Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
The PLA143 can be used to replace mechanical
relays, and offers the superior reliability associated
with semiconductor devices. Because it has no
moving parts, it offers faster, bounce-free switching in
a more compact surface mount or thru-hole package.
Features
•
•
•
•
•
•
•
•
•
•
•
•
Blocking Voltage: 600V
Low Input Control Current: 2mA
4000V
rms
Input/Output Isolation
Low Drive Power Requirements (TTL/CMOS
Compatible)
No Moving Parts
High Reliability
Arc-Free With No Snubbing Circuits
FCC Compatible
VDE Compatible
No EMI/RFI Generation
Small 6-Pin Package
Machine Insertable, Wave Solderable
Approvals
•
UL Recognized Component: File E76270
•
CSA Certified Component: Certificate 1175739
•
EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Applications
•
Instrumentation
•
Multiplexers
•
Data Acquisition
•
Electronic Switching
•
I/O Subsystems
•
Meters (Watt-Hour, Water, Gas)
•
Medical Equipment—Patient/Equipment Isolation
•
Security
•
Aerospace
•
Industrial Controls
Ordering Information
Part #
PLA143
PLA143S
PLA143STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1000/Reel)
Pin Configuration
AC/DC Configuration
+ Control
– Control
NC
1
2
3
6
5
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
NC
1
2
3
6
5
4
+ Load
– Load
Switching Characteristics of
Normally Open Devices
Form-A
I
F
90%
I
LOAD
10%
t
on
t
off
Pb
DS-PLA143-R08
e
3
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Absolute Maximum Ratings @ 25ºC
Parameter
Peak Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Total Package Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
PLA143
Ratings
600
5
50
1
100
800
4000
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 1.33 mW / ºC
Derate linearly 6.67 mW / ºC
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Load Current, Continuous
AC/DC Configuration
DC Configuration
Peak Load Current
On-Resistance
1
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
Conditions
Symbol
Min
Typ
Max
Units
-
-
t=10ms
I
L
=100mA
I
L
=170mA
V
L
=600V
P
I
L
I
LPK
-
-
-
-
-
-
-
-
-
-
0.2
0.9
-
-
-
-
-
-
-
-
-
-
50
-
0.35
1.2
-
3
100
170
±350
50
14
1
5
5
-
2
-
1.4
10
-
mA
rms
/ mA
DC
mA
DC
mA
P
A
R
ON
I
LEAK
t
on
t
off
C
OUT
I
F
I
F
V
F
I
R
C
I/O
I
F
=5mA, V
L
=10V
V
L
=50V, f=1MHz
I
L
=90mA
-
I
F
=5mA
V
R
=5V
-
ms
pF
mA
mA
V
A
pF
Measurement taken within 1 second of on-time.
2
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PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
35
30
Device Count (N)
Device Count (N)
25
20
15
10
5
0
1.17
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
PLA143
Typical LED Forward Voltage Drop
(N=50, I
F
=5mA)
25
20
15
10
5
0
0.64
Typical Turn-On Time
(N=50, I
F
=2mA, I
L
=100mA
DC
)
35
30
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, I
F
=2mA, I
L
=90mA
DC
)
0.68
0.72
0.76
0.80
0.84
0.88
0.22
0.24
0.26
0.28
0.30
Turn-On Time (ms)
Turn-Off Time (ms)
25
20
15
10
5
0
Typical I
F
for Switch Operation
(N=50, I
L
=100mA
DC
)
25
20
15
10
5
0
Typical I
F
for Switch Dropout
(N=50, I
L
=100mA
DC
)
35
30
Device Count (N)
25
20
15
10
5
0
Typical On-Resistance Distribution
(N=50, I
L
=100mA
DC
)
Device Count (N)
Device Count (N)
0.53
0.54
0.55
0.56
0.57
0.58
0.59
0.33
0.34
0.35
0.36
0.37
0.38
0.39
34.3
34.6
34.9
35.2
35.5
35.8
36.1
LED Current (mA)
LED Current (mA)
On-Resistance ( )
Typical Blocking Voltage Distribution
(N=50)
35
30
Device Count (N)
25
20
15
10
5
0
777
782
787
792
797
802
807
Blocking Voltage (V
P
)
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Voltage Drop (V)
1.8
Turn-On Time (ms)
1.6
1.4
1.2
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
5
Typical Turn-On Time
vs. LED Forward Current
(I
L
=100mA
DC
)
0.7
0.6
Turn-Off Time (ms)
0.5
0.4
0.3
0.2
0.1
0
10
15
20
25
30
35
40
45
50
0
5
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=100mA
DC
)
I
F
=50mA
I
F
=10mA
I
F
=5mA
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R08
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PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical Turn-On Time
vs. Temperature
(I
L
=70mA
DC
)
Typical Turn-Off Time
vs. Temperature
(I
F
=5mA, I
L
=70mA
DC
)
PLA143
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
-20
I
F
=5mA
I
F
=10mA
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40
-20
70
On-Resistance ( )
60
50
40
30
20
10
Typical On-Resistance vs. Temperature
(I
F
=2mA, I
L
=50mA
DC
)
Turn-On Time (ms)
0
20
40
60
80
100
Turn-Off Time (ms)
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
3.0
2.5
LED Current (mA)
2.0
1.5
1.0
0.5
0.0
-40
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=70mA
DC
)
3.0
2.5
LED Current (mA)
2.0
1.5
1.0
0.5
0.0
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=70mA
DC
)
150
Load Current (mA)
100
50
0
-50
-100
-150
Typical Load Current vs. Load Voltage
(I
F
=5mA)
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
-6
-4
-2
0
2
4
6
Temperature (ºC)
Temperature (ºC)
Load Voltage (V)
110
100
Load Current (mA)
90
80
70
60
50
40
30
20
-40
-20
Maximum Load Current
vs. Temperature
(I
F
=2mA)
Blocking Voltage (V
P
)
Typical Blocking Voltage
vs. Temperature
950
900
Leakage ( A)
850
800
750
700
650
600
-40
-20
0
20
40
60
80
100
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
-40
Typical Leakage vs. Temperature
Measured Across Pins 4&6
0
20
40
60
80
100
120
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Temperature (ºC)
Energy Rating Curve
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10 s 100 s 1ms 10ms 100ms
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
Load Current (A)
1s
10s 100s
4
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Manufacturing Information
Moisture Sensitivity
PLA143
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
PLA143 / PLA143S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
PLA143 / PLA143S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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