M
PL
IA
N
Features
■
0805 size
■
Magnetic shielding
■
Height as low as 0.85 mm
■
Nickel barrier
■
RoHS compliant*
Applications
■
Prevention of electromagnetic interference
T
*R
oH
S
to signals on the secondary side of
electronic equipment
CO
CV201210 Series - Ferrite Multi-Layer Chip Inductors
Electrical Specifications
Inductance
µH
0.047
0.068
0.082
0.10
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
Tol. %
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
±10
Q
Min.
15
15
15
20
20
20
20
20
20
20
25
25
25
25
25
45
45
45
45
45
45
45
45
45
45
45
45
45
45
30
30
30
30
30
Test
Freq.
(MHz)
L, Q
50*
50
50
25
25
25
25
25
25
25
25
25
25
25
25
10
10
10
10
10
10
10
10
10
4
4
4
2
2
1
1
1
1
0.4
SRF
(MHz)
Min.
320
280
255
235
220
200
185
170
150
145
135
125
115
105
100
75
65
60
55
50
45
41
38
35
32
29
26
24
22
19
18
16
14
13
DCR
(mΩ)
Max.
200
200
200
300
300
400
400
500
500
550
650
650
750
800
1000
400
500
500
600
650
750
800
900
1000
900
1000
1100
1150
1250
800
900
1100
1150
1250
I rms
(mA)
Max.
300
300
300
250
250
250
250
250
250
250
200
200
150
150
150
50
50
50
50
30
30
30
30
30
15
15
15
15
5
5
5
5
5
5
General Specifications
Inductance Test Voltage ...............60 mV
Temperature Rise
.................30 °C max. at rated current
Operating Temperature
................................-55 °C to +125 °C
Storage Temperature
................................-55 °C to +125 °C
Reflow Soldering .. 230 °C, 50 sec. max.
Resistance to Soldering Heat
.......................... +260 °C, 10 seconds
Materials
Base Material................................Ferrite
Terminal ....................................Ag/Ni/Sn
Packaging
0.85 mm Product Height
.............................. 4,000 pcs. per reel
1.25 mm Product Height
.............................. 2,000 pcs. per reel
Product Dimensions
Bourns
®
Part No.
CV201210-47NK
CV201210-68NK
CV201210-82NK
CV201210-R10K
CV201210-R12K
CV201210-R15K
CV201210-R18K
CV201210-R22K
CV201210-R27K
CV201210-R33K
CV201210-R39K
CV201210-R47K
CV201210-R56K
CV201210-R68K
CV201210-R82K
CV201210-1R0K
CV201210-1R2K
CV201210-1R5K
CV201210-1R8K
CV201210-2R2K
CV201210-2R7K
CV201210-3R3K
CV201210-3R9K
CV201210-4R7K
CV201210-5R6K
CV201210-6R8K
CV201210-8R2K
CV201210-100K
CV201210-120K
CV201210-150K
CV201210-180K
CV201210-220K
CV201210-270K
CV201210-330K
A ± 0.20
(A ± 0.008)
0.5 ± 0.3
(0.02 ± 0.008)
2.0 ± 0.2
(.079 ± .008)
1.25 ± 0.20
(0.49 ± 0.008)
DIMENSIONS:
MM
(INCHES)
Model
CV201210-47NK through
CV201210-R39K
CV201210-R47K through
CV201210-R82K
CV201210-1R0K through
CV201210-2R2K
CV201210-2R7K through
CV201210-330K
Dim. A
0.85
(0.033)
1.25
(0.050)
0.85
(0.033)
1.25
(0.050)
*Test Frequency for L (inductance) of CV201210-47NK is 10 MHz.
Packaging Specifications
178.0
(7.00)
DIA.
2.0 ± 0.8
(.079 ± .031)
12.0
(.472)
Recommended Layout
21.0 ± 0.8
(.827 ± .031)
13.0 ± 0.5
(.512 ± .020)
DIA.
60.0
(2.362)
13.5 ± 0.5
DIA.
(.531 ± .020)
3.0
(.118)
DIMENSIONS:
MM
(INCHES)
1.0
(.039)
1.0
(.039)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
9.0
(.354)
CV201210 Series - Ferrite Multi-Layer Chip Inductors
Electrical Specifications
Q Characteristics
120
100
80
100
330
DC Bias Characteristics
Inductance (µH)
10
100
4R7
Q
60
40
100
20
0
1
10
100
330
1R2
1
1R0
4R7
R10
R12
0.1
1
10
100
1000
Frequency (MHz)
DC Current (mA)
Inductance Characteristics
100
Impedance Characteristics
10000
330
330
Impedance (ohms)
150
1000
Inductance (µH)
10
4R7
100
1
1R0
4R7
10
1R0
0.1
1
10
100
1000
1
1
10
100
1000
Frequency (MHz)
Frequency (MHz)
REV. 12/14
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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