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SMD291AX500T5

产品描述Soldering Flux SODR PASTE W/LD (T5) 63n/37b 500g JAR NC
产品类别工具与设备   
文件大小135KB,共2页
制造商Chip Quik
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SMD291AX500T5概述

Soldering Flux SODR PASTE W/LD (T5) 63n/37b 500g JAR NC

SMD291AX500T5规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
Chip Quik
产品种类
Product Category
Soldering Flux
RoHSN
产品
Product
Flux
类型
Type
Paste, No Clean
工厂包装数量
Factory Pack Quantity
1

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SMD291AX500T5
Datasheet revision 1.1
www.chipquik.com
Solder Paste No-Clean Sn63/Pb37 in Jar 500g T5 Mesh
Product Highlights
Printing speeds up to 100mm/sec
Long stencil life
Wide process window
Clear residue
Low voiding
Excellent wetting compatibility on most board finishes
Print grade
Compatible with enclosed print heads
Passes BONO test
Specifications
Alloy:
Mesh Size:
Micron (µm) Range:
Flux Type:
Flux Classification:
Metal Load:
Melting Point:
Packaging:
Shelf Life:
Sn63/Pb37
T5
15-25
Synthetic No-Clean
REL0
89.75% Metal by Weight
183°C (361°F)
Jar 500g
Refrigerated >12 months, Unrefrigerated >6 months
*See
notes below:
*Shelf
Life Notes: Chip Quik® solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visually
inspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the product
thoroughly for 2-3 minutes before inspection and use.
Chip Quik® solder paste is manufactured using Made in USA high quality synthetic flux and precision atomized metal
powder. Chip Quik® solder paste is guaranteed for 12 months from date of manufacture, regardless of refrigeration. If you
have any issues with our solder paste, please contact Chip Quik® directly for no charge warranty replacement. Please retain
original bill of sale, and solder paste in original container as we may request its return for internal R&D testing purposes.
Printer Operation
Print Speed: 25-100mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary
Stencil Life
>8 hours @ 20-50% RH 22-28°C (72-82°F)
>4 hours @ 50-70% RH 22-28°C (72-82°F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8°C (37-46°F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25°C
(68-77°F) before use.
1
© 1994-2015 Chip Quik® Inc.
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