电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MAX4764ETB+TG104

产品描述Analog Switch ICs Dual SPDT Audio Clickless Switch
产品类别模拟混合信号IC    信号电路   
文件大小478KB,共15页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
标准
下载文档 详细参数 选型对比 全文预览

MAX4764ETB+TG104概述

Analog Switch ICs Dual SPDT Audio Clickless Switch

MAX4764ETB+TG104规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Maxim(美信半导体)
包装说明,
Reach Compliance Codecompliant
模拟集成电路 - 其他类型SPDT
JESD-609代码e3
湿度敏感等级1
端子面层Matte Tin (Sn)

文档预览

下载PDF文档
19-3152; Rev 2; 1/06
Low-Voltage, Dual SPDT, Audio Clickless
Switches with Negative Rail Capability
General Description
The MAX4762–MAX4764/MAX4764A/MAX4765 dual
SPDT (single-pole/double-throw) switches feature nega-
tive signal capability that allows signals below ground to
pass through without distortion. These analog switches
operate from a single +1.8V to +5.5V supply and have
low 0.6Ω on-resistance, making them ideal for switching
audio signals.
The MAX4763/MAX4765 include a comparator that can
be used for headphone detection or a mute/send key
function. The MAX4764/MAX4764A/MAX4765 have an
internal shunt switch to automatically discharge any
capacitance at the NO and NC connection points. This
reduces click-and-pop sounds that occur when switching
audio signals between precharged points.
These SPDT switches are available in space-saving
µMAX
®
, TDFN, thin QFN, and UCSP
packages and
operate over the -40°C to +85°C extended tempera-
ture range.
Features
Distortion-Free Negative Signal Throughput Down
to V
CC
- 5.5V
Comparator for Headphone or Mute Detection
(MAX4763/MAX4765)
Internal Shunt Resistor Reduces Click/Pop
(MAX4764/MAX4764A/MAX4765)
Low On-Resistance (R
ON
)
0.6Ω at +2.7V Supply
0.25Ω On-Resistance Flatness
0.05Ω On-Resistance Matching
+1.8V to +5.5V Supply Voltage
-70dB Crosstalk (100kHz)
-65dB Off-Isolation (100kHz)
0.01% Total Harmonic Distortion
Available in µMAX, TDFN, Thin QFN, and UCSP
Packages
MAX4762–MAX4764/MAX4764A/MAX4765
Applications
Cell Phones
PDAs and Handheld Devices
Notebook Computers
MP3 Players
Ordering Information
PART
MAX4762ETB
MAX4762EUB
MAX4762EBC-T
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
PIN-
PACKAGE
10 TDFN
10 µMAX
12 UCSP-12
TOP
MARK
ACG
ABU
µMAX is a registered trademark and UCSP is a trademark of
Maxim Integrated Products, Inc.
Ordering Information continued at end of data sheet.
Selector Guide appears at end of data sheet.
Pin Configurations/Functional Diagrams/Truth Table
TOP VIEW
(BUMP SIDE DOWN)
MAX4762/MAX4764
MAX4763/MAX4765
C1
NO2
C2
COM2
C3
NC2
C4
IN2
B1
V
CC
A1
NO1
A2
COM1
A3
NC1
C1
NO2
C2
COM2
C3
NC2
C4
IN2
B1
V
CC
B2
CMPO
B3
CMP-
B4
GND
A1
NO1
A2
COM1
A3
NC1
A4
IN1
IN_
0
1
MAX4762–MAX4764/
MAX4764A/MAX4765
NO_
OFF
ON
NC_
ON
OFF
B4
GND
A4
IN1
SWITCHES SHOWN FOR LOGIC "0" INPUT
UCSP
UCSP
Pin Configurations/Functional Diagrams/Truth Table continued at end of data sheet.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX4764ETB+TG104相似产品对比

