WS488
SAC305
Water Soluble Solder Paste
Features:
- Excellent Wetting
- Extended Cleaning Window
- Superior Slump Resistance
- 8 Hour + Stencil Life
- Aqueous Wash with Water
- Large Process Window
Description:
AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces,
components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print
characteristics and 8+ hours of stencil life. WS488 is compatible with all leaded and lead-free alloys, and has been
developed for use in a wide range of applications. Easily cleaned in tap water, this all purpose water soluble product
was created to meet the industry’s demand for a consistently reliable water soluble product.
Printing:
-
-
-
Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16
mm (½ to ⅝ inch) is normally sufficient to begin).
Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and
workable properties.
WS488 provides the necessary tack time and force for today’s high speed placement equipment, which will
enhance product performance and reliability.
RECOMMENDED INITIAL PRINTER SETTINGS BELOW ARE DEPENDENT ON PCB AND PAD DESIGN
PARAMETER
Squeegee Pressure
Squeegee Speed
Snap-off Distance
RECOMMENDED INITIAL SETTINGS
0.10-0.30 kg/cm (.6 - 1.7 lbs/In.) of blade
12-150 mm/sec (.5-6”/sec)
On Contact 0.00 mm (0.00”)
PARAMETER
PCB Separation Distance
PCB Separation Speed
RECOMMENDED INITIAL SETTINGS
0.75-2.0 mm (.030-.080”)
Slow
Reflow Profile:
Two unique profile families are depicted below; both can be used in ramp-spike or ramp-soak-spike applications, and
they each have similar reflow temperatures. The two profiles differ in where they reach their respective peak
temperatures, as well as the time above liquidus (TAL). The shorter profile of the two would apply to smaller
assemblies, where as the longer profile would apply to larger assemblies, such as backplanes or high-density boards.
The shaded area defines the process window. Oven efficiency, board size/mass, component type and density all
influence the final profile for a given assembly. These profiles are starting points, and processing boards with thermal-
couples attached is recommended to optimize the process.
RATE OF
RISE 2°C /
SEC MAX
RAMP
TO
150°C
(302°F)
≤ 75 Sec
≤ 90 Sec
PROGRESS
THROUGH
150°C-175°C
(302°F-347°F)
30-60 Sec
60-90 Sec
TO PEAK
TEMP 230°C-
245°C (445°F-
474°F)
45-75 Sec
45-75 Sec
TIME ABOVE
217°C (425°F)
Short Profiles
Long Profiles
30-60 Sec
60-90 Sec
COOLDOWN PROFILE
≤
4 °C / SEC LENGTH
AMBIENT
TO COOL
DOWN
45± 15 Sec
2.75-3.5 Min
45± 15 Sec
4.5-5.0 Min
T
HE RECOMMENDED REFLOW PROFILE FOR
WS488
IS PROVIDED AS A GUIDELINE
. O
PTIMAL PROFILE MAY DIFFER DUE TO OVEN TYPE
,
ASSEMBLY
LAYOUT
,
OR OTHER PROCESS VARIABLES
. C
ONTACT
AIM T
ECHNICAL
S
UPPORT IF YOU REQUIRE ADDITIONAL PROFILING ASSISTANCE
.
T
HE
R
EFLOW
P
ROFILE FOR THE
SAC305 P
ASTES USING A
V
APOR
P
HASE
R
EFLOW
O
VEN
: P
EAK TEMPERATURE RANGE I S
230°C – 245°C.
Compatible Products:
-
Electropure Solder Bar
-
WS Tacky Flux
-
WS715; WS375 Spray Flux
-
WS482 Cored Wire
-
Epoxy 4089 – Chip Bonding Epoxy
-
200AX – Stencil Cleaner
Cleaning:
WS488 can be cleaned easily with normal tap water. Deionized water is recommended for the final rinse. A
temperature of 38°C (100°F) - 66°C (150°F) is sufficient for removing residues. An in-line or other
pressurized spray cleaning system is suggested, but is not required.
Handling and Storage:
- WS488 has a refrigerated shelf life of 1 year at 4°C (40°F) - 12°C (55°F).
