Buffers & Line Drivers SN74LVC162244A
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | TFBGA, BGA54,6X9,32 |
| 针数 | 54 |
| Reach Compliance Code | _compli |
| Factory Lead Time | 1 week |
| SN74LVC162244AGRDR | SN74LVC162244AZRDR | 74LVC162244ADLRG4 | 74LVC162244ADGVRG4 | 74LVC162244ADGVRE4 | |
|---|---|---|---|---|---|
| 描述 | Buffers & Line Drivers SN74LVC162244A | Buffers & Line Drivers 16B Bfr/Drvr | Buffers & Line Drivers 16-Bit Buffer/Driver With 3-State Outputs | Buffers & Line Drivers 16-Bit Buffer/Driver | Buffers & Line Drivers 8-Bit FET Bus Switch |
| 是否无铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA | BGA | SSOP | SOIC | SOIC |
| 包装说明 | TFBGA, BGA54,6X9,32 | TFBGA, BGA54,6X9,32 | SSOP, SSOP48,.4 | TSSOP, TSSOP48,.25,16 | TSSOP, TSSOP48,.25,16 |
| 针数 | 54 | 54 | 48 | 48 | 48 |
| Reach Compliance Code | _compli | unknow | unknow | unknow | unknow |
| 控制类型 | - | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| 系列 | - | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | - | R-PBGA-B54 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 |
| JESD-609代码 | - | e1 | e4 | e4 | e4 |
| 长度 | - | 8 mm | 15.875 mm | 9.7 mm | 9.7 mm |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | - | 0.012 A | 0.012 A | 0.012 A | 0.012 A |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 |
| 位数 | - | 4 | 4 | 4 | 4 |
| 功能数量 | - | 4 | 4 | 4 | 4 |
| 端口数量 | - | 2 | 2 | 2 | 2 |
| 端子数量 | - | 54 | 48 | 48 | 48 |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | - | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | - | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | TFBGA | SSOP | TSSOP | TSSOP |
| 封装等效代码 | - | BGA54,6X9,32 | SSOP48,.4 | TSSOP48,.25,16 | TSSOP48,.25,16 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | - | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 |
| 电源 | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Su | - | 4.4 ns | 4.4 ns | 4.4 ns | 4.4 ns |
| 传播延迟（tpd） | - | 6 ns | 6 ns | 6 ns | 6 ns |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.2 mm | 2.79 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | - | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | - | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | BALL | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | 0.8 mm | 0.635 mm | 0.4 mm | 0.4 mm |
| 端子位置 | - | BOTTOM | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 5.5 mm | 7.49 mm | 4.4 mm | 4.4 mm |
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