MAX4764ETB+TG104 MAX4764EUB-T MAX4764EUB MAX4762EUB+T MAX4762EBC-T MAX8903NETI+ MAX4762EUB MAX4764EUB+ MAX4764EBC+T MAX4762EBC+T
描述 Analog Switch ICs Dual SPDT Audio Clickless Switch Analog Switch ICs Low-Voltage, Dual SPDT, Audio Clickless Switches with Negative Rail Capability Analog Switch ICs Low-Voltage, Dual SPDT, Audio Clickless Switches with Negative Rail Capability Analog Switch ICs Dual SPDT Audio Clickless Switch Analog Switch ICs Low-Voltage, Dual SPDT, Audio Clickless Switches with Negative Rail Capability Battery Management 2A 1-Cell Li+ DC-DC Charger for USB and Adapter Power Analog Switch ICs Low-Voltage, Dual SPDT, Audio Clickless Switches with Negative Rail Capability Analog Switch ICs Dual SPDT Audio Clickless Switch Analog Switch ICs Dual SPDT Audio Clickless Switch Analog Switch ICs Dual SPDT Audio Clickless Switch
是否Rohs认证 符合 不符合 不符合 符合 不符合 - 不符合 符合 符合 符合
厂商名称 Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) - Maxim(美信半导体) Maxim(美信半导体) - Maxim(美信半导体)
包装说明 , TSSOP, TSSOP10,.19,20 TSSOP, TSSOP10,.19,20 MO-187C-BA, USOP-10 4 X 3 MM, UCSP-12 - MO-187C-BA, USOP-10 TSSOP, TSSOP10,.19,20 VFBGA, BGA12,3X4,20 VFBGA,
Reach Compliance Code compliant not_compliant not_compliant compliant not_compliant - not_compliant compliant compliant compliant
模拟集成电路 - 其他类型 SPDT SPDT SPDT SPDT SPDT - SPDT SPDT SPDT SPDT
JESD-609代码 e3 e0 e0 e3 e0 - e0 e3 e1 e1
湿度敏感等级 1 1 1 1 1 - 1 1 1 1
端子面层 Matte Tin (Sn) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Matte Tin (Sn) Tin/Lead (Sn/Pb) - Tin/Lead (Sn85Pb15) Matte Tin (Sn) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
是否无铅 - 含铅 含铅 不含铅 含铅 - 含铅 不含铅 不含铅 不含铅
零件包装代码 - TSSOP TSSOP TSSOP BGA - TSSOP TSSOP BGA BGA
针数 - 10 10 10 12 - 10 10 12 12
JESD-30 代码 - S-PDSO-G10 S-PDSO-G10 S-PDSO-G10 R-PBGA-B12 - S-PDSO-G10 S-PDSO-G10 R-PBGA-B12 R-PBGA-B12
长度 - 3 mm 3 mm 3 mm 2.02 mm - 3 mm 3 mm 2.02 mm 2.02 mm
正常位置 - NO/NC NO/NC NO/NC NO/NC - NO/NC NO/NC NO/NC -
信道数量 - 1 1 1 1 - 1 1 1 1
功能数量 - 2 2 2 2 - 2 2 2 2
端子数量 - 10 10 10 12 - 10 10 12 12
标称断态隔离度 - 65 dB 65 dB 65 dB 65 dB - 65 dB 65 dB 65 dB 65 dB
通态电阻匹配规范 - 0.05 Ω 0.05 Ω 0.05 Ω 0.05 Ω - 0.05 Ω 0.05 Ω 0.05 Ω 0.05 Ω
最大通态电阻 (Ron) - 0.85 Ω 0.85 Ω 0.85 Ω 0.85 Ω - 0.85 Ω 0.85 Ω 0.85 Ω 0.85 Ω
最高工作温度 - 85 °C 85 °C 85 °C 85 °C - 85 °C 85 °C 85 °C 85 °C
最低工作温度 - -40 °C -40 °C -40 °C -40 °C - -40 °C -40 °C -40 °C -40 °C
输出 - SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT - SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT -
