Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MK22FX512AVLH12

MK22FX512AVLH12: 产品描述ARM Microcontrollers - MCU MK22FX512AVLH12/QFP64///STANDARD MARKING * TRAY DR; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小1MB，共72页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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MK22FX512AVLH12概述

ARM Microcontrollers - MCU MK22FX512AVLH12/QFP64///STANDARD MARKING * TRAY DR

MK22FX512AVLH12规格参数

参数名称	属性值
Brand Name	Freescale
是否无铅	不含铅
是否Rohs认证	符合
包装说明	10 X 10 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-64
Reach Compliance Code	compliant
Base Number Matches	1

文档解析

Kinetis K22F微控制器系列采用120MHz ARM Cortex-M4内核，搭载浮点运算单元和DSP指令加速信号处理。存储子系统提供512KB至1MB可编程闪存与128KB SRAM，FlexMemory技术支持4KB FlexRAM和128KB FlexNVM配置。工作电压1.71-3.6V兼容电池供电场景，工业温度范围-40°C至105°C确保环境适应性，64引脚LQFP封装优化空间利用率。能效管理实现多模式功耗控制：动态运行电流279μA/MHz，待机模式5.1μA（状态保持+5μs唤醒），超低静态模式仅268nA。集成USB OTG控制器支持设备/主机角色切换，内置3.3V LDO简化供电设计。安全机制包含存储器保护单元、硬件CRC校验及全球唯一128位芯片标识符。模拟子系统集成双16位ADC、12位DAC和三路高精度比较器。通信接口覆盖CAN总线、多路SPI/I²C/UART、SD存储卡控制器和I²S音频接口。定时器模块包含20通道PWM输出（支持电机控制）、正交解码器和实时时钟，时钟架构支持晶体/PLL/FLL混合时钟源，满足精密时序应用需求。Kinetis K22F微控制器基于120MHz Cortex-M4架构，硬件FPU加速浮点运算，DSP指令优化数字信号处理。存储配置包含1MB闪存/128KB SRAM，支持ECC保护的FlexNVM技术实现128KB非易失存储。工作电压1.71-3.6V兼容纽扣电池供电，工业级温度范围覆盖-40°C至105°C，64引脚LQFP封装提供40个GPIO资源。能效系统实现四级功耗管理：运行模式279μA/MHz，待机5.1μA（5μs唤醒），休眠模式268nA。集成USB全速OTG控制器，内置可编程充电检测模块。安全子系统包含128位唯一ID、硬件CRC-32生成器及多主DMA保护机制。数据采集系统集成双16位ADC（1Msps采样率）、12位电压输出DAC和三个窗口比较器。通信接口支持CAN FD、高速SPI(50MHz)、I²C、UART(带FIFO)、SDHC和I²S主控接口。定时资源包含周期中断定时器、载波调制发射器和可编程延迟块，时钟网络支持外部时钟输入与内部低功耗振荡器切换。

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Freescale Semiconductor, Inc.

Data Sheet: Technical Data

K22P64M120SF5V2

Rev 5, 03/2015

Kinetis K22F Sub-Family Data

Sheet

120 MHz ARM® Cortex®-M4-based Microcontroller with FPU

The K22 product family members are optimized for cost-sensitive

applications requiring low-power, USB connectivity, processing

efficiency with floating point unit. It shares the comprehensive

enablement and scalability of the Kinetis family. This product

offers:

• Up to 1 MB of flash memory with up to 128 KB of SRAM

• Small package with high memory density

• Run power consumption down to 279 μA/MHz. Static

power consumption down to 5.1 μA with full state retention

and 5 μs wakeup. Lowest Static mode down to 268 nA

• USB LS/FS OTG 2.0 with embedded 3.3 V, 120 mA LDO

voltage regulator

MK22FX512AVLH12

MK22FN1M0AVLH12

64 LQFP

10 x 10 x 1.4 mm Pitch 0.5 mm

Performance

• Up to 120 MHz ARM Cortex-M4-based core with DSP

instructions delivering 1.25 Dhrystone MIPS per MHz

Memories and memory interfaces

• Up to 1 MB program flash memory and 128 KB RAM

• 4 KB FlexRAM and 128 KB FlexNVM on FlexMemory

devices

• FlexBus external bus interface

System peripherals

• Multiple low-power modes; low leakage wakeup unit

• Memory protection unit with multi-master protection

• 16-channel DMA controller

• External watchdog monitor and software watchdog

Security and integrity modules

• Hardware CRC module

• 128-bit unique identification (ID) number per chip

Analog modules

• Two 16-bit SAR ADCs

• One 12-bit DAC

• Three analog comparators (CMP)

