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IS42RM16200C-6BLI-TR

产品描述DRAM 32M, 2.5V, Mobile SDRAM, 2Mx16, 166Mhz, 54 ball BGA (8mmx8mm) RoHS, IT, T&R
产品类别存储   
文件大小506KB,共33页
制造商ISSI(芯成半导体)
官网地址http://www.issi.com/
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IS42RM16200C-6BLI-TR概述

DRAM 32M, 2.5V, Mobile SDRAM, 2Mx16, 166Mhz, 54 ball BGA (8mmx8mm) RoHS, IT, T&R

IS42RM16200C-6BLI-TR规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
ISSI(芯成半导体)
产品种类
Product Category
DRAM
类型
Type
SDRAM Mobile
Data Bus Width16 bit
Organization2 M x 16
封装 / 箱体
Package / Case
BGA-54
Memory Size32 Mbit
Maximum Clock Frequency166 MHz
Access Time5.5 ns
电源电压-最大
Supply Voltage - Max
3 V
电源电压-最小
Supply Voltage - Min
2.3 V
Supply Current - Max50 mA
最小工作温度
Minimum Operating Temperature
- 40 C
最大工作温度
Maximum Operating Temperature
+ 85 C
安装风格
Mounting Style
SMD/SMT
工作电源电压
Operating Supply Voltage
2.5 V
工厂包装数量
Factory Pack Quantity
2500
单位重量
Unit Weight
0.003517 oz

文档预览

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IS42SM16200C
IS42RM16200C
IS42VM16200C
1M
x
16Bits
x
2Banks Low Power Synchronous DRAM
Description
These IS42SM/RM/VM16200C are low power 33,554,432 bits CMOS Synchronous DRAM organized as 2 banks of 1,048,576 words x 16
bits. These products are offering fully synchronous operation and are referenced to a positive edge of the clock. All inputs and outputs
are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve high bandwidth. All input
and output voltage levels are compatible with LVCMOS.
Features
JEDEC standard 3.3V, 2.5V, 1.8V power supply.
• Auto refresh and self refresh.
• All pins are compatible with LVCMOS interface.
• 4K refresh cycle / 64ms.
• Programmable Burst Length and Burst Type.
- 1, 2, 4, 8 or Full Page for Sequential Burst.
- 4 or 8 for Interleave Burst.
• Programmable CAS Latency : 2,3 clocks.
• Programmable Driver Strength Control
- Full Strength or 1/2, 1/4, 1/8 of Full Strength
• Deep Power Down Mode.
• All inputs and outputs referenced to the positive edge of the
system clock.
• Data mask function by DQM.
• Internal dual banks operation.
• Burst Read Single Write operation.
• Special Function Support.
- PASR(Partial Array Self Refresh)
- Auto TCSR(Temperature Compensated Self Refresh)
• Automatic precharge, includes CONCURRENT Auto Precharge
Mode and controlled Precharge.
Copyright © 2010 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its
products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services
described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information
and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or
effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to
its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Rev. A | Mar. 2011
www.issi.com
- dram@issi.com
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