Sn63/Pb37 No Clean Solder Paste
4860P Technical Data Sheet
4860P
Description
The MG 4860P
No Clean Solder Paste
is a no clean solder paste designed for surface mount applications
using a syringe dispensing method. The post soldering residues of 4860P are non-conductive, non-
corrosive and highly insulated.
Benefits
Low residues
Easily dispensed
Excellent wettability
Hard non-conductive residues
Solder Composition of MG 4860P Solder Paste
Sn63 alloy is the conventional eutectic solder used in most electronic assemblies. The Sn63 alloy
conforms and exceeds the impurity requirements of J-STD-006 and all other relevant international
standards.
Typical Analysis
Sn
62.5-
63.5
Pb
Bal.
Cu
0.030
Max
Ag
0.020
Max
Sb
0.050
Max
Bi
0.050
Max
In
0.050
Max
As
0.010
Max
Fe
0.010
Max
Ni
0.005
Max
Cd
0.001
Max
Al
0.001
Max
Zn
0.001
Max
Au
0.002
Max
Particle Size
Sn63 alloy is 3(45-25µm and J-STD-005 powder distribution. Solder powder distribution is measured
utilizing laser diffraction, optical analysis and sieve analysis. Careful control of solder powder
manufacturing processes ensures the particles’ shape are 95% spherical minimum (aspect ratio < 1.5)
and that the alloy contains a typical maximum oxide level of 80 ppm.
Classification of Solder Powder by Particle Size
Powder Type
3
Fines
Majority
Coarse
Typical Mesh
<10%
20
>80%
25-45
>90%
<1%
45
0%
50
325/500
Metal Loading
Typical metal loading for dispensing application is 87.0-88.0 %.
Rev. Date: 25 August 2014 / Ver. 1.10
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Sn63/Pb37 No Clean Solder Paste
4860P Technical Data Sheet
4860P
Properties
Melting Point, °C
Hardness, Brinell
Coefficient of Thermal Expansion
Tensile Strength, psi
Density, g/cc
Electrical Resistivity , (µohm- cm)
Electrical Conductivity, 104/ohm-cm
Yield Strength, psi
Total Elongation,%
Joint Shear Strength, at 0.1mm/min 20 °C
Joint Shear Strength, at 0.1mm/min 100 °C
Creep Strength, N/mm2 at 0.1mm/min 20 °C
MG 4860P Sn63/Pb37
183 E
14HB
24.7
4442
8.42
14.5
6.9
3950
48
23
14
3.3
Property
Flux Classification
Copper Mirror
Corrosion
SIR
JSTD-004
Bellcore (Telecordia)
Electromigration
Post Reflow Flux Residue
Acid Value
Metal Loading
Viscosity
Brookfield
(1)
, kcps
Malcom
(2)
, poise
Slump Test
25 °C, 0.63 vertical/horizontal
150 °C, 0.63 vertical/horizontal
25 °C, 0.33 vertical/horizontal
150 °C, 0.33 vertical/horizontal
Solder Ball Test
Tack
Initial
Tack retention @ 24 hr
Tack retention @ 24 hr
Specification
REL0
No removal of copper film
Pass
2.44 x 10
10
ohms
4.10 x 10
10
ohms
Pass
45%
110
88%
400+/-10% kcps
850-1100
No bridges all spacings
No bridges all spacings
0.20 /0.20
0.20/0.20
Pass
85 gm
90 gm
82 gm
Test Method
JSTD-004
IPC-TM-650 2.3.32
IPC-TM-650 2.6.15
IPC-TM-650 2.6.3.3
Bellcore GR-78-CORE 13.1.3
Bellcore GR-78-CORE 13.1.4
TGA Analysis
IPC-TM-650 2.3.13
IPC-TM-650 2.2.20
IPC-TM-650 2.4.34 modified
IPC-TM-650 2.4.34.3 modified
IPC-TM-650 2.4.35
IPC-TM-650 2.4.35
IPC-TM-650 2.4.35
IPC-TM-650 2.4.35
IPC-TM-650 2.4.43
JIS Z 3284
JIS Z 3284
JIS Z 3284
Rev. Date: 25 August 2014 / Ver. 1.10
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Sn63/Pb37 No Clean Solder Paste
4860P Technical Data Sheet
4860P
Dispensing
Needle inner
in.
