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70264-101LF

产品描述High Speed / Modular Connectors 4 Row Signal Header, Straight, Solder-to-Board, Narrow Body
产品类别连接器   
文件大小162KB,共9页
制造商FCI / Amphenol
标准
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70264-101LF概述

High Speed / Modular Connectors 4 Row Signal Header, Straight, Solder-to-Board, Narrow Body

70264-101LF规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
FCI / Amphenol
产品种类
Product Category
High Speed / Modular Connectors
RoHSDetails
产品
Product
Headers
位置数量
Number of Positions
24 Position
排数
Number of Rows
4 Row
节距
Pitch
2 mm
端接类型
Termination Style
Through Hole
系列
Packaging
Tube
电流额定值
Current Rating
1 A
外壳材料
Housing Material
Liquid Crystal Polymer (LCP)
安装角
Mounting Angle
Straight
触点材料
Contact Material
Phosphor Bronze
绝缘电阻
Insulation Resistance
5 GOhms
最大工作温度
Maximum Operating Temperature
+ 125 C
最小工作温度
Minimum Operating Temperature
- 55 C
工厂包装数量
Factory Pack Quantity
48

文档预览

下载PDF文档
NUMBER
TYPE
GS-12-446
TITLE
PRODUCT SPECIFICATIONS
PAGE
REVISION
Converged Metral® Header –HM1 versions
Straight and Right Angle Solder To BOARD and PIP
1 of 9
AUTHORIZED BY
DATE
B
22/05/2007
M LENOIR
CLASSIFICATION
UNRESTRICTED
1.0
OBJECTIVE
This specification defines the performance, test and reliability requirements of the Headers Straight and
Right Angle Solder to Board product HM1 versions.
2.0
SCOPE
This specification is applicable to the termination characteristics of the Metral HEADER, which provides a
separable, interconnect for printed circuit boards.
3.0
GENERAL
This document is composed of the following sections:
Paragraph
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0
3.1
Title
OBJECTIVE
SCOPE
GENERAL
APPLICABLE DOCUMENTS
PERFORMANCE LEVELS
REQUIREMENTS
ELECTRICAL CHARACTERISTICS
MECHANICAL CHARACTERISTICS
ENVIRONMENTAL CONDITIONS
PACKAGING
Lead Free / RoHs informations
-All product where the part number ends in ‘LF’ meet the European Union directives and
other country regulations as described in GS-22-008.
-The part numbers that do not end in ‘LF’ meet all regulations except for Pb in SnPb plating.
Solder to Board Version
-The housing will withstand exposure to 260°C peak temperature for 5 seconds in a wave solder
application with a 1.60mm minimum thick board circuit. See application notes/procedures if they
are applicable
-Termination plating specification: 1.27µ mini Nickel under layer with 2.5µ to 7.5µ Pure TIN (matte)
-Packaging specification: see GS-14-920
Pin in Paste Version
-The housing will withstand exposure to 260°C peak temperature for.30 seconds in convection,
Infra red or Vapor reflow oven. See application notes/procedures if they are applicable
-Termination plating specification: 1.27µ mini Nickel under layer with 2.5µ to 7.5µ Pure TIN (matte)
-Packaging specification: see GS-14-920
Copyright FCI
Form E-3334
Rev F
GS-01-001
PDM: Rev:B
STATUS:
Released
Printed: Nov 28, 2010
.

70264-101LF相似产品对比

70264-101LF HM1L44DAP000H6PLF
描述 High Speed / Modular Connectors 4 Row Signal Header, Straight, Solder-to-Board, Narrow Body High Speed / Modular Connectors Right Angle Signal Header, 192 Position Solder-to-Board
Product Attribute Attribute Value Attribute Value
制造商
Manufacturer
FCI / Amphenol FCI / Amphenol
产品种类
Product Category
High Speed / Modular Connectors High Speed / Modular Connectors
RoHS Details Details
产品
Product
Headers Headers
位置数量
Number of Positions
24 Position 192 Position
排数
Number of Rows
4 Row 4 Row
节距
Pitch
2 mm 2 mm
端接类型
Termination Style
Through Hole Through Hole
系列
Packaging
Tube Tray
电流额定值
Current Rating
1 A 1 A
外壳材料
Housing Material
Liquid Crystal Polymer (LCP) Liquid Crystal Polymer (LCP)
安装角
Mounting Angle
Straight Right
触点材料
Contact Material
Phosphor Bronze Phosphor Bronze
绝缘电阻
Insulation Resistance
5 GOhms 5 GOhms
最大工作温度
Maximum Operating Temperature
+ 125 C + 125 C
最小工作温度
Minimum Operating Temperature
- 55 C - 55 C
工厂包装数量
Factory Pack Quantity
48 15
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