• Voltage reference

Communication interfaces

• USB full-/low-speed On-the-Go controller

• USB Device Charger detect

• Controller Area Network (CAN) module

• Three SPI modules

• Three I2C modules

• Six UART modules

• Secure Digital host controller (SDHC)

• I2S module

Timers

• Two 8-channel Flex-Timers (PWM/Motor Control)

• Two 2-channel Flex-Timers (PWM/Quad Decoder)

• Periodic interrupt timers and 16-bit low-power timer

• Carrier modulator transmitter

• Real-time clock

• Programmable delay block

Clocks

• 3 to 32 MHz and 32 kHz crystal oscillator

• PLL, FLL, and multiple internal oscillators

Operating Characteristics

• Voltage range: 1.71 to 3.6 V

• Flash write voltage range: 1.71 to 3.6 V

• Temperature range (ambient): –40 to 105°C

Freescale reserves the right to change the detail specifications as may be required to

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current operating ratings............................. 5

2 General................................................................................... 6

2.1 AC electrical characteristics.............................................6

2.2 Nonswitching electrical specifications..............................7

2.2.1 Voltage and current operating requirements....... 7

2.2.2 LVD and POR operating requirements................8

2.2.3 Voltage and current operating behaviors.............8

2.2.4 Power mode transition operating behaviors........ 10

2.2.5 Power consumption operating behaviors............ 10

2.2.6 EMC radiated emissions operating behaviors..... 14

2.2.7 Designing with radiated emissions in mind..........15

2.2.8 Capacitance attributes.........................................15

2.3 Switching specifications...................................................15

2.3.1 Device clock specifications..................................15

2.3.2 General switching specifications......................... 16

2.4 Thermal specifications..................................................... 17

2.4.1 Thermal operating requirements......................... 17

2.4.2 Thermal attributes................................................17

3 Peripheral operating requirements and behaviors.................. 18

3.1 Core modules.................................................................. 18

3.1.1 Debug trace timing specifications........................19

3.1.2 JTAG electricals.................................................. 19

3.2 System modules.............................................................. 22

3.3 Clock modules................................................................. 22

3.3.1 MCG specifications..............................................22

3.3.2 Oscillator electrical specifications........................25

3.3.3

32 kHz oscillator electrical characteristics........... 27

3.4 Memories and memory interfaces................................... 27

3.4.1 Flash (FTFE) electrical specifications..................27

3.4.2 EzPort switching specifications........................... 32

3.4.3 Flexbus switching specifications..........................33

3.5 Security and integrity modules........................................ 36

3.6 Analog............................................................................. 36

3.6.1 ADC electrical specifications............................... 37

3.6.2 CMP and 6-bit DAC electrical specifications....... 41

3.6.3 12-bit DAC electrical characteristics....................43

3.6.4 Voltage reference electrical specifications.......... 46

3.7 Timers..............................................................................47

3.8 Communication interfaces............................................... 47

3.8.1 USB electrical specifications............................... 47

3.8.2 USB DCD electrical specifications.......................48

3.8.3 USB VREG electrical specifications.................... 48

3.8.4 CAN switching specifications...............................49

3.8.5 DSPI switching specifications (limited voltage

range).................................................................. 49

3.8.6

3.8.7

3.8.8

3.8.9

DSPI switching specifications (full voltage

range).................................................................. 51

I2C switching specifications.................................52

UART switching specifications............................ 53

I2S switching specifications.................................53

4 Dimensions............................................................................. 65

4.1 Obtaining package dimensions....................................... 65

5 Pinout...................................................................................... 66

5.1 K22 Signal Multiplexing and Pin Assignments.................66

5.2 K22 Pinouts..................................................................... 69

6 Revision History...................................................................... 70

7 Copyright................................................................................. 0

8 Legal....................................................................................... 0