0.033
0.023
0.02
0.016
0.013
0.01
Diameter
µ
m
838
584
508
406
330
254
Applicable powder
(mesh cut)
-200+325
-325+500
-325+500
-325+500
-325+500
-400+635
Needle Gauge
18
20
21
22
23
25
The clearance gap between the needle and the substrate affects the shape and quality of the dot
dispensed. If the clearance is too little, the dot tends to be flattened out, and if too large, the dot tends to
have long tailing.
Pressure
The pressure applied in the syringe should be kept at a minimum, and the proper head pressure kept in
the range of 15-25 lb/in² (1.05-1.76 kg/cm²). In cases where a paste requires much higher pressure
(more than 40 lb/in² or 2.82 kg/cm²) to dispense, the paste will become inconsistent and clogging may be
expected. The external air pressure supply should be maintained constant.
Paste Application
Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the
paste enough time to come to thermal equilibrium with the environment. The flow rate of paste in a
dispensing application depends on viscosity, which can be altered by temperature change. If solder paste
is purchased in syringes pre-mixing is not necessary due to the shear action produced from the
dispensing.
Reflow
Best results have been achieved when MG 4860P is reflowed in a
forced air convection
oven with a
minimum of 8 zones (top & bottom), however reflow is possible with a 4 zone oven (top & bottom).
The following is a recommended profile for a forced air convection reflow process. The melting
temperature of the solder, the heat resistance of the components, and the characteristics of the PCB (i.e.
density, thickness, etc.) determine the actual reflow profile.
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Sn63/Pb37 No Clean Solder Paste
4860P Technical Data Sheet
4860P
Preheat Zone -
The preheat zone, is also referred to as the ramp zone, and is used to elevate the
temperature of the PCB to the desired soak temperature. In the preheat zone the temperature of the PCB
is constantly rising, at a rate that should not exceed 2.5 C/sec. The oven’s preheat zone should normally
occupy 25-33% of the total heated tunnel length.
The Soak Zone -
normally occupies 33-50% of the total heated tunnel length exposes the PCB to a
relatively steady temperature that will allow the components of different mass to be uniform in
temperature. The soak zone also allows the flux to concentrate and the volatiles to escape from the
paste.
The Reflow Zone -
or spike zone is to elevate the temperature of the PCB assembly from the activation
temperature to the recommended peak temperature. The activation temperature is always somewhat
below the melting point of the alloy, while the peak temperature is always above the melting point.
Cleaning
MG 4860P is a no clean formulation therefore the residues do not need to be removed for typical
applications. If residue removal is desired, use MG 8241-T or 8241-W Isopropyl Alcohol Wipes.
Rev. Date: 25 August 2014 / Ver. 1.10
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Sn63/Pb37 No Clean Solder Paste
4860P Technical Data Sheet
4860P
Storage and Handling
Store refrigerated between 2-10°C [35-50°F] to minimize solvent evaporation, flux separation, and
chemical activity. Storage of syringes is preferred in an upright position with tip down to prevent flux
separation and air entrapment. Use at room temperature, warm up can be achieved by removing from
refrigerator 3 hours before use, faster warm up can also be achieved by placing in a sealed container in a
water bath at near ambient temperature for 30 minutes.
Directions
Unscrew cap from dispensing end and screw on dispensing needle. Remove end cap from plunger and
insert plunger or attach to an automatic dispenser. The supplied plunger will be slightly loose to prevent
draw back when removing.
Shelf Life
6 Months - (30-50°F/2-10°C)
Reusing Solder Paste
This is not normally recommended, because it typically generates more problems than it is worth. If you
do decide to reuse solder paste, these pointers may be helpful. This paste should be tightly sealed and
refrigerated. Then, the paste may be reused at a later date, provided that the paste has not separated or
thickened significantly compared to its original properties. Storage of syringes is preferred in an upright
position with tip down to prevent flux separation and air entrapment.
Working Environment
Solder paste performs best when used in a controlled environment. Maintaining ambient temperature of
between 68-77°F (20-25 °C) at a relative humidity of 40-65% will ensure consistent performance and
maximum life of paste.
Cleaning Misprint Boards
If you should have a misprinted board, the paste may be cleaned off manually with MG 8241 Alcohol
Wipes.
Stencil Cleaning
Periodic cleaning of the stencil during production is recommended to prevent any paste from being
deposited in unwanted areas of the board. Without stencil cleaning, solder balling will increase. We
recommend a periodic dry wipe (every 5 to 10 boards) with an occasional MG 8241-T or 8241-W Alcohol
Wipe (every 15 to 25 boards). When running fine pitch boards, the cleaning may need to become more
frequent.
Rev. Date: 25 August 2014 / Ver. 1.10
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