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - TSSOP TSSOP TSSOP VFBGA - TSSOP TSSOP VFBGA VFBGA
封装等效代码 - TSSOP10,.19,20 TSSOP10,.19,20 TSSOP10,.19,20 BGA12,3X4,20 - TSSOP10,.19,20 TSSOP10,.19,20 BGA12,3X4,20 -
封装形状 - SQUARE SQUARE SQUARE RECTANGULAR - SQUARE SQUARE RECTANGULAR RECTANGULAR
封装形式 - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度) - NOT SPECIFIED 240 260 240 - 240 260 260 260
电源 - 3/5 V 3/5 V 3/5 V 3/5 V - 3/5 V 3/5 V 3/5 V -
认证状态 - Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 - 1.1 mm 1.1 mm 1.1 mm 0.67 mm - 1.1 mm 1.1 mm 0.67 mm 0.67 mm
最大供电电压 (Vsup) - 5.5 V 5.5 V 5.5 V 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) - 1.8 V 1.8 V 1.8 V 1.8 V - 1.8 V 1.8 V 1.8 V 1.8 V
标称供电电压 (Vsup) - 3 V 3 V 3 V 3 V - 3 V 3 V 3 V 3 V
表面贴装 - YES YES YES YES - YES YES YES YES
最长断开时间 - 70 ns 70 ns 70 ns 70 ns - 70 ns 70 ns 70 ns 70 ns
最长接通时间 - 80 ns 80 ns 80 ns 80 ns - 80 ns 80 ns 80 ns 80 ns
切换 - BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE - BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE -
技术 - BICMOS BICMOS BICMOS BICMOS - BICMOS BICMOS BICMOS BICMOS
温度等级 - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 - GULL WING GULL WING GULL WING BALL - GULL WING GULL WING BALL BALL
端子节距 - 0.5 mm 0.5 mm 0.5 mm 0.5 mm - 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 - DUAL DUAL DUAL BOTTOM - DUAL DUAL BOTTOM BOTTOM
处于峰值回流温度下的最长时间 - NOT SPECIFIED 20 30 20 - 20 30 30 30
宽度 - 3 mm 3 mm 3 mm 1.54 mm - 3 mm 3 mm 1.54 mm 1.54 mm
ECCN代码 - - - EAR99 EAR99 - EAR99 EAR99 EAR99 EAR99
EEWORLD大学堂----TI高功率密度电源设计中的散热解决方案
TI高功率密度电源设计中的散热解决方案:https://training.eeworld.com.cn/course/3680...
wanglan123 聊聊、笑笑、闹闹
【河蟹】技术网站也有河蟹
:funk: 技术网站也有河蟹,版主们也是挡员吧!...
h0nly_zhang 微控制器 MCU
有奖评测:平头哥RISC-V低功耗板——RVB2601
论坛给大家弄来了平头哥最近连发三款RISC-V生态板——RVB2601 板子的相关资料很肥,感兴趣的网友开宰啦~对啦对啦,平头哥还为本次参与评测网友提供了惊喜礼品(见文末),一起来 ......
EEWORLD社区 国产芯片交流
MSP430f149驱动12864液晶
各位高手好,帮忙解决一个msp430f149控制12864的问题吗,如何根据12864的时序实现用430来控制,程序该怎么写?有哪位大侠有这方面的程序,详细解答一下,不胜感激!...
莫回头 嵌入式系统
只是一个很简单的问题却突然想不明白
电源并联提高电压,串联提高电流这我能理解。 但刚看书说串联和并联提供相同的功率,比如是Vb,RL和Ib; 并联是通过提高到3Vb,串联是通过提高到3Ib. 但是并联的话不是 I并=V并/RL=3Ib 而串 ......
zmsxhy 模拟与混合信号
请问tms570系列(tms570lc4357)支持emmc存储吗
请问tms570系列(tms570lc4357)支持emmc存储吗,mibspi能用在mmc协议上吗 ...
yuanyuan 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2764  1575  2176  1975  159  56  32  44  40  4 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved