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MAX13013EBT-T

产品描述Translation - Voltage Levels +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators
产品类别模拟混合信号IC    驱动程序和接口   
文件大小461KB,共18页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
下载文档 详细参数 选型对比 全文预览

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MAX13013EBT-T概述

Translation - Voltage Levels +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators

MAX13013EBT-T规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码BGA
包装说明UCSP-6
针数6
Reach Compliance Codenot_compliant
ECCN代码EAR99
Factory Lead Time1 week
接口集成电路类型INTERFACE CIRCUIT
JESD-30 代码R-PBGA-B6
JESD-609代码e0
长度1.98 mm
湿度敏感等级1
功能数量1
端子数量6
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码VFBGA
封装等效代码BGA6,2X3,20
封装形状RECTANGULAR
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)240
电源1.8/3.3 V
认证状态Not Qualified
座面最大高度0.67 mm
最大供电电压3.6 V
最小供电电压1.65 V
标称供电电压2.5 V
电源电压1-最大3.2 V
电源电压1-分钟1.2 V
电源电压1-Nom1.8 V
表面贴装YES
技术BICMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距0.5 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度1.75 mm
Base Number Matches1

文档预览

下载PDF文档
19-3266; Rev 2; 12/04
+1.2V to +3.6V, 0.1µA, 100Mbps,
Single-/Dual-/Quad-Level Translators
General Description
The MAX13013/MAX13014/MAX3023 single-/dual-/quad-
level translators provide the level shifting necessary to
allow 100Mbps data transfer in a multivoltage system.
Externally applied voltages, V
CC
and V
L
, set the logic
levels on either side of the device. Logic signals present
on the V
L
side of the device appear as a higher voltage
logic signal on the V
CC
side of the device, and vice-
versa.
The MAX13013 single-, the MAX13014 dual-, and the
MAX3023 (UCSP™ package) quad-level translators fea-
ture an enable (EN) input. The MAX3023 (TSSOP pack-
age) quad-level translator features EN and
EN
inputs.
When disabled, each device places all inputs/outputs
on both sides in tri-state and reduces the V
CC
supply
current to 0.03µA, and the V
L
supply current to 0.1µA.
These devices operate at a guaranteed 100Mbps data
rate for V
L
> 1.8V.
The MAX13013/MAX13014/MAX3023 accept a +1.65V
to +3.6V V
CC
voltage and a +1.2V to (V
CC
- 0.4V) V
L
voltage, making them ideal for data transfer between
low-voltage ASICs/programmable logic devices (PLDs)
and higher voltage systems. The MAX13013 is avail-
able in 3 x 2 UCSP and 6-pin SC70 packages. The
MAX13014 is available in 3 x 3 UCSP and 8-pin SOT23
packages. The MAX3023 is available in 4 x 3 UCSP
and 14-pin TSSOP packages. All devices operate over
the extended -40°C to +85°C temperature range.
Features
100Mbps Guaranteed Data Rate
Bidirectional Level Translation
MAX13013 (Single)
MAX13014 (Dual)
MAX3023 (Quad)
V
L
Operation Down to +1.2V
Ultra-Low 0.1µA Supply Current When Disabled
Low-Quiescent Current (0.1µA)
UCSP, SC70, SOT23, and TSSOP Packages
MAX13013/MAX13014/MAX3023
Pin Configurations
TOP VIEW
V
CC
1
6
EN
A
V
CC
GND 2
I/O V
CC
1
GND
1
2
3
MAX13013
5
V
L
B
MAX13013
V
L
I/O V
L
1
EN
I/O V
CC
1 3
4
I/O V
L
1
SC70
3 x 2 UCSP
TOP VIEW
(BUMPS ON BOTTOM OF DIE)
Typical Operating Circuit
+1.8V
0.1µF
0.1µF
+3.3V
Applications
CMOS Logic-Level Translation
Low-Voltage ASIC Level Translation
Cell Phones
SPI™, MICROWIRE™ Level Translation
Portable POS Systems
Portable Communication Devices
GPS
Telecommunications Equipment
+1.8V
SYSTEM
CONTROLLER
CLK
DATA
GND
V
L
V
CC
+3.3V
SYSTEM
MAX13014
I/O V
L
1
I/O V
L
2
I/O V
CC
1
I/O V
CC
2
GND
CLK
DATA
GND
Ordering Information/Selector Guide
PART
MAX13013EXT
TEMP RANGE
-40°C to +85°C
PIN-PACKAGE
6 SC70
PACKAGE
CODE
TOP
MARK
ACD
NUMBER OF
V
L
V
CC
TRANSLATORS
1
Number of
V
CC
V
L
TRANSLATORS
1
EN
EN
MICROWIRE is a trademark of National Semiconductor Corp.
SPI is a trademark of Motorola, Inc.
UCSP is a trademark of Maxim Integrated Products, Inc.
Pin Configurations continued at end of data sheet.
Ordering Information/Selector Guide continued at end of
data sheet.
1
________________________________________________________________
Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX13013EBT-T相似产品对比

