Tin & Solder Stripper
Cat. No. 41692
Tin & Solder Stripper is an acidic, ferric nitrate based solder stripper designed for
use in printed circuit board fabrications for removal of solder and tin deposits from
copper substrates. It can be used to ensure a clean, solder free surface for
subsequent plating and other processing operations.
It is designed to be used in immersion or spray applications. Tin & Solder Stripper
provides minimal sludge generation during operation and a low copper attach rate.
It is easily waste treated and contains no hazardous fluorides, fluoborates, or
peroxides. It operates at room temperature for ease of use and reduction of
corrosive vapors.
OPERATING CONDITIONS
Nominal
Range
27°C (80°F)
21°C - 35°C (70 - 95°C °F)
Temperature
Dwell Time*(immersion)
3 minutes
1 – 5 minutes
Dwell Time* (spray)
1 minute
20 seconds – 2 minutes
*Dwell times are based on a nominal thickness of 0.3 mil (7.6 micron) of tin or tin/lead
Agitation – Mechanical for immersion operation
Oscillation is recommended in spray applications
BATH OPERATION AND MAINTENANCE
No analysis is required. The solution is replaced when the stripping rate is reduced to an
unacceptable level.
Solution volume should be maintained with additions of Tin & Solder Stripper. The bath life can be
extended by replacing 10% to 20% of the working bath with fresh solution.
Disclaimer:
This information is believed to be accurate. It is intended for professional end users having the skills to evaluate and use
the data properly. M.G. Chemicals Ltd. Does not guarantee the accuracy of the data and assumes no liability in
connection with damages incurred while using it.
The Tin & Solder Striper can also be maintained using specific gravity to control automatic feed and
bleed additions. The specific gravity controller should be set to maintain a specific gravity between
1.250 and 1.300. Lower specific gravity provides greater speed while high specific gravity will allow
more economical operation.
Tin & Solder Striper can hold 75-100 g/L of tin metal or 125-150 g/L of tin/lead. To determine the
volume of solution used per panel, it is necessary to determine the amount of tin or tin/lead per panel.
For tin, 1mil sq.ft. is equivalent to 21 grams 91 micron sq. meter is equivalent to 8.8 grams). The
volume of solution per panel can then be calculated as shown below.
For tin:
Tin & Solder Striper solution used = mil/sq.ft./panel x 18 g/mil sq.ft. x 1L/100g
For tin/lead:
Tin & Solder Striper solution used = mil sq.ft./panel x 21 g/mil sq.ft. x 1L/150g
EQUIPMENT
All materials in contact with the solution should be constructed of quartz, glass, 316 stainless steel, titanium or plastics
©
such as polypropylene, high density polyethylene, PVC, or Teflon . Plastisol coatings are also acceptable.
WASTE TREATMENT
Adjust the pH to 8.5 with caustic soda to precipitate the metals. Dispose of all meterials in accordance wth all applicable
federal, state/province, and local requirements.
SAFETY
Proper safety equipment including face and eye protection, gloves, boots, and aprons should be used when handling this
material. In case of exposure, flush the affected area with clean water and CONTACT A PHYSICIAN. Proper ventilatioin
should be provided to avoid exposure to mists and vapors.
Consult the Material Safety Data Sheet for safety, health and environmental information.
Disclaimer:
This information is believed to be accurate. It is intended for professional end users having the skills to evaluate and use
the data properly. M.G. Chemicals Ltd. Does not guarantee the accuracy of the data and assumes no liability in
connection with damages incurred while using it.
DSP 与 ARM 处理器
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
