HMC365S8G
/
365S8GE
v04.0506
SMT GaAs HBT MMIC
DIVIDE-BY-4, DC - 13.0 GHz
Features
Ultra Low SSB Phase Noise: -151 dBc/Hz
Wide Bandwidth
Output Power: 5 dBm
Single DC Supply: +5V
S8G SMT Package
Typical Applications
6
FREQUENCY DIVIDERS & DETECTORS - SMT
Prescaler for DC to Ku Band PLL Applications:
• Satellite Communication Systems
• Fiber Optic
• Point-to-Point and Point-to-Multi-Point Radios
• VSAT
Functional Diagram
General Description
The HMC365S8G & HMC365S8GE are low noise
Divide-by-4 Static Dividers with InGaP GaAs HBT
technology in 8 lead surface mount plastic packages.
This device operates from DC (with a square wave
input) to 13.0 GHz input frequency with a single +5.0V
DC supply. The low additive SSB phase noise of -151
dBc/Hz at 100 kHz offset helps the user maintain good
system noise performance.
Electrical Specifications,
T
A
= +25° C, 50 Ohm System, Vcc = 5V
Parameter
Maximum Input Frequency
Minimum Input Frequency
Input Power Range
Sine Wave Input. [1}
Fin = 1 to 8 GHz
Fin = 8 to 11 GHz
Fin = 11 to 13 GHz
Output Power
Reverse Leakage
SSB Phase Noise (100 kHz offset)
Output Transition Time
Supply Current (Icc)
1. Divider will operate down to DC for square-wave input signal.
Fin = 13 GHz
Both RF Outputs Terminated
Pin = 0 dBm, Fin = 6 GHz
Pin = 0 dBm, Fout = 882 MHz
-15
-10
-5
2
Conditions
Min.
13
Typ.
14
0.2
>-20
>-15
>-8
5
45
-151
100
110
0.5
+10
+3
+3
Max.
Units
GHz
GHz
dBm
dBm
dBm
dBm
dB
dBc/Hz
ps
mA
6 - 44
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC365S8G
/
365S8GE
v04.0506
SMT GaAs HBT MMIC
DIVIDE-BY-4, DC - 13.0 GHz
Input Sensitivity Window, T= 25 °C
20
Input Sensitivity Window vs. Temperature
20
6
Min Pin +25 C
Max Pin +25 C
Min Pin +85 C
Max Pin +85 C
Min Pin -40 C
Max Pin -40 C
10
INPUT POWER (dBm)
INPUT POWER (dBm)
10
0
Recommended
Operating Window
0
-10
-10
-20
-20
-30
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
INPUT FREQUENCY (GHz)
-30
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
INPUT FREQUENCY (GHz)
Output Power vs. Temperature
10
9
8
7
6
5
4
3
2
1
0
-1
-2
-3
-4
-5
0
1
2
3
4
5
6
7
8
SSB Phase Noise
Performance, Pin= 0 dBm, T= 25 °C
0
-20
SSB PHASE NOISE (dBc/Hz)
-40
-60
-80
-100
-120
-140
-160
2
10
+25 C
+85 C
-40 C
9 10 11 12 13 14 15
10
3
10
4
10
5
10
6
10
7
INPUT FREQUENCY (GHz)
OFFSET FREQUENCY (Hz)
Output Harmonic
Content, Pin= 0 dBm, T= 25 °C
0
Reverse Leakage, Pin= 0 dBm, T= 25 °C
0
-10
POWER LEVEL (dBm)
Both Output Ports Terminated
One Output Port Terminated
-10
OUTPUT LEVEL (dBm)
Pfeedthru
2nd Harmonic
3rd Harmonic
-20
-30
-40
-50
-60
-20
-30
-40
-50
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
INPUT FREQUENCY (GHz)
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15
INPUT FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
6 - 45
FREQUENCY DIVIDERS & DETECTORS - SMT
OUTPUT POWER (dBm)
HMC365S8G
/
365S8GE
v04.0506
SMT GaAs HBT MMIC
DIVIDE-BY-4, DC - 13.0 GHz
Output Voltage Waveform,
Pin= 0 dBm, Fout= 882 MHz, T= 25 °C
Absolute Maximum Ratings
RF Input (Vcc = +5V)
Vcc
Junction Temperature
Continuous Pdiss (T= 85°C)
(derate 15 mW/°C above 85°C)
Thermal Resistance (RTH)
(junction to ground paddle)
Storage Temperature
Operating Temperature
+13 dBm
+5.5V
135 °C
760 mW
65.8 °C/W
-65 to +150 °C
-40 to to +85 °C
6
FREQUENCY DIVIDERS & DETECTORS - SMT
AMPLITUDE (mV)
700
600
500
400
300
200
100
0
-100
-200
-300
-400
-500
-600
-700
22.7 22.9 23.1 23.3 23.5 23.7 23.9 24.1 24.3 24.5 24.7
TIME (nS)
Typical Supply Current vs. Vcc
Vcc (V)
4.75
Icc (mA)
94
110
118
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
5.0
5.25
Note: Divider will operate over full voltage range shown above
Outline Drawing
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO
PCB RF GROUND.
Package Information
Part Number
HMC365S8G
HMC365S8GE
Package Body Material
Low Stress Injection Molded Plastic
RoHS-compliant Low Stress Injection Molded Plastic
Lead Finish
Sn/Pb Solder
100% matte Sn
MSL Rating
MSL1
MSL1
[1]
Package Marking
[3]
HMC365
XXXX
HMC365
XXXX
[2]
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
6 - 46
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC365S8G
/
365S8GE
v04.0506
SMT GaAs HBT MMIC
DIVIDE-BY-4, DC - 13.0 GHz
Pin Description
Pin Number
Function
Description
Interface Schematic
6
FREQUENCY DIVIDERS & DETECTORS - SMT
1
OUT
Divided output 180° out of phase with pin 3.
2, 6
N/C
No connection. These pins must not be grounded.
3
OUT
Divided Output.
4
Vcc
Supply voltage 5V ± 0.25V.
5
IN
RF Input must be DC blocked.
7
IN
RF Input 180° out of phase with pin 5 for differential operation.
A/C ground for single ended operation
8
GND
Ground Backside of package has exposed metal ground paddle which
must be connected to ground.
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
6 - 47
HMC365S8G
/
365S8GE
v04.0506
SMT GaAs HBT MMIC
DIVIDE-BY-4, DC - 13.0 GHz
Evaluation PCB
6
FREQUENCY DIVIDERS & DETECTORS - SMT
List of Materials for Evaluation PCB 104631
Item
J1 - J3
C1 - C4
C5
C6
U1
PCB
[2]
Description
PCB Mount SMA RF Connector
100 pF Capacitor, 0402 Pkg.
1000 pF Capacitor, 0603 Pkg.
10 μF Tantalum Capacitor
HMC365S8G / HMC365S8GE Divide-by-4
104627 Eval Board
[1]
[1] Reference this number when ordering complete evaluation PCB
[2] Circuit Board Material: Rogers 4350
The circuit board used in the final application
should use RF circuit design techniques. Signal
lines should have 50 ohm impedance while the
package ground leads and backside ground slug
should be connected directly to the ground plane
similar to that shown. A sufficient number of via
holes should be used to connect the top and bottom
ground planes. The evaluation circuit board shown
is available from Hittite upon request. This evalua-
tion board is designed for single ended input test-
ing. J2 and J3 provide differential output signals.
6 - 48
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
实时操作系统RTOS
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
