2-Axis Magnetic Sensor Circuit
HMC6042
The Honeywell HMC6042 is a surface mount multi-chip module designed
for low field magnetic sensing such as low cost compassing and
magnetometry. The HMC6042 includes our state of the art 1042 series
magneto-resistive sensors plus a precision mixed signal ASIC containing
three sensor amplifiers and a compatible set/reset strap driver circuit for 2.4
to 3.6 volt operation. The ASIC plus sensors are surface mount packaged in
a 3.6 by 5.0 by 1.0mm LCC that can be used stand alone for very low cost
2-axis compasses, or with the HMC1041Z to complete the magnetic sensor
portion of a 3-axis, tilt compensated compass. Applications for the
HMC6042 include Consumer Electronic Compassing and Magnetometry.
Advanced Information
The HMC6042 utilizes Honeywell’s Anisotropic Magnetoresistive (AMR) technology that provides advantages over other
magnetic sensor technologies. The sensors feature precision in-axis sensitivity and linearity, solid-state construction with
very low cross-axis sensitivity designed to measure both direction and magnitude of Earth’s magnetic fields, from tens of
micro-gauss to 6 gauss. Honeywell’s Magnetic Sensors are among the most sensitive and reliable low-field sensors in the
industry.
Honeywell continues to maintain product excellence and performance by introducing innovative solid-state magnetic
sensor solutions. These are highly reliable, top performance products that are delivered when promised. Honeywell’s
magnetic sensor solutions provide real solutions you can count on.
FEATURES
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2-Axis Magnetoresistive Sensor and
ASIC in a Single Package
Low Cost
5 x 3.6 x 1.0mm LCC Surface Mount
Package
Low Voltage Operations (2.4 to 3.6V)
Built-In Set/Reset Drive Circuit
Signal Processing Flexibility
Lead Free Package Construction
Wide Magnetic Field Range (+/-6 Oe)
Available in Tape & Reel Packaging
BENEFITS
for Highly Integrated Products. Just Add a
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Small SizeInterface with ADC, Plus Two External SMTMicro-
Controller
Capacitors
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Designed for High Volume, Cost Sensitive OEM Designs
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Easy to Assemble & Compatible with High Speed SMT Assembly
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Compatible for Battery Powered Applications
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Single Logic Input for Degaussing, Thermal Drift Compensation
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Feedback Pins for Gain and Bandwidth Shaping
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Complies with Current Environmental Standards
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Sensors Can Be Used in Strong Magnetic Field Environments
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High Volume OEM Assembly
HMC6042
SPECIFICATIONS
Characteristics
System
Sensitivity
Zero Field Offset
Magnetic Field Range
Power Supply
Supply Voltage
Current
VDD1, VDD2 Referenced to GND
Bridge Current = 0.9mA/volt per axis
Continuous (VDD1)
Peak (0.5msec) (VDD1 + VDD2)
Full scale (FS) – total applied field
After Set/Reset Pulses
1 kHz bandwidth, VDD1 = 3.0 volts
Offset = (OUT+) – (OUT-)
Field = 0 gauss after Set pulse
Cross field = 0.5 gauss,
Happlied = ±3 gauss
Sensitivity starts to degrade.
Use S/R pulse to restore sensitivity.
No perming effect on zero reading
T
A
= -40 to 125°C, Vbridge=5V
T
A
= -40 to 125°C, No Set/Reset
T
A
= -40 to 125°C, With Set/Reset
Bridge Ohmic Tempco
Linearity Error
VDD1 = 3.0V, T
A
= -40 to 125°C
Best fit straight line
± 1 gauss
± 3 gauss
± 6 gauss
3 sweeps across ±3 gauss
3 sweeps across ±3 gauss
No Feedback Connections
0.1
A
v
= 250
A
v
= 250
VDD1 = 3.0V
Source
Sink
Recommended Capacitor Size
Includes Internal 1042 S/R Strap
1.0
45
0.15
3.6
3.6
2.2
1.5
4.4
10
6
2.85
2100
-3500
-3100
±500
±10
2500
0.17
0.42
0.80
0.15
0.11
225
10
2900
ppm/°C
%FS
-1.25
2.4
5.2
3.0
3.6
7.0
25
+6
1.0
0.12
±0.5
±0.2%
20
10000
-2000
+1.25
1.25
Volts
mA
Open Loop Gain, After Set/Reset Pulses
VDD1 = 3.0 volts
Full Scale
175
0.75
±1
1.5
275
2.25
±2
mV/V/gauss
volts
gauss
Conditions*
Min
Typ
Max
Units
Magnetic sensors
Field Range
Sensitivity
Resolution
Bridge Offset
Cross-Axis Sensitivity
Disturbing Field
Max. Exposed Field
Sensitivity Tempco
Bridge Offset Tempco
-6
0.8
gauss
mV/V/gauss
milli-gauss (RMS)
mV/V
%FS/gauss
gauss
gauss
ppm/°C
ppm/°C
Hysteresis Error
Repeatability Error
ASIC
Amplifier Gains
Bandwidth
Slew Rate
Gain Bainwidth
Phase Margin
Output Voltage Range
Output Current
Set/Reset Strap Driver
Reservior Cap C1
Load Road Range
2
%FS
%FS
V/V
kHz
V/µsec
MHz
deg
V
mA
µF
ohms
www.honeywell.com
HMC6042
Characteristics
Internal Strap Resistance
Other
Operating Temperature
Storage Temperature
Weight
* Tested at 25°C except stated otherwise.