MAX13013EBT-T MAX13002EEUE MAX13013EXT-T MAX13001EEUE MAX13014EBL+T
描述 Translation - Voltage Levels +1.2V to +3.6V, 0.1A, 100Mbps, Single-/Dual-/Quad-Level Translators Translation - Voltage Levels Ultra-Low-Voltage Level Translators Translation - Voltage Levels +1.2V to 3.6V, 0.1microamps, 100Mbps, Single-/Dual-/Quad-Level Translators Translation - Voltage Levels Ultra-Low-Voltage Level Translators Interface Circuit, BICMOS, PBGA9, UCSP-9
是否无铅 含铅 含铅 含铅 含铅 不含铅
是否Rohs认证 不符合 不符合 不符合 不符合 符合
零件包装代码 BGA TSSOP SOIC TSSOP BGA
包装说明 UCSP-6 4.40 MM, MO-153AB, TSSOP-16 SC-70, 6 PIN 4.40 MM, MO-153AB, TSSOP-16 VFBGA,
针数 6 16 6 16 9
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant compliant
接口集成电路类型 INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 代码 R-PBGA-B6 R-PDSO-G16 R-PDSO-G6 R-PDSO-G16 S-PBGA-B9
JESD-609代码 e0 e0 e4 e0 e1
长度 1.98 mm 5 mm 2 mm 5 mm 1.52 mm
功能数量 1 6 1 6 2
端子数量 6 16 6 16 9
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VFBGA TSSOP TSSOP TSSOP VFBGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度) 240 NOT SPECIFIED 245 NOT SPECIFIED 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 0.67 mm 1.1 mm 1.1 mm 1.1 mm 0.67 mm
最大供电电压 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 1.65 V 1.5 V 1.65 V 1.5 V 1.65 V
标称供电电压 2.5 V 1.65 V 2.5 V 1.65 V 2.5 V
表面贴装 YES YES YES YES YES
技术 BICMOS BICMOS BICMOS BICMOS BICMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL GULL WING GULL WING GULL WING BALL
端子节距 0.5 mm 0.65 mm 0.65 mm 0.65 mm 0.5 mm
端子位置 BOTTOM DUAL DUAL DUAL BOTTOM
处于峰值回流温度下的最长时间 20 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 1.75 mm 4.4 mm 1.25 mm 4.4 mm 1.52 mm
厂商名称 Maxim(美信半导体) - Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体)
湿度敏感等级 1 - 1 - 1
封装等效代码 BGA6,2X3,20 TSSOP16,.25 TSSOP6,.08 TSSOP16,.25 -
电源 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V 1.8/3.3 V -
电源电压1-最大 3.2 V - 3.2 V - 3.2 V
电源电压1-分钟 1.2 V - 1.2 V - 1.2 V
电源电压1-Nom 1.8 V - 1.8 V - 1.8 V

 
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