Operating Temperature Range .........................-40°C to +125°C
Storage Temperature Range .............................-65°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Note 1:
Continuous output current is limited by the power dissipation of the package.
*As per JEDEC51 standard.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 2)
SOT23
Junction-to-Case Thermal Resistance (θ
JC
)......................75°C/W
TDFN
Junction-to-Case Thermal Resistance (θ
JC
).......................8.5°C/W
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V+ = +12V, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 3)
PARAMETER
POWER SUPPLY
V+ Operating Range
V+ Undervoltage Lockout
V+ Undervoltage Lockout
Hysteresis
V+ Undervoltage Lockout to
Output Delay Time
V+ Supply Current
n-CHANNEL OUTPUT
Driver Output Resistance—
Pulling Down (MAX5048AAUT/
MAX5048BAUT)
V
V+
= +10V,
I
N-OUT
= -100mA
V
V+
= +4.5V,
I
N-OUT
= -100mA
V
V+
= +10V,
I
N-OUT
= -100mA
V
V+
= +4.5V,
I
N-OUT
= -100mA
T
A
= +25°C
T
A
= +125°C
T
A
= +25°C
T
A
= +125°C
T
A
= +25°C
T
A
= +125°C
T
A
= +25°C
T
A
= +125°C
0.23
0.38
0.24
0.40
0.31
0.46
0.32
0.48
0.32
0.43
0.34
0.47
0.34
0.51
0.36
0.55
Ω
Ω
I+
V+ rising
IN+ = IN- = V+
V+
UVLO
V+ rising
4.0
3.25
3.6
400
300
0.95
1.5
12.6
4.00
V
V
mV
ns
mA
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
R
ON-N
Driver Output Resistance—
Pulling Down (MAX5048AATT/
MAX5048BATT)
R
ON-N
2
Maxim Integrated
MAX5048
7.6A, 12ns, SOT23/TDFN, MOSFET Driver
ELECTRICAL CHARACTERISTICS (continued)
(V+ = +12V, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 3)
PARAMETER
Power-Off Pulldown Resistance
Power-Off Pulldown Clamp
Voltage
Output Leakage Current
Peak Output Current (Sinking)
p-CHANNEL OUTPUT
Driver Output Resistance—
Pulling Up (MAX5048AAUT/
MAX5048BAUT)
V
V+
= +10V,
I
P-OUT
= 50mA
R
ON-P
V
V+
= +4.5V,
I
P-OUT
= 50mA
V
V+
= +10V,
I
P-OUT
= 50mA
V
V+
= +4.5V,
I
P-OUT
= 50mA
P_OUT = 0
C
L
= 10,000pF
MAX5048A
MAX5048B
MAX5048A
MAX5048B
MAX5048A
MAX5048B
V
IN_
= V+ or 0
C
IN
C
L
= 1000pF
Rise Time
t
R
C
L
= 5000pF
C
L
= 10,000pF
C
L
= 1000pF
Fall Time
Turn-On Propagation Delay Time
Turn-Off Propagation Delay Time
Break-Before-Make Time
t
F
t
D-ON
t
D-OFF
C
L
= 5000pF
C
L
= 10,000pF
Figure 1, C
L
= 1000pF (Note 4)
Figure 1, C
L
= 1000pF (Note 4)
7
7
1.6
0.68
0.001
2.5
8
45
82
3.2
7.5
12.5
12
12
2.5
25
25
ns
ns
ns
ns
ns
10
0.67 x V+
2.4
0.33 x V+
0.8
T
A
= +25°C
T
A
= +125°C
T
A
= +25°C
T
A
= +125°C
T
A
= +25°C
T
A
= +125°C
T
A
= +25°C
T
A
= +125°C
2.00
2.85
2.20
3.10
2.08
2.93
2.28
3.18
0.001
1.3
3.00
4.30
3.30
4.70
3.08
4.38
3.38
4.78
10
µA
A
Ω
Ω
I
LK-N
I
PK-N
SYMBOL
CONDITIONS
V+ = 0 or unconnected, I
N-OUT
= -10mA,
T
A
= +25°C
V+ = 0 or unconnected, I
N-OUT
= -10mA,
T
A
= +25°C
N_OUT = V+
C
L
= 10,000pF
MIN
TYP
3.3
0.85
6.85
7.6
MAX
10
1.0
20
UNITS
Ω
V
µA
A
Driver Output Resistance—
Pulling Up (MAX5048AATT/
MAX5048BATT)
Output Leakage Current
Peak Output Current (Sourcing)
LOGIC INPUT
Logic 1 Input Voltage
Logic 0 Input Voltage
Logic-Input Hysteresis
Logic-Input Current
Input Capacitance
R
ON-P
I
LK-P
I
PK-P
V
IH
V
IL
V
HYS
V
V
V
µA
pF
SWITCHING CHARACTERISTICS FOR V+ = +10V
Maxim Integrated
3
MAX5048
7.6A, 12ns, SOT23/TDFN, MOSFET Driver
ELECTRICAL CHARACTERISTICS (continued)
(V+ = +12V, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
PARAMETER
SYMBOL
C
L
= 1000pF
Rise Time
t
R
C
L
= 5000pF
C
L
= 10,000pF
C
L
= 1000pF
Fall Time
Turn-On Propagation Delay Time
Turn-Off Propagation Delay Time
Break-Before-Make Time
t
F
t
D-ON
t
D-OFF
C
L
= 5000pF
C
L
= 10,000pF
Figure 1, C
L
= 1000pF (Note 4)
Figure 1, C
L
= 1000pF (Note 4)
8
8
CONDITIONS
MIN
TYP
12
41
74
3.0
7.0
11.3
14
14
4.2
27
27
ns
ns
ns
ns
ns
MAX
UNITS
SWITCHING CHARACTERISTICS FOR V+ = +4.5V
Note 3:
All DC specifications are 100% tested at T
A
= +25°C. Specifications over -40°C to +125°C are guaranteed by design.
当今的计算机外部设备，都在追求高速度和高通用性。为了满足用户的需求，以Intel为首的七家公司于1994年推出了USB（Universal Serial Bus，通用串行总线）总线协议，专用于低、中速的计算机外设。目前，USB端口已成为微机主板的标准端口；而在不久的将来，所有的微机外设，包括键盘、鼠标、显示器、打印机、数字相机、扫描仪和游戏柄等等，都将通过USB与主机相连。
...[详细]
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