Supervisory Circuits 3.3V Econoreset w/ Open Drain Output
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Maxim(美信半导体) |
零件包装代码 | TO-92 |
包装说明 | TO-92, 3 PIN |
针数 | 3 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
Factory Lead Time | 1 week |
可调阈值 | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | O-PBCY-T3 |
JESD-609代码 | e0 |
信道数量 | 1 |
功能数量 | 1 |
端子数量 | 3 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TO-92 |
封装等效代码 | SIP3,.1,50 |
封装形状 | ROUND |
封装形式 | CYLINDRICAL |
峰值回流温度(摄氏度) | 240 |
电源 | 1.2/5.5 V |
认证状态 | Not Qualified |
最大供电电流 (Isup) | 0.035 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 1.27 mm |
端子位置 | BOTTOM |
阈值电压标称 | +2.55V |
处于峰值回流温度下的最长时间 | 20 |
DS1816-20 | DS1816-20/T&R | DS1816-10 | DS1816-10/T&R | DS1816R-10-U | DS1816R-20/T&R | DS1816R-10/T&R | |
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描述 | Supervisory Circuits 3.3V Econoreset w/ Open Drain Output | Supervisory Circuits 3.3V Econoreset w/ Open Drain Output | Supervisory Circuits 3.3V Econoreset w/ Open Drain Output | Supervisory Circuits 3.3V Econoreset w/ Open Drain Output | Supervisory Circuits | Supervisory Circuits | Supervisory Circuits |
是否无铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) |
零件包装代码 | TO-92 | TO-92 | - | TO-92 | SOT-23 | SOT-23 | SOT-23 |
包装说明 | TO-92, 3 PIN | TO-92, 3 PIN | - | TO-92, 3 PIN | SOT-23, 3 PIN | SOT-23, 3 PIN | SOT-23, 3 PIN |
针数 | 3 | 3 | - | 3 | 3 | 3 | 3 |
Reach Compliance Code | not_compliant | not_compliant | - | not_compliant | not_compliant | not_compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
可调阈值 | NO | NO | - | NO | NO | NO | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | O-PBCY-T3 | O-PBCY-T3 | - | O-PBCY-T3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 |
JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 | e0 |
信道数量 | 1 | 1 | - | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 |
端子数量 | 3 | 3 | - | 3 | 3 | 3 | 3 |
最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TO-92 | TO-92 | - | TO-92 | TSOP | TSOP | TSOP |
封装等效代码 | SIP3,.1,50 | SIP3,.1,50 | - | SIP3,.1,50 | TO-236 | TO-236 | TO-236 |
封装形状 | ROUND | ROUND | - | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CYLINDRICAL | CYLINDRICAL | - | CYLINDRICAL | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
峰值回流温度(摄氏度) | 240 | 240 | - | 240 | 240 | 240 | 240 |
电源 | 1.2/5.5 V | 1.2/5.5 V | - | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V | 1.2/5.5 V |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电流 (Isup) | 0.035 mA | 0.035 mA | - | 0.035 mA | 0.035 mA | 0.035 mA | 0.035 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | NO | NO | - | NO | YES | YES | YES |
技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | - | 1.27 mm | 0.95 mm | 0.95 mm | 0.95 mm |
端子位置 | BOTTOM | BOTTOM | - | BOTTOM | DUAL | DUAL | DUAL |
阈值电压标称 | +2.55V | +2.55V | - | +2.88V | +2.88V | +2.55V | +2.88V |
处于峰值回流温度下的最长时间 | 20 | 20 | - | 20 | 20 | 20 | 20 |
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