Ambient
Ambient, unbiased
-40
-55
TBD
125
125
°C
°C
milli-grams
Conditions*
Min
3
Typ
Max
6
Units
ohms
PIN CONFIGURATIONS
(Arrow indicates direction of applied field that generates a positive output voltage after a SET pulse.)
S/R C
S/R IN
S/R-
5
IN Z+
IN Z+
6
IN Z-
7
C1
8
HMC6042
9
10
S/R+
OFF-
NC
4
Y
3
2
AMR DIE
X
11
12
ASIC
DIE
13
FB Z
OUT Z
FB Y
VDD1
1
14
OUT Y
20
OFF+
OFF+
19
NC
NC
18
VDD2
VDD2
17
GND
16
OUT X
15
FB X
BOTTOM VIEW
Pin Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Function
VDD1
NC
Offset Strap-
Set/Reset+
Set/Reset-
Z sensor In+
Z sensor In-
C1, reservoir cap
Set/Reset drive out
Set/Reset logic input
Z amp feedback
Z amp output
Y amp feedback
Y amp output
X amp feedback
X amp output
GND, ground return
VDD2
NC
Offset Strap+
www.honeywell.com
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HMC6042
PACKAGE OUTLINES
PACKAGE DRAWING HMC6042 (20-PIN LPCC, dimensions in millimeters)
Dimensions
D
D1
E
E1
A
Minimum
0.89
e = 0.5 Basic
Nominal
5.00 BSC
2.50 BSC
3.60 BSC
1.50 BSC
1.06
Maximum
1.23
MOUNTING CONSIDERATIONS
The following is the recommend printed circuit board (PCB) footprint for the HMC6042.
PCB Pad Definition
The HMC6042 is a fine pitch LCC package with a 0.50mm pin pitch (spacing), with the pin pads defined as 0.50mm by
0.20mm in size. PCB pads are recommended to be oversized by 0.025mm from each pad for a short dimension oversize
of 0.05mm. The interior PCB pad is recommended to be 0.05mm oversized per pin with an exterior oversize of 0.20mm
for proper package centering and to permit test probing. Lead finish is SnAgCu.
Stencil Design and Solder Paste
A 4 mil stencil and 100% paste coverage is recommended for the electrical contact pads. The HMC6042 has been tested
successfully with no-clean solder paste.
Pick and Place
Placement is machine dependant and no restrictions are recommended, and have been tested with mechanical centering.
Placement force should be equivalent 1206 SMT resistors and enough force should be used to squeeze the paste out
from the package/contact pad overlap and to keep the package pin contacts vertical.
Reflow and Rework
No special profile is required for the HMC6042 and compatible with lead eutectic and lead-free solder paste reflow
profiles. Honeywell recommends the adherence to solder paste manufacturer’s guidelines. The HMC6042 may be
reworked with soldering irons, but extreme care must be taken not to overheat the copper pads from the part’s fiberglass
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www.honeywell.com
HMC6042
substrate. Irons with a tip temperature no greater than 315°C should be used. Excessive rework risks the copper pads
pulling away into the molten solder.
SCHEMATIC DIAGRAM
HMC6042
VDD1
IN X+
AMR
GND
HMC6042
VDD1
GND
IN X-
G
OUT X
FB X
GND
AN0
AN1
AN2
CLK
TXD
RXD
DO0
SERIAL
I/O
IN Y+
OUT Y
AMR
IN Y-
Host
µC
G
FB Y
Vdd
Vss
VDD
GND
GND
IN Z+
IN Z-
OUT Z
G
FB Z
C1
+ 2.2µF
SET/RESET
S/R IN
VDD2
S/R+
S/R-
C2
S/R C
0.22µF
BASIC DEVICE OPERATION
The Honeywell HMC6042 magnetoresistive sensor circuit is a pair of sensor and analog support circuits to measure
magnetic fields. With power supply applied, the sensor converts any incident magnetic field in the sensitive axis direction
to a differential voltage output. In addition to the bridge circuit, the sensors have two on-chip magnetically coupled straps;
the offset strap and the set/reset strap. These straps are Honeywell patented features for incident field adjustment and
magnetic domain alignment; and eliminate the need for external coils positioned around the sensors.
The magnetoresistive sensors are made of a nickel-iron (Permalloy) thin-film deposited on a silicon wafer and patterned
as a resistive strip element. In the presence of a magnetic field, a change in the bridge resistive elements causes a
corresponding change in voltage across the bridge outputs.
www.honeywell.com
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