STPS10L40C
Low drop power Schottky rectifier
Datasheet - production data
A1
K
Description
Dual center tap Schottky rectifier suited for switch
mode power supply and high frequency DC to
DC converters.
Packaged either in TO-220AB and D
2
PAK, this
device is especially intended for use in low
voltage, high frequency inverters, free wheeling
and polarity protection applications.
K
A1
A2
A2
K
Table 1: Device summary
Symbol
I
F(AV)
Value
2x5A
40 V
150 °C
0.36 V
TO-220AB
K
K
V
RRM
T
j
(max.)
V
F
(typ.)
A2
A2
A1
D2PAK
A1
Features
Low forward voltage drop meaning very
small conduction losses
Low dynamic losses as a result of the
schottky barrier
Avalanche capability specified
ECOPACK
®
2 compliant component for
D²PAK on demand
April 2016
DocID9433 Rev 7
1/12
www.st.com
This is information on a product in full production.
Characteristics
STPS10L40C
1
Characteristics
Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified)
Symbol
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
P
ARM
T
stg
T
j
Notes:
(1)
(dP
tot
/dT
j
)
Parameter
Repetitive peak reverse voltage
Forward rms current
Average forward current δ = 0.5,
square wave
Surge non repetitive forward current
Repetitive peak avalanche power
Storage temperature range
Maximum operating junction temperature
(1)
Per diode
T
C
= 140 °C
Per device
Value
40
20
5
Unit
V
A
A
10
150
190
-65 to +150
+150
A
W
°C
°C
t
p
= 10 ms sinusoidal
t
p
= 10 µs, T
j
= 125 °C
< (1/R
th(j-a)
) condition to avoid thermal runaway for a diode on its own heatsink.
Table 3: Thermal parameters
Symbol
R
th(j-c)
R
th(c)
Junction to case
Coupling
Parameter
Per diode
Total
-
Value
3.0
1.7
0.35
Unit
°C/W
°C/W
When the diodes 1 and 2 are used simultaneously:
ΔT
j (diode1)
= P
(diode1)
x R
th(j-c)
(per diode) + P
(diode2)
x R
th(c)
Table 4: Static electrical characteristics (per diode)
Symbol
I
R
(1)
Parameter
Reverse leakage current
Test conditions
T
j
= 25 °C
T
j
= 100 °C
T
j
= 25 °C
V
F
(1)
Forward voltage drop
T
j
= 100 °C
T
j
= 25 °C
T
j
= 125 °C
Notes:
(1)
Pulse
Min.
-
-
-
-
-
-
Typ.
Max.
0.2
Unit
mA
mA
V
R
= V
RRM
I
F
= 5 A
I
F
= 5 A
I
F
= 10 A
I
F
= 10 A
8
25
0.53
0.36
0.46
0.67
V
0.49
0.59
test: t
p
= 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.33 x I
F(AV)
+ 0.026 I
F2(RMS)
2/12
DocID9433 Rev 7
STPS10L40C
Characteristics
1.1
Characteristics (curves)
Figure 1: Average forward power dissipation
versus average forward current (per diode)
3.5
3.0
2.5
2.0
1.5
1.0
Figure 2: Average forward current versus ambient
temperature (δ = 0.5, per diode)
6
PF(AV)(W)
δ
= 0.1
δ = 0.2
IF(AV)(A)
Rth(j-a) = Rth(j-c)
δ
= 0.05
δ = 0.5
5
4
δ =1
3
2
T
Rth(j-a) = 15 °C/W
T
0.5
IF(AV)(A)
1
δ
= tp/T
4.0
4.5
5.0
5.5
tp
δ = tp/T
tp
50
Tamb(°C)
75
100
125
150
0.0
0.0
0
6.0
6.5
0
25
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Figure 3: Normalized avalanche power derating
versus pulse duration (Tj = 125 °C)
1
P
ARM
(t p )
P
ARM
(10 µs)
Figure 4: Relative variation of thermal impedance
junction to case versus pulse duration
1.0
Zth(j-c)/Rth(j-c)
0.8
0.1
δ
= 0.5
0.6
0.4
0.01
δ
= 0.2
δ
= 0.1
T
0.2
t
p
(µs)
single pulse
0.001
t
p
(s )
1E-2
1E-1
1
10
100
1000
0.0
1E-3
δ
= tp/T
tp
1E+0
Figure 5: Reverse leakage current versus reverse
voltage applied (typical values, per diode)
1E+2
Figure 6: Junction capacitance versus reverse
voltage applied (typical values, per diode)
1000
IR(mA)
Tj = 150 °C
C(pF)
F = 1 MHz
V
= 30 mV
OSC
RMS
T = 25 °C
j
1E+1
Tj = 100 °C
1E+0
100
1E-1
Tj = 25 °C
1E-2
VR(V)
1E-3
0
5
10
15
VR(V)
10
25
30
35
40
20
1
2
5
10
20
50
DocID9433 Rev 7
3/12
Characteristics
Figure 7: Forward voltage drop versus forward
current (maximum values, per diode)
STPS10L40C
Figure 8: Thermal resistance junction to ambient
versus copper surface under tab for D²PAK
80
70
60
R
th(j-a)
(°C/W)
D²PAK
50
40
30
20
Epoxy printed board FR4, e CU= 35 µm
10
S
Cu
(cm²)
0
0
5
10
15
20
25
30
35
40
4/12
DocID9433 Rev 7
STPS10L40C
Package
information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
Cooling method: by conduction (C)
Epoxy meets UL 94,V0
Recommended torque value: 0.55 N·m (for TO-220AB)
Maximum torque value: 0.7 N·m (for TO-220AB)
DocID9433 Rev 7
5/12
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