Intel
®
Xeon
®
Processor E3-1200 v3
Product Family
Datasheet – Volume 1 of 2
July 2014
Order No.: 328907-002
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Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
Datasheet – Volume 1 of 2
2
July 2014
Order No.: 328907-002
Contents—Processor
Contents
Revision History..................................................................................................................9
1.0 Introduction................................................................................................................10
1.1
1.2
1.3
1.4
1.5
1.6
1.7
Supported Technologies.........................................................................................11
Interfaces............................................................................................................ 12
Power Management Support...................................................................................12
Thermal Management Support................................................................................13
Package Support...................................................................................................13
Terminology.........................................................................................................13
Related Documents............................................................................................... 16
2.0 Interfaces................................................................................................................... 18
2.1 System Memory Interface...................................................................................... 18
2.1.1 System Memory Technology Supported.......................................................19
2.1.2 System Memory Timing Support................................................................. 20
2.1.3 System Memory Organization Modes........................................................... 20
2.2 PCI Express* Interface.......................................................................................... 23
2.2.1 PCI Express* Support................................................................................ 23
2.2.2 PCI Express* Architecture.......................................................................... 24
2.2.3 PCI Express* Configuration Mechanism........................................................ 24
2.3 Direct Media Interface (DMI).................................................................................. 26
2.4 Processor Graphics................................................................................................28
2.5 Processor Graphics Controller (GT)..........................................................................28
2.5.1 3D and Video Engines for Graphics Processing.............................................. 29
2.5.2 Multi Graphics Controllers Multi-Monitor Support........................................... 31
2.6 Digital Display Interface (DDI)................................................................................31
2.7 Intel
®
Flexible Display Interface (Intel
®
FDI)............................................................ 37
2.8 Platform Environmental Control Interface (PECI)....................................................... 37
2.8.1 PECI Bus Architecture................................................................................37
3.0 Technologies............................................................................................................... 39
3.1 Intel
®
Virtualization Technology (Intel
®
VT)............................................................. 39
3.2 Intel
®
Trusted Execution Technology (Intel
®
TXT)..................................................... 43
3.3 Intel
®
Hyper-Threading Technology (Intel
®
HT Technology)....................................... 44
3.4 Intel
®
Turbo Boost Technology 2.0..........................................................................45
3.5 Intel
®
Advanced Vector Extensions 2.0 (Intel
®
AVX2)................................................45
3.6 Intel
®
Advanced Encryption Standard New Instructions (Intel
®
AES-NI).......................46
3.7 Intel
®
Transactional Synchronization Extensions - New Instructions (Intel
®
TSX-NI)..... 47
3.8 Intel
®
64 Architecture x2APIC................................................................................ 47
3.9 Power Aware Interrupt Routing (PAIR).................................................................... 48
3.10 Execute Disable Bit..............................................................................................48
3.11 Supervisor Mode Execution Protection (SMEP)........................................................49
4.0 Power Management.................................................................................................... 50
4.1 Advanced Configuration and Power Interface (ACPI) States Supported......................... 51
4.2 Processor Core Power Management......................................................................... 52
4.2.1 Enhanced Intel
®
SpeedStep
®
Technology Key Features..................................52
4.2.2 Low-Power Idle States............................................................................... 53
July 2014
Order No.: 328907-002
Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
Datasheet – Volume 1 of 2
3
Processor—Contents
4.3
4.4
4.5
4.6
4.2.3 Requesting Low-Power Idle States...............................................................54
4.2.4 Core C-State Rules....................................................................................55
4.2.5 Package C-States......................................................................................56
4.2.6 Package C-States and Display Resolutions.................................................... 60
Integrated Memory Controller (IMC) Power Management............................................61
4.3.1 Disabling Unused System Memory Outputs................................................... 61
4.3.2 DRAM Power Management and Initialization..................................................62
4.3.3 DRAM Running Average Power Limitation (RAPL) .........................................64
4.3.4 DDR Electrical Power Gating (EPG).............................................................. 64
PCI Express* Power Management............................................................................64
Direct Media Interface (DMI) Power Management...................................................... 64
Graphics Power Management..................................................................................65
4.6.1 Intel
®
Rapid Memory Power Management (Intel
®
RMPM)................................65
4.6.2 Graphics Render C-State............................................................................65
4.6.3 Intel
®
Graphics Dynamic Frequency............................................................ 65
5.0 Thermal Management................................................................................................. 66
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
Thermal Metrology................................................................................................ 67
Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 1.1.............................. 67
Fan Speed Control Scheme with Digital Thermal Sensor (DTS) 2.0.............................. 69
Thermal Specifications...........................................................................................70
Processor Temperature..........................................................................................72
Adaptive Thermal Monitor...................................................................................... 72
THERMTRIP# Signal.............................................................................................. 75
Digital Thermal Sensor.......................................................................................... 75
5.8.1 Digital Thermal Sensor Accuracy (Taccuracy)................................................76
5.9 Intel
®
Turbo Boost Technology Thermal Considerations..............................................76
5.9.1 Intel
®
Turbo Boost Technology Power Control and Reporting.......................... 76
5.9.2 Package Power Control.............................................................................. 77
5.9.3 Turbo Time Parameter............................................................................... 78
6.1 System Memory Interface Signals........................................................................... 80
6.2 Memory Reference Compensation Signals.................................................................82
6.3 Reset and Miscellaneous Signals............................................................................. 83
6.4 PCI Express* Interface Signals............................................................................... 84
6.5 Display Interface Signals....................................................................................... 84
6.6 Direct Media Interface (DMI).................................................................................. 84
6.7 Phase Locked Loop (PLL) Signals.............................................................................85
6.8 Testability Signals.................................................................................................85
6.9 Error and Thermal Protection Signals....................................................................... 86
6.10 Power Sequencing Signals.................................................................................... 86
6.11 Processor Power Signals.......................................................................................87
6.12 Sense Signals..................................................................................................... 87
6.13 Ground and Non-Critical to Function (NCTF) Signals.................................................87
6.14 Processor Internal Pull-Up / Pull-Down Terminations................................................ 87
7.0 Electrical Specifications.............................................................................................. 88
7.1
7.2
7.3
7.4
Integrated Voltage Regulator..................................................................................88
Power and Ground Lands ...................................................................................... 88
V
CC
Voltage Identification (VID).............................................................................. 88
Reserved or Unused Signals................................................................................... 93
6.0 Signal Description....................................................................................................... 80
Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
Datasheet – Volume 1 of 2
4
July 2014
Order No.: 328907-002
Contents—Processor
7.5
7.6
7.7
7.8
Signal Groups.......................................................................................................93
Test Access Port (TAP) Connection.......................................................................... 95
DC Specifications................................................................................................. 95
Voltage and Current Specifications.......................................................................... 96
7.8.1 Platform Environment Control Interface (PECI) DC Characteristics................. 101
7.8.2 Input Device Hysteresis........................................................................... 102
Processor Component Keep-Out Zone.................................................................... 103
Package Loading Specifications............................................................................. 103
Package Handling Guidelines................................................................................ 104
Package Insertion Specifications............................................................................104
Processor Mass Specification.................................................................................104
Processor Materials............................................................................................. 104
Processor Markings............................................................................................. 105
Processor Land Coordinates.................................................................................. 105
Processor Storage Specifications........................................................................... 106
8.0 Package Mechanical Specifications........................................................................... 103
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
9.0 Processor Ball and Signal Information...................................................................... 108
July 2014
Order No.: 328907-002
Intel
®
Xeon
®
Processor E3-1200 v3 Product Family
Datasheet – Volume 1 of 2
5
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