|
ISL6506ACBZ-T |
ISL6506BCBZA |
ISL6548A-6506EVAL1Z |
描述 |
Switching Controllers ISL6506A 2 OUTPUT ACPI CNTRLR 8L EP |
Switching Controllers W/ANNEAL 2 OUTPUT ACPI PWR CNTRLR 8LD |
Power Management IC Development Tools ISL6548A-6506 EVALUA TION BRD 1 RHS CMPL |
Brand Name |
Intersil |
Intersil |
- |
厂商名称 |
Renesas(瑞萨电子) |
Renesas(瑞萨电子) |
- |
零件包装代码 |
SOIC |
SOIC |
- |
包装说明 |
HLSOP, SOP8,.25 |
HLSOP, SOP8,.25 |
- |
针数 |
8 |
8 |
- |
Reach Compliance Code |
compliant |
compliant |
- |
ECCN代码 |
EAR99 |
EAR99 |
- |
Factory Lead Time |
13 weeks |
1 week |
- |
可调阈值 |
NO |
NO |
- |
模拟集成电路 - 其他类型 |
POWER SUPPLY SUPPORT CIRCUIT |
POWER SUPPLY SUPPORT CIRCUIT |
- |
JESD-30 代码 |
R-PDSO-G8 |
R-PDSO-G8 |
- |
JESD-609代码 |
e3 |
e3 |
- |
长度 |
4.89 mm |
4.89 mm |
- |
湿度敏感等级 |
3 |
3 |
- |
信道数量 |
1 |
1 |
- |
功能数量 |
1 |
1 |
- |
端子数量 |
8 |
8 |
- |
最高工作温度 |
70 °C |
70 °C |
- |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
封装代码 |
HLSOP |
HLSOP |
- |
封装等效代码 |
SOP8,.25 |
SOP8,.25 |
- |
封装形状 |
RECTANGULAR |
RECTANGULAR |
- |
封装形式 |
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE |
- |
峰值回流温度(摄氏度) |
260 |
260 |
- |
电源 |
5 V |
5 V |
- |
认证状态 |
Not Qualified |
Not Qualified |
- |
座面最大高度 |
1.68 mm |
1.68 mm |
- |
最大供电电压 (Vsup) |
5.25 V |
5.25 V |
- |
最小供电电压 (Vsup) |
4.75 V |
4.75 V |
- |
标称供电电压 (Vsup) |
5 V |
5 V |
- |
表面贴装 |
YES |
YES |
- |
温度等级 |
COMMERCIAL |
COMMERCIAL |
- |
端子面层 |
Matte Tin (Sn) - annealed |
Matte Tin (Sn) - annealed |
- |
端子形式 |
GULL WING |
GULL WING |
- |
端子节距 |
1.27 mm |
1.27 mm |
- |
端子位置 |
DUAL |
DUAL |
- |
处于峰值回流温度下的最长时间 |
30 |
30 |
- |
宽度 |
3.9 mm |
3.9 mm |
- |