
32
9
40
43
30
11
MAX.
-
-
-
-2.5
± 100
-1
-5
-
0.0123
0.0222
-
-
-
-
59
31
-
-
4
22
18
50
18
60
65
45
22
UNIT
V
mV/°C
V
nA
μA
A
Ω
S
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode
Current
Pulse Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
V
DS
= -15 V, V
GS
= 0 V, f = 1 MHz
V
DS
= -15 V, V
GS
= -10 V, I
D
= -13.9 A
V
DS
= -15 V, V
GS
= -4.5 V, I
D
= -13.9 A
f = 1 MHz
V
DD
= -15 V, R
L
= 1.35
Ω
I
D
≅
-11.1 A, V
GEN
= -10 V, R
g
= 1
Ω
-
-
-
-
-
-
0.4
-
-
-
-
-
pF
nC
Ω
ns
V
DD
= -15 V, R
L
= 1.35
Ω
I
D
≅
-11.1 A, V
GEN
= -4.5 V, R
g
= 1
Ω
-
-
-
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
T
C
= 25 °C
-
-
-
-
-0.8
33
30
18
16
-35
-60
-1.2
50
45
-
-
A
V
ns
nC
ns
I
S
= -11.1 A, V
GS
= 0 V
I
F
= -11.1 A, dI/dt = 100 A/μs,
T
J
= 25 °C
-
-
-
-
-
Notes
a. Pulse test; pulse width
≤
300 μs, duty cycle
≤
2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
S15-1032-Rev. B, 04-May-15
Document Number: 65164
2
For technical questions, contact:
pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Si7617DN
www.vishay.com
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
60
V
GS
= 10 V thru 5 V
0.8
45
I
D
- Drain Current (A)
V
GS
= 4 V
30
I
D
- Drain Current (A)
0.6
T
C
= 125 °C
0.4
T
C
= 25 °C
0.2
T
C
= - 55 °C
0
0
1
2
3
4
V
DS
- Drain-to-Source Voltage (V)
0.0
0
1
2
3
V
GS
- Gate-to-Source Voltage (V)
4
1.0
Vishay Siliconix
15
V
GS
= 3 V
Output Characteristics
0.030
Transfer Characteristics
3000
C
iss
0.024
R
DS(on)
- On-Resistance (Ω)
C - Capacitance (pF)
V
GS
= 4.5 V
0.018
2400
1800
0.012
V
GS
= 10 V
0.006
1200
C
oss
600
C
rss
0.000
0
15
30
45
I
D
- Drain Current (A)
60
0
0
5
10
15
20
25
V
DS
- Drain-to-Source Voltage (V)
30
On-Resistance vs. Drain Current
1.8
R
DS(on)
- On-Resistance (Normalized)
I
D
= 13.9 A
V
GS
- Gate-to-Source Voltage (V)
8
V
DS
= 8 V
6
V
DS
= 15 V
4
V
DS
= 24 V
2
I
D
= 13.9 A
Capacitance
10
V
GS
= 4.5 V
1.5
V
GS
= 10 V
1.2
0.9
0
0
10
20
30
Q
g
- Total Gate Charge (nC)
40
0.6
- 50
- 25
0
25
50
75
100
125
150
T
J
- Junction Temperature (°C)
Gate Charge
S15-1032-Rev. B, 04-May-15
On-Resistance vs. Junction Temperature
Document Number: 65164
3
For technical questions, contact:
pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Si7617DN
www.vishay.com
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
100
0.04
Vishay Siliconix
R
DS(on)
- On-Resistance (Ω)
I
S
- SourceCurrent(A)
0.03
10
0.02
T
J
= 125 °C
T
J
= 150 °C
1
T
J
= 25 °C
0.01
T
J
= 25 °C
0.1
0.0
0.2
0.4
0.6
0.8
1.0
1.2
V
SD
- Source-to-Drain Voltage (V)
0
2
4
6
8
10
V
GS
- Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
2.2
I
D
= 250 µA
40
1.9
Power (W)
30
50
On-Resistance vs. Gate-to-Source Voltage
V
GS(th)
(V)
1.6
20
1.3
10
1.0
- 50
- 25
0
25
50
75
100
125
150
0
0.01
0.1
1
Time (s)
10
100
1000
T
J
- Temperature (°C)
Threshold Voltage
100
Limited by R
DS(on)
*
10
I
D
- Drain Current (A)
Single Pulse Power, Junction-to-Ambient
100 µs
1 ms
10 ms
1
100 ms
1s
10 s
DC
T
A
= 25 °C
Single Pulse
0.01
0.1
BVDSS
Limited
0.1
1
10
100
V
DS
- Drain-to-Source Voltage (V)
* V
GS
> minimum V
GS
at which R
DS(on)
is specified
Safe Operating Area
S15-1032-Rev. B, 04-May-15
Document Number: 65164
4
For technical questions, contact:
pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Si7617DN
www.vishay.com
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
60
Vishay Siliconix
45
I
D
- Drain Current (A)
Package Limited
30
15
0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
Current Derating*
75
2.0
60
1.5
Power (W)
45
Power (W)
0
25
50
75
100
125
150
1.0
30
0.5
15
0
T
C
- Case Temperature (°C)
0.0
0
25
50
75
100
125
150
T
A
- Ambient Temperature (°C)
Power Derating, Junction-to-Case
Power Derating, Junction-to-Ambient
* The power dissipation P
D
is based on T
J
(max.) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the
package limit.
S15-1032-Rev. B, 04-May-15
Document Number: 65164
5
For technical questions, contact:
pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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