General Purpose Prototyping Boards
VECTORBORD
®
Vectorbord
®
Prototyping Boards
with punched holes are
convenient, economical
tools for assembling circuit components-and
cost efficient
alternatives to custom designs. Available in several hole patterns for a
full range of design needs,
circuit speeds, component types and density.
May be copper clad on one side. A
complete line of accessory products
also available, including eyelets, push-in (solderable or solderless), Wire-
Wrap and screw machine terminals for all Vectorbord
®
Prototyping Boards.
Pattern M
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.05"
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0.2"
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0.1"
.05"
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0.1"
Enlarged to show detail
Pattern H
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.023"
.027"
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.062"
.067"
.10"
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.10"
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0.1"
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.062"
.067"
0.1"
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Pattern
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
P
G
G
G
G
H
H
H
H
M
M
M
Part No.
59P44-032
64P44WE
64P44XXXP
64P44
84P44WE
169P44C1
169P44C2
169P44
169P44XXXP
169P44WEC1
169P44WE
169P59-032
169P59C1
169P59XXXP
169P79WE
169P79
169P84
169P84C1
169P84WE
169P84WEC1
349P84
169P99
42G22WEC1
42G24WE
85G24WE
85G42WE
85H48WE
170H48WE
85H85WE
170H85WE
126M76-032
336M76-032
336M76-032C1
Width
4.50"
4.50"
4.50"
4.50"
4.50"
4.50"
4.50"
4.50"
4.50"
4.50"
4.50"
6.00"
6.00"
6.00"
8.00"
8.00"
8.50"
8.50"
8.50"
8.50"
8.50"
10.00"
4.50"
4.80"
4.80"
8.50"
4.80"
4.80"
8.50"
8.50"
4.00"
4.00"
4.00"
Length
6.00"
6.50"
6.50"
6.50"
8.50"
17.00"
17.00"
17.00"
17.00"
17.00"
17.00"
17.00"
17.00"
17.00"
17.00"
17.00"
17.00"
17.00"
17.00"
17.00"
35.00"
17.00"
8.50"
8.50"
17.00"
17.00"
8.50"
17.00"
8.50"
17.00"
6.50"
17.00"
17.00"
Thick
0.031"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.031"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.037"
0.037"
0.037"
Vectorbord
®
is a registered trademark of
Vector Electronic Company
11115 Vanowen St., North Hollywood, CA 91605 Phone(818)985-8208 Fax(818)985-7708
Toll-Free (800) 423-5659
Web site: http://www.vectorelect.com
ELECTRONIC COMPANY
Ð
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.040"
.044"
Hole
0.042"
0.042"
0.042"
0.042"
0.042"
0.042"
0.042"
0.042"
0.042
0.042"
0.042"
0.042"
0.042"
0.042"
0.042"
0.042"
0.042"
0.042"
0.042"
0.042"
0.042"
0.042"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.062"
0.025"
0.025"
0.025"
Material/Description
FR4 Epoxy Glass
FR4 Epoxy Glass
FR2 Phenolic
CEM-1 Epoxy Glass Composite
FR4 Epoxy Glass
CEM-1, copper, 1 side
CEM-1, copper, 2 sides
CEM-1
FR2 Phenolic
FR4 Epoxy Glass, copper, 1 side
FR4 Epoxy Glass
FR4 Epoxy Glass
CEM-1, copper, 1 side.
FR2 Phenolic
FR4 Epoxy Glass
CEM-1
CEM-1
CEM-1, copper, 1 side
FR4 Epoxy Glass
FR4, copper 1 side
CEM-1
CEM-1
CEM-1, copper 1 side
CEM-1
CEM-1
FR4 Epoxy Glass
FR4 Epoxy Glass
FR4 Epoxy Glass
FR4 Epoxy Glass
FR4 Epoxy Glass
FR4 Epoxy Glass
FR4 Epoxy Glass
FR4 Epoxy Glass, copper 1 side
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Pattern G
Pattern P
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Products
Board Patterns
Prototyping Boards
Voltage/Ground Plane
Pattern
• Overall voltage and ground planes
on opposite board sides
• Isolated copper plated thru holes with
insulating ring
• Can be committed to either voltage
or ground plane with solder washers
(T124)
Good for Vcc & Gnd distribution &
noise immunity
Zig-Zag Buses
• Pattern on one side alternates holes
with opposite side bus
(See illustration)
• 3-hole pads provide holes for DIP's
• 0.3" wide DIP's span buses
and are soldered + pads
• Accepts wire-wrap or solder
terminals in Zig-Zag bus
Interleaved Bus Pattern
• Two independent copper buses that
run the full width of board
• 0.3" DIPs span buses
• All copper buses are solder plated
• Accepts solder or wire-wrap
terminals
(see Parts & Accessories Section)
General Proto
Products
Pad-Per-Hole and Pad-Per- Hole
• Voltage and Ground bus lines trace a
and Ground Plane Patterns
path around board perimeter
• Isolated solder pads around all
holes for mounting of DIP's and
other components
• Solder plated pad and bus sur
faces
• General purpose and bus specific
applications
• Wire-wrap socket pins and
connectors available separately
• Some boards have back to back
peripheral buses
• Unrestricted pattern inside of buses
(No copper geometry)
Board Dimensions
All board dims are Height x Width
Universal & Peripheral
Bus Pattern 02
3-Hole Solder Pad Pattern
• Voltage and ground buses
interleaved between pad areas
• Sockets (DIP) and components
mount over bus lines for maximum
component capacity
• Pattern provides for convenient
soldered jumper wire connections
to component leads or sockets
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Wire-Wrap is a trademark of Cooper Group
Specifications subject to change without notice.
ELECTRONIC COMPANY
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