- Allow the solder paste to warm naturally to ambient temperature (8 hrs.) prior to breaking the seal for use.
- Mix the product lightly and thoroughly for 1 to 2 minutes to ensure even distribution of any separated
material.
- Do not store new and used paste in the same container, and reseal any opened containers while not in use.
- Replace the internal plug and cap of the 500 gram jars to ensure the best possible seal.
Safety:
- Use with adequate ventilation and proper personal protective equipment.
- Refer to the accompanying Material Safety Data Sheet
for any specific emergency information.
- Do not dispose of any lead-containing materials in non-approved containers.
Physical Properties:
ITEM
Appearance
Alloy
Melting Point
Particle Size
General Metal Loading
Viscosity
Packaging
SPECIFICATION
Gray, Smooth, Creamy
SAC305
217°C
T3, T4, T5
88.5% (T3)
Print/Dispense Versions Available
Available in all industry standard packaging.
Test Data Summary:
CLASSIFICATION
Product
Name
WS488
POWDER TESTING
No.
Item
1
IPC Classification to J-STD-004
ORM1
Copper Mirror to J-STD-004
< 50% Breakthrough – M
Results
Type 3 – 45-25 micron
Type 4 – 38-20 micron
Spherical
Results
55.17 mg KOH/g Flux
No Fluoride
< 50% Breakthrough – M
Halides Present
Control Coupons > 1E9 at 96 & 168 h. -
Pass
Sample Coupons > 1E8 at 96 & 168 h. -
Pass
> No dendrite growth or corrosion, after a
visual inspection - pass
See list of recommended products above
Results
Printing: 900 ± 10% kcps
Dispensing: 400 ± 20% kcps
Results
30.5 gf
82.8 gf
Pass
Pass
4°C (39°F) = 1 year
Pass
Test Method
J-STD-004 IPC TM 650 2.2.14
Microscope
Test Method
J-STD-004 IPC TM 650 2.3.13
J-STD-004 IPC TM 650 2.3.35.1
J-STD-004 IPC TM 650 2.3.35.2
J-STD-004 IPC TM 650 2.3.32
J-STD-004 IPC TM 650 2.3.33
Silver Chromate to J-STD-004
Halides Present
Powder Size
2
Powder Shape
FLUX MEDIUM TESTING
No.
Item
1
Acid Value
2
3
4
Fluorides Spot Test
Corrosivity Test/ Copper Mirror
Halide-Free/Silver Chromate Paper Test
Surface Insulation Resistance
(Solder paste was reflowed on test coupons,
left at ambient temperatures for 2 weeks, then
5
cleaned with 55-58°C tap water for 120 sec,
and allowed to air dried for 30 min before
testing)
6
Compatibility Test
VISCOSITY TESTING
No.
Item
1
T-Bar Spindle Test Method
J-STD-004 IPC TM 650 2.6.3.3
GR-78-CORE
Test Method
J-STD-005 IPC TM 650 2.4.34
Test Method
J-STD-005 IPC TM 650 2.4.44
JIS Z 3284 Annez 9
J-STD-005 IPC TM 650 2.4.43
J-STD-005 IPC TM 650 2.4.45
AIM TM 125-11
J-STD-005 IPC TM 650 2.4.35
SOLDER PASTE TESTING
No.
Item
1
Tack Test
2
Tack Test
3
Solder Ball Test
4
Wetting Test
5
Paste Shelf Life
6
Solder Paste Slump Test
Manufacturing and Distribution Worldwide
Canada +1-514-494-2000 · USA +1-401-463-5605 · Mexico +52-656-630-0032 · Europe +44-1737-222-258
Asia-Pacific +86-755-2993-6487 · India +91-80-41554753 ·
info@aimsolder.com · www.aimsolder.com
AIM IS ISO9001:2008 CERTIFIED
The information contained herein is based on data considered accurate and is offered at no charge. Product information is based upon the
assumption of proper handling and operating conditions. All information pertaining to solder paste is produced with 45-micron powder. Liability
is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. Please refer to
http://www.aimsolder.com/terms.cfm
to review AIM's terms and conditions.
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Document Rev # 7
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