HMC-XDH158
v01.1207
GaAs MMIC X4 ACTIVE FREQUENCY
MULTIPLIER, 54 - 64 GHz OUTPUT
Features
Output Power: -6 dBm
Wide Input Power Range: 0 to +5 dBm
High Fo Isolation: 30 dBc
Low Conversion Loss: 8 dB
Die Size: 1.8 x 0.8 x 0.1 mm
Typical Applications
2
ACTIVE FREQ. MULTIPLIERS - CHIP
This HMC-XDH158 is ideal for:
• Short-Haul / High Capacity Radios
• Point-to-Point Radio
• Test & Measurement Equipment
• SATCOM
• Military and Secure Communications
Functional Diagram
General Description
The HMC-XDH158 is a monolithic X4 Active Fre-
quency Multiplier which utilizes GaAs High Electron
Mobility Transistor (HEMT) technology and exhib-
its low conversion loss and high Fo isolation. This
wideband multiplier is ideal for use in LO multiplier
chains for high capacity and SATCOM radios yield-
ing reduced parts count vs. traditional approaches. All
bond pads and the die backside are Ti/Au metallized
and the HEMT devices are fully passivated for reliable
operation. The HMC-XDH158 X4 Active Frequency
Multiplier MMIC is compatible with conventional die
attach methods, as well as thermocompression and
thermosonic wire bonding, making it ideal for MCM
and hybrid microcircuit applications. All data shown
herein is measured with the chip in a 50 Ohm environ-
ment and contacted with RF probes.
Electrical Specifi cations*
T
A
= 25 °C, Vdd1 = 1.5V, Vdd2 = 4V, Vgg1 = -0.2V, Vgg2 = -0.3V, +2 dBm Drive Level
Parameter
Frequency Range Input
Frequency Range Output
Output Power
Conversion Loss
Fo Isolation with respect to output
2Fo Isolation with respect to output
Supply Current
Idd1
Idd2
Min.
Typ.
14 - 16
56 - 64
-6
8
36
54
14
115
14
Max.
Units
GHz
GHz
dBm
dB
dB
dB
mA
mA
*Unless otherwise indicated, all measurements are from probed die
2 - 74
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC-XDH158
v01.1207
GaAs MMIC X4 ACTIVE FREQUENCY
MULTIPLIER, 54 - 64 GHz OUTPUT
x4 Conversion Loss vs. Frequency
-5
-6
CONVERSION LOSS (dB)
OUTPUT POWER (dBm)
-7
-8
-9
-10
-11
-12
-13
-14
-15
14
14.5
15
FREQUENCY (GHz)
15.5
16
-60
14
14.5
15
FREQUENCY (GHz)
15.5
16
-10
-20
-30
-40
-50
4F
3F
F
2F
Output Power vs. Frequency
0
2
ACTIVE FREQ. MULTIPLIERS - CHIP
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
2 - 75
HMC-XDH158
v01.1207
GaAs MMIC X4 ACTIVE FREQUENCY
MULTIPLIER, 54 - 64 GHz OUTPUT
Absolute Maximum Ratings
2
ACTIVE FREQ. MULTIPLIERS - CHIP
RF Input Level
Supply Voltage (Vdd1, Vdd2)
Gate Voltage (Vgg1, Vgg2)
Channel Temperature
Storage Temperature
Operating Temperature
+7 dBm
+5 Vdc
-1 to 0.3 Vdc
180 °C
-65 to +150 °C
-55 to +85 °C
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Outline Drawing
Die Packaging Information
Standard
WP - 8
[2]
[1]
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. TYPICAL BOND PAD IS .004” SQUARE.
3. BACKSIDE METALLIZATION: GOLD.
4. BACKSIDE METAL IS GROUND.
5. BOND PAD METALLIZATION: GOLD.
6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
7. OVERALL DIE SIZE ±.002”
Alternate
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
2 - 76
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC-XDH158
v01.1207
GaAs MMIC X4 ACTIVE FREQUENCY
MULTIPLIER, 54 - 64 GHz OUTPUT
Pad Descriptions
Pad Number
1
Function
RFIN
Description
This pad is AC coupled and matched to 50 Ohms.
Interface Schematic
2
ACTIVE FREQ. MULTIPLIERS - CHIP
4, 6
Vdd1, Vdd2
Power Supply for amplifier. See Assembly Drawing for
required external components.
3
RFOUT
This pad is AC coupled and matched to 50 Ohms.
Gate control for amplifier. Please follow “MMIC Amplifier
Biasing Procedure” Application Note. See Assembly Draw-
ing for required external components.
Die bottom must be connected to RF/DC ground.
2,5
Vgg1, Vgg2
Die Bottom
GND
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
2 - 77
HMC-XDH158
v01.1207
GaAs MMIC X4 ACTIVE FREQUENCY
MULTIPLIER, 54 - 64 GHz OUTPUT
Assembly Diagram
2
ACTIVE FREQ. MULTIPLIERS - CHIP
2 - 78
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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