Multiplexer Switch ICs 8:1 40 Ohm LC2MOS High Performance
| 参数名称 | 属性值 |
| Source Url Status Check Date | 2013-05-01 14:56:37.182 |
| Brand Name | Analog Devices Inc |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, TSSOP16,.25 |
| 针数 | 16 |
| 制造商包装代码 | RU-16 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 其他特性 | CAN ALSO OPERATE WITH 12V SUPPLY |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 5 mm |
| 湿度敏感等级 | 1 |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 标称断态隔离度 | 75 dB |
| 通态电阻匹配规范 | 15 Ω |
| 最大通态电阻 (Ron) | 100 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 235 |
| 电源 | 12/+-15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大信号电流 | 0.02 A |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | YES |
| 最长断开时间 | 150 ns |
| 最长接通时间 | 150 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 4.4 mm |
| ADG408BRU | ADG408BN | PCF0402P-15-82R5BI | ADG408BRU-REEL | ADG409BR-REEL7 | ADG408BR | |
|---|---|---|---|---|---|---|
| 描述 | Multiplexer Switch ICs 8:1 40 Ohm LC2MOS High Performance | Multiplexer Switch ICs 8:1 40 Ohm LC2MOS High Performance | Fixed Resistor, Metal Film, 0.063W, 82.5ohm, 25V, 0.1% +/-Tol, 15ppm/Cel, Surface Mount, 0402, CHIP | Multiplexer Switch ICs 8:1 40 Ohm LC2MOS High Performance | Multiplexer Switch ICs 4:1 40 Ohm LC2MOS High Performance | Multiplexer Switch ICs 8:1 40 Ohm LC2MOS High Performance |
| Source Url Status Check Date | 2013-05-01 14:56:37.182 | - | - | 2013-05-01 14:56:37.191 | 2013-05-01 14:56:37.231 | 2013-05-01 14:56:37.181 |
| Brand Name | Analog Devices Inc | - | - | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc |
| 是否无铅 | 含铅 | - | - | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | - | 符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | TSSOP | - | - | TSSOP | SOIC | SOIC |
| 包装说明 | TSSOP, TSSOP16,.25 | - | CHIP | TSSOP, TSSOP16,.25 | MS-012AC, SOIC-16 | MS-012AC, SOIC-16 |
| 针数 | 16 | - | - | 16 | 16 | 16 |
| 制造商包装代码 | RU-16 | - | - | RU-16 | R-16 | R-16 |
| Reach Compliance Code | not_compliant | - | compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | - | - | EAR99 | EAR99 | EAR99 |
| 其他特性 | CAN ALSO OPERATE WITH 12V SUPPLY | - | PRECISION, LASER TRIMMABLE | CAN ALSO OPERATE WITH 12V SUPPLY | CAN ALSO OPERATE WITH 12V SUPPLY | CAN ALSO OPERATE WITH 12V SUPPLY |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | - | - | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-PDSO-G16 | - | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e0 | - | e3 | e0 | e0 | e0 |
| 长度 | 5 mm | - | - | 5 mm | 9.9 mm | 9.9 mm |
| 湿度敏感等级 | 1 | - | - | 1 | 1 | 1 |
| 标称负供电电压 (Vsup) | -15 V | - | - | -15 V | -15 V | -15 V |
| 信道数量 | 8 | - | - | 8 | 4 | 8 |
| 功能数量 | 1 | - | - | 1 | 1 | 1 |
| 端子数量 | 16 | - | 2 | 16 | 16 | 16 |
| 标称断态隔离度 | 75 dB | - | - | 75 dB | 75 dB | 75 dB |
| 通态电阻匹配规范 | 15 Ω | - | - | 15 Ω | 15 Ω | 15 Ω |
| 最大通态电阻 (Ron) | 100 Ω | - | - | 100 Ω | 100 Ω | 100 Ω |
| 最高工作温度 | 85 °C | - | 125 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | - | - | TSSOP | SOP | SOP |
| 封装等效代码 | TSSOP16,.25 | - | - | TSSOP16,.25 | SOP16,.25 | SOP16,.25 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR PACKAGE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 235 | - | - | 240 | 240 | 235 |
| 电源 | 12/+-15 V | - | - | 12/+-15 V | 12/+-15 V | 12/+-15 V |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | - | - | 1.2 mm | 1.75 mm | 1.75 mm |
| 最大信号电流 | 0.02 A | - | - | 0.02 A | 0.02 A | 0.02 A |
| 标称供电电压 (Vsup) | 15 V | - | - | 15 V | 15 V | 15 V |
| 表面贴装 | YES | - | YES | YES | YES | YES |
| 最长断开时间 | 150 ns | - | - | 150 ns | 150 ns | 150 ns |
| 最长接通时间 | 150 ns | - | - | 150 ns | 150 ns | 150 ns |
| 切换 | BREAK-BEFORE-MAKE | - | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | - | METAL FILM | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | - | Matte Tin (Sn) - with Nickel (Ni) barrier | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | - | - | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | - | - | 0.65 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | - | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | - | - | 30 | 30 | 20 |
| 宽度 | 4.4 mm | - | - | 4.4 mm | 3.9 mm | 3.9 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
