Translation - Voltage Levels +1.2V to 3.6V, 0.1microamps, 100Mbps, Single-/Dual-/Quad-Level Translators
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | BGA |
| 包装说明 | UCSP-9 |
| 针数 | 9 |
| Reach Compliance Code | not_compliant |
| 接口集成电路类型 | INTERFACE CIRCUIT |
| JESD-30 代码 | S-PBGA-B9 |
| JESD-609代码 | e0 |
| 长度 | 1.52 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 2 |
| 端子数量 | 9 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VFBGA |
| 封装等效代码 | BGA9,3X3,20 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 1.8/3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.67 mm |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 1.65 V |
| 标称供电电压 | 2.5 V |
| 电源电压1-最大 | 3.2 V |
| 电源电压1-分钟 | 1.2 V |
| 电源电压1-Nom | 1.8 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 0.5 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 1.52 mm |
| MAX13014EBL-T | MAX3023EBC-TG47 | MAX13014EKA-T | MAX3023EBC+T | MAX13013EBT+T | MAX3023EUD+T | MAX13013EXT+T | |
|---|---|---|---|---|---|---|---|
| 描述 | Translation - Voltage Levels +1.2V to 3.6V, 0.1microamps, 100Mbps, Single-/Dual-/Quad-Level Translators | Translation - Voltage Levels 1.2-3.6V .1uA 100Mbps | Translation - Voltage Levels +1.2V to 3.6V, 0.1microamps, 100Mbps, Single-/Dual-/Quad-Level Translators | Translation - Voltage Levels 1.2-3.6V .1uA 100Mbps | Translation - Voltage Levels +1.2V to +3.6V, 0.1 A, 100Mbps, Single-/Dual-/Quad-Level Translators | Translation - Voltage Levels 1.2-3.6V .1uA 100Mbps | Translation - Voltage Levels Single 100Mbps |
| 是否无铅 | 含铅 | - | 含铅 | 不含铅 | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | - | 不符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - |
| 零件包装代码 | BGA | - | SOIC | BGA | - | TSSOP | SOIC |
| 包装说明 | UCSP-9 | - | MO-178, SOT-23, 8 PIN | VFBGA, BGA12,3X4,20 | - | TSSOP, TSSOP14,.25 | TSSOP, TSSOP6,.08 |
| 针数 | 9 | - | 8 | 12 | - | 14 | 6 |
| Reach Compliance Code | not_compliant | - | not_compliant | compliant | compliant | compliant | compliant |
| 接口集成电路类型 | INTERFACE CIRCUIT | - | INTERFACE CIRCUIT | INTERFACE CIRCUIT | - | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
| JESD-30 代码 | S-PBGA-B9 | - | R-PDSO-G8 | R-PBGA-B12 | R-PBGA-B6 | R-PDSO-G14 | R-PDSO-G6 |
| JESD-609代码 | e0 | - | e0 | e3 | - | e3 | e4 |
| 长度 | 1.52 mm | - | 2.9 mm | 2.02 mm | - | 5 mm | 2 mm |
| 湿度敏感等级 | 1 | - | 1 | 1 | - | 1 | 1 |
| 功能数量 | 2 | - | 2 | 4 | - | 4 | 1 |
| 端子数量 | 9 | - | 8 | 12 | 6 | 14 | 6 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VFBGA | - | LSSOP | VFBGA | FBGA | TSSOP | TSSOP |
| 封装等效代码 | BGA9,3X3,20 | - | TSSOP8,.1 | BGA12,3X4,20 | BGA6,2X3,20 | TSSOP14,.25 | TSSOP6,.08 |
| 封装形状 | SQUARE | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | - | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 240 | - | 240 | 260 | - | 260 | 260 |
| 电源 | 1.8/3.3 V | - | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V | 1.8/3.3 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.67 mm | - | 1.45 mm | 0.67 mm | - | 1.1 mm | 1.1 mm |
| 最大供电电压 | 3.6 V | - | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V |
| 最小供电电压 | 1.65 V | - | 1.65 V | 1.65 V | - | 1.65 V | 1.65 V |
| 标称供电电压 | 2.5 V | - | 2.5 V | 2.5 V | - | 2.5 V | 2.5 V |
| 电源电压1-最大 | 3.2 V | - | 3.2 V | 3.2 V | - | 3.2 V | 3.2 V |
| 电源电压1-分钟 | 1.2 V | - | 1.2 V | 1.2 V | - | 1.2 V | 1.2 V |
| 电源电压1-Nom | 1.8 V | - | 1.8 V | 1.8 V | - | 1.8 V | 1.8 V |
| 表面贴装 | YES | - | YES | YES | YES | YES | YES |
| 技术 | BICMOS | - | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) | - | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | BALL | - | GULL WING | BALL | BALL | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | - | 0.65 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.65 mm |
| 端子位置 | BOTTOM | - | DUAL | BOTTOM | BOTTOM | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | - | 20 | 30 | - | 30 | 30 |
| 宽度 | 1.52 mm | - | 1.625 mm | 1.54 mm | - | 4.4 mm | 1.25